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- Polymer Property : Pot Life = 240 min
Polymer Property : Pot Life = 240 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Pot Life | 240 min | 240 min | |
| NextGen Adhesives P907-01 Fiber Optic Adhesive Description: NGAC P907-01 is a rapid curing, low viscosity, heat cured epoxy adhesive system that is specifically formulated for use in the fiber optic industry.Advantages and Applications: Uses inc.. |
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| Pot Life | 240 min | 240 min | |
| Resin Technology Group 408 Oxy-Bond™ Electrically Conductive Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma.. |
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| Pot Life | 240 min | 240 min | |
| Resin Technology Group 408 Oxy-Bond™ Electrically Conductive Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma.. |
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| Pot Life | 240 min @Temperature 25.0 °C |
240 min @Temperature 77.0 °F |
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| Lord Adhesives Aeroglaze® 9741 Epoxy Primer/Tie-Coat Aeroglaze® 9741 is a two-part epoxy primer designed for use on aluminum, metal, and prepared composite surfaces. Aeroglaze 9741 primer/tie-coat is applied to scuff-sanded urethane top coats and e.. |
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| Pot Life | 240 min @Temperature 25.0 °C |
240 min @Temperature 77.0 °F |
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| Lord Adhesives Aeroglaze® 9744 Epoxy Primer/Tie-Coat Aeroglaze® 9744 is a two-part epoxy primer designed for use on aluminum, metal, and prepared composite surfaces. Aeroglaze 9744 primer/tie-coat is applied to scuff-sanded urethane top coats and e.. |
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| Pot Life | 240 min @Temperature 25.0 °C |
240 min @Temperature 77.0 °F |
50% relative humidity |
| Lord Adhesives Aeroglaze® K3425 Sandable Primer/Surfacer For application on epoxy graphite or other plastic substrates or over a suitable primer on metal.Limitations - Aeroglaze® K3425 primer/surfacer contains no inhibiting pigments and is not suitable.. |
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| Pot Life | 240 min @Temperature 25.0 °C |
240 min @Temperature 77.0 °F |
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| Momentive Performance Materials RTV615 Clear General Purpose Potting/Encapsulating Compound Two-part addition cure. Two-part addition cure RTV silicones can be cured very quickly with the use of high heat. Addition cure products have no cure by-products and can be used to unlimited depth.. |
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| Pot Life | 240 min @Temperature 25.0 °C |
240 min @Temperature 77.0 °F |
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| Momentive Performance Materials RTV656 Clear Extreme Low Temperature Potting/Encapsulating Compound Two-part addition cure. Two-part addition cure RTV silicones can be cured very quickly with the use of high heat. Addition cure products have no cure by-products and can be used to unlimited depth.. |
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| Pot Life | 240 min @Temperature 25.0 °C |
240 min @Temperature 77.0 °F |
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| Tra-Con Tra-Bond 221M02 Information provided by Tra-Con Inc. |
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| Pot Life | 240 min | 240 min | |
| Tra-Con Tra-Bond F123 Color Keyed High Temperature Epoxy Adhesive TRA-BOND F123 is a fast cure, low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating sin.. |
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| Pot Life | 240 min | 240 min | |
| Tra-Con Tra-Bond F123LV Color Keyed High Temperature Epoxy Adhesive TRA-BOND F123LV is a fast cure, low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating s.. |
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| Pot Life | >= 240 min @Temperature 25.0 °C |
>= 240 min @Temperature 77.0 °F |
100 grams |
| Trelleborg Emerson & Cuming Eccobond® 11 Heat Cure Catalyst Emerson & Cuming 11 Eccobond® Heat Cure CatalystGeneral purpose, low viscosity, elevated temperature curing. Long working life. Yields cured coatings with excellent chemical resistance. Subject to .. |
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| Pot Life | 240 min | 240 min | |
| Tra-Con Tra-Duct 2924 Conductive Silver Epoxy Adhesive TRA-DUCT 2924 is a two part electrically conductive composition developed for low shrinkage, low resistivity bonding applications where good electrical and physical properties over a wide temperatur.. |
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| Pot Life | 240 - 360 min @Temperature 25.0 °C |
240 - 360 min @Temperature 77.0 °F |
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| Cytec Conathane® CC-1155 (Conap) Polyurethane Two-component Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i.. |
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| Pot Life | 240 min | 240 min | |
| Epoxy Technology EPO-TEK® 360T High Temperature Epoxy Material Description: A two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications. It is a thixotropic.. |
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| Pot Life | 240 min | 240 min | |
| Epoxy Technology EPO-TEK® 375 High Temperature Epoxy Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen sy.. |
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| Pot Life | 240 min | 240 min | |
| Epoxy Technology EPO-TEK® EJ2189-LV Electrically Conductive Epoxy Low Viscosity, two component room temp curing conductive epoxyInformation Provided by Epoxy Technology |
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| Pot Life | 240 min | 240 min | |
| Epoxy Technology EPO-TEK® EV2002 Silver-filled, electrically conductive, flexible epoxy Material Description: Silver-filled, electrically conductive, flexible epoxyInformation Provided by Epoxy Technology |
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| Pot Life | 240 min | 240 min | |
| Epoxy Technology EPO-TEK® OD2002 High Temperature Epoxy Material Description: High Tg version of EPO-TEK®353ND with low modulus and good toughness. Replacement for EPO-TEK® 364. Complies with USP Class VI biocompatibility standards.Information Provid.. |
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| Pot Life | 240 min | 240 min | |
| Epoxy Technology EPO-TEK® OE101 Two Component Epoxy Material Description: A two component epoxy designed for low stress applications in fiber optic packaging, opto-electronics and semiconductors. It is a lower modulus version of EPO-TEK® 353ND.Inf.. |
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| Pot Life | 240 min | 240 min | |
| Epoxyset Epoxiohm EO-30M-1 Electrically Conductive Epoxy Adhesive EO-30M-1 is a two part, semi-rigid, silver filled, epoxy adhesive. EO-30M-1 exhibits superior adhesion to a wide variety of substrates including most metals, ceramics, glass and plastics.Information.. |
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| Pot Life | 240 min @Temperature 75.0 °C |
240 min @Temperature 167 °F |
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| ACC EP WQS EPI Engineered Polymers Water Base Quick Set Epoxy EP WQS Water Base Quick Set, “Powered by Reactamine® Technology”, is a two component 60% solids, no VOC, self-leveling modified epoxy. This versatile new generation epoxy displays low blush, fast.. |
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| Pot Life | 240 min @Temperature 24.0 °C |
240 min @Temperature 75.2 °F |
15 lb. mass |
| BCC Products BC 7009-2 Epoxy Casting BC 7009-2 is an iron filled, low-cost mass casting system. Recommended for use in casting a minimum of two inches and a maximum of six inches in non-conductive molds. Thicknesses to nine inches in m.. |
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| Pot Life | >= 240 min @Temperature 23.0 °C |
>= 240 min @Temperature 73.4 °F |
100 g mass |
| Aremco Aremco-Bond™ 2340 High Temperature Epoxide Potting Compound High Temperature, Low Viscosity, Low Expansion, High Glass Transition Temperature & Chemical Resistance |
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| Pot Life | 240 min @Temperature 25.0 °C |
240 min @Temperature 77.0 °F |
100 gm mass |
| Aremco Aremco-Bond™ 568 High Performance Epoxide Aluminum-Filled, 1:1, Good Bond Strength and High Thermal Conductivity. |
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| Pot Life | 240 min @Temperature 25.0 °C |
240 min @Temperature 77.0 °F |
100 gm mass |
| Aremco Aremco-Bond™ 631 High Performance Epoxide Clear-Amber, 1:1, Good Bond Strength and Corrosion Resistance.Also available filled with aluminum oxide (Alumina) or pigments. |
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| Pot Life | 240 min | 240 min | uncured |
| Atom Adhesives AA-BOND F123 Epoxy Adhesive AA-BOND F123 is a low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating single or multi.. |
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| Pot Life | 240 min | 240 min | uncured |
| Atom Adhesives AA-BOND F123BK Epoxy Adhesive AA-BOND F123BK is a low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating single or mul.. |
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| Pot Life | 240 min | 240 min | 500 g |
| Abatron AboCast 50-11/AboCure 50-1 Epoxy Information provided by Abatron, Inc.Processing: Shelf life: 12+ months (unmixed). 100/35 ratio. Pot life: 500 g, 240 min. at 25°C(77°F). Exothermic Peak 190°C (375°F). Hardens in 2-24 hours.. |
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| Pot Life | >= 240 min @Temperature 24.0 °C |
>= 240 min @Temperature 75.2 °F |
2 lb. mass |
| BCC Products BC 7062-3H Epoxy Casting BC 7062 are aluminum filled, low viscosity epoxy mass casting resins. These room temperature cure systems allow the user choice thicknesses of 1/8 inch to a maximum of 6 inches without foaming or yi.. |
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