Polymer Property : Processing Temperature = 73.9 °C Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Processing Temperature	73.9 °C	165 °F	Optimum cure is 2 hr. @ 165°F
Armstrong A-1/A Epoxy Adhesive A brown epoxy paste formulated with enhanced wetting capabilities to hard rubbers and rigid thermoplastics. Has low outgassing characteristics at temperatures below 250°FInformation provided by El..
Processing Temperature	73.9 °C	165 °F	Optimum cure is 30 min. @ 165°F
Armstrong A-1/V Epoxy Adhesive A brown epoxy paste formulated with enhanced wetting capabilities to hard rubbers and rigid thermoplastics. Has low outgassing characteristics at temperatures below 250°FInformation provided by El..
Processing Temperature	73.9 °C	165 °F	Optimum cure is 20 min. @ 165°F
Armstrong A-10-T Epoxy Adhesive Clear, thixotropic, 5-minute cure general-purpose epoxy adhesive. Provides rapid high strength bonds to many substrates. Supplied in 1:1 ratio dispense kits for easy application.Information provid..
Processing Temperature	73.9 °C	165 °F	Optimum cure is 2 hr. @ 165°F
Armstrong A-12 Epoxy Adhesive, at 1:1 Mix Ratio Our most popular general-purpose, high viscosity adhesive for industry. Combines low toxicity with excellent physical properties, and offers a non-critical mixing ratio of 1:1 by weight. This rati..
Processing Temperature	73.9 °C	165 °F	Optimum cure is 2 hr. @ 165°F
Armstrong A-12 Epoxy Adhesive, at 2:3 Mix Ratio Our most popular general-purpose, high viscosity adhesive for industry. Combines low toxicity with excellent physical properties, and offers a non-critical mixing ratio of 1:1 by weight. This rati..
Processing Temperature	73.9 °C	165 °F	Fast cure is 20 min @ 165°F
Armstrong A-12 Epoxy Adhesive, at 2:3 Mix Ratio Our most popular general-purpose, high viscosity adhesive for industry. Combines low toxicity with excellent physical properties, and offers a non-critical mixing ratio of 1:1 by weight. This rati..
Processing Temperature	73.9 °C	165 °F	Optimum cure is 2 hr. @ 165°F
Armstrong A-12-T Epoxy Adhesive Provides the same basic properties as A-12, but in thixotropic, non-sag, easily-brushable paste form. An ideal material for use where adhesive flow during cure cannot be tolerated. A-12-T meets t..
Processing Temperature	73.9 °C	165 °F	Optimum cure is 2 hr. @ 165°F
Armstrong A-2/A Epoxy Adhesive This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac..
Processing Temperature	73.9 °C	165 °F	Optimum cure is 2 hr. @ 165°F
Armstrong A-3/A Epoxy Adhesive A Jet black epoxy paste especially formulated for bonding rigid materials. When used with Activator A or E, A-3 exhibits excellent bonding properties to phenolics, precious stones, ceramics, glass,..
Processing Temperature	73.9 °C	165 °F	Optimum cure is 2 hr. @ 165°F
Armstrong A-31 Epoxy Adhesive Is a neutral-colored thixotropic paste material having a creamy or buttery consistency that will not flow even when cured at elevated temperatures A-31 also features Extremely low outgassing charact..
Processing Temperature	73.9 °C	165 °F	Optimum cure is 2 hr. @ 165°F
Armstrong A-4/A Epoxy Adhesive Is a heavy, non-metallic filled, gray paste epoxy that provides excellent thixotropic non-sag bond lines. It can be used for small volume casting applications.Information provided by Ellsworth Adhe..
Processing Temperature	73.9 °C	165 °F	Optimum cure is 2 hr. @ 165°F
Armstrong A-5/A Epoxy Adhesive Information provided by Ellsworth Adhesives.
Processing Temperature	73.9 °C	165 °F	Optimum cure is 20 min. @ 165°F
Armstrong A-7 Epoxy Adhesive Clear, flexible, 5-minute cure structural bonding plastic adhesive. Develops high performance, high impact durable bonds for operating temperatures from -65° to +250°. Supplied in 1:1 ratio dispe..
Processing Temperature	73.9 °C	165 °F	Optimum cure is 2 hr. @ 165°F
Armstrong C-1/A Epoxy Adhesive A versatile, low viscosity, unfilled resin used for electrical potting and laminating applications. It is an excellent insulator, and provides outstanding chemical resistance to most compoundsInfor..
Processing Temperature	73.9 °C	165 °F	Optimum cure is 2 hr. @ 165°F
Armstrong C-1/H20 Epoxy Adhesive A versatile, low viscosity, unfilled resin used for electrical potting and laminating applications. It is an excellent insulator, and provides outstanding chemical resistance to most compoundsInfor..
Processing Temperature	73.9 °C	165 °F	Optimum cure is 2 hr. @ 165°F
Armstrong C-4/D Epoxy Adhesive A low viscosity, clear amber, unfilled adhesive, recommended for use with activators D or W. C-4 with Activator W offers maximum versatility in that differing degrees of flexibility can be achieved ..
Processing Temperature	73.9 °C	165 °F	Optimum cure is 2 hr. @ 165°F
Armstrong C-4/W Epoxy Adhesive A low viscosity, clear amber, unfilled adhesive, recommended for use with activators D or W. C-4 with Activator W offers maximum versatility in that differing degrees of flexibility can be achieved ..
Processing Temperature	73.9 °C	165 °F	Optimum cure is 2 hr. @ 165°F
Armstrong C-7/H20 Epoxy Adhesive A clear, unfilled, medium viscosity adhesive recommended for use with any Armstrong Activator. Physical property data included covers C-7 used with Activators W and H-20. All other Activators may ..
Processing Temperature	73.9 °C	165 °F	Optimum cure is 2 hr. @ 165°F
Armstrong X-81/A Epoxy Adhesive Information provided by Ellsworth Adhesives.
Processing Temperature	73.9 °C	165 °F	Optimum cure is 2 hr. @ 165°F
Armstrong X-81-A/F Epoxy Adhesive Information provided by Ellsworth Adhesives.