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Polymer Property : Processing Temperature = 72.0 °F Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Processing Temperature | 22.2 - 26.7 °C | 72.0 - 80.0 °F | Prepolymer Temperature |
| Northstar Polymers MPP-A80H Room-Temperature Curable Polyurethane MPP-A80H has been specifically formulated to service applications where high elongation and good physical strength are required as well as where temperature during the process must be low for a very.. |
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| Processing Temperature | 22.2 - 26.7 °C | 72.0 - 80.0 °F | Curing Agent Temperature |
| Northstar Polymers MPP-A80H Room-Temperature Curable Polyurethane MPP-A80H has been specifically formulated to service applications where high elongation and good physical strength are required as well as where temperature during the process must be low for a very.. |
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| Processing Temperature | 22.2 - 30.0 °C | 72.0 - 86.0 °F | Curing Agent Temperature |
| Northstar Polymers MPP-W43C Polyurethane Gel MPP-W43C is a polyurethane gel formulation specifically designed for padding and cushioning applications that require Shore Durometer OOO scale hardness materials. With this material, a user can ob.. |
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| Processing Temperature | 22.2 - 30.0 °C | 72.0 - 86.0 °F | Prepolymer Temperature |
| Northstar Polymers GK-22 Polyurethane Gel for Adhesion Pad Applications GK-22 is a polyurethane gel formulation designed to make soft sticky polyurethane gel for pressure-sensitive-adhesive type products. This 2-part cast urethane system can be manually processed easi.. |
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| Processing Temperature | 22.2 - 30.0 °C | 72.0 - 86.0 °F | Curing Agent Temperature |
| Northstar Polymers GK-22 Polyurethane Gel for Adhesion Pad Applications GK-22 is a polyurethane gel formulation designed to make soft sticky polyurethane gel for pressure-sensitive-adhesive type products. This 2-part cast urethane system can be manually processed easi.. |
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| Processing Temperature | 22.2 - 185 °C | 72.0 - 365 °F | Average value: 129 °C Grade Count:14 |
| Overview of materials for Epoxy Encapsulant, Unreinforced This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Encapsulant, Unreinforced". Each property range of values reported is minimum and maximum values o.. |
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| Processing Temperature | 22.2 °C | 72.0 °F | |
| Armstrong A-1/V Epoxy Adhesive A brown epoxy paste formulated with enhanced wetting capabilities to hard rubbers and rigid thermoplastics. Has low outgassing characteristics at temperatures below 250°FInformation provided by El.. |
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| Processing Temperature | 22.2 °C | 72.0 °F | |
| Armstrong A-10-T Epoxy Adhesive Clear, thixotropic, 5-minute cure general-purpose epoxy adhesive. Provides rapid high strength bonds to many substrates. Supplied in 1:1 ratio dispense kits for easy application.Information provid.. |
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| Processing Temperature | 22.2 °C | 72.0 °F | |
| Armstrong A-12 Epoxy Adhesive, at 1:1 Mix Ratio Our most popular general-purpose, high viscosity adhesive for industry. Combines low toxicity with excellent physical properties, and offers a non-critical mixing ratio of 1:1 by weight. This rati.. |
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| Processing Temperature | 22.2 °C | 72.0 °F | |
| Armstrong A-12 Epoxy Adhesive, at 2:3 Mix Ratio Our most popular general-purpose, high viscosity adhesive for industry. Combines low toxicity with excellent physical properties, and offers a non-critical mixing ratio of 1:1 by weight. This rati.. |
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| Processing Temperature | 22.2 °C | 72.0 °F | |
| Armstrong A-12 Epoxy Adhesive, at 3:2 Mix Ratio Our most popular general-purpose, high viscosity adhesive for industry. Combines low toxicity with excellent physical properties, and offers a non-critical mixing ratio of 1:1 by weight. This rati.. |
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| Processing Temperature | 22.2 °C | 72.0 °F | |
| Armstrong A-12-T Epoxy Adhesive Provides the same basic properties as A-12, but in thixotropic, non-sag, easily-brushable paste form. An ideal material for use where adhesive flow during cure cannot be tolerated. A-12-T meets t.. |
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| Processing Temperature | 22.2 °C | 72.0 °F | |
| Armstrong A-2/A Epoxy Adhesive This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac.. |
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| Processing Temperature | 22.2 °C | 72.0 °F | |
| Armstrong A-2/H20 Epoxy Adhesive This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac.. |
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| Processing Temperature | 22.2 °C | 72.0 °F | |
| Armstrong A-2/W Epoxy Adhesive This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac.. |
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| Processing Temperature | 22.2 °C | 72.0 °F | |
| Armstrong A-271 Epoxy Adhesive A clear amber adhesive system. A-271 is a medium viscosity liquid with excellent wetting ability. It is ideal for bonding glass or similar smooth surfaces. It features very low shrinkage coupled .. |
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| Processing Temperature | 22.2 °C | 72.0 °F | |
| Armstrong A-3/A Epoxy Adhesive A Jet black epoxy paste especially formulated for bonding rigid materials. When used with Activator A or E, A-3 exhibits excellent bonding properties to phenolics, precious stones, ceramics, glass,.. |
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| Processing Temperature | 22.2 °C | 72.0 °F | |
| Armstrong A-31 Epoxy Adhesive Is a neutral-colored thixotropic paste material having a creamy or buttery consistency that will not flow even when cured at elevated temperatures A-31 also features Extremely low outgassing charact.. |
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| Processing Temperature | 22.2 °C | 72.0 °F | |
| Armstrong A-34 Epoxy Adhesive This white paste material is a fast-curing adhesive with a working life of 20-25 minutes in a 100-gram mass. Mixing ratio is a convenient 1:1. A-34 has excellent wetting properties and is suggeste.. |
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| Processing Temperature | 22.2 °C | 72.0 °F | |
| Armstrong A-4/A Epoxy Adhesive Is a heavy, non-metallic filled, gray paste epoxy that provides excellent thixotropic non-sag bond lines. It can be used for small volume casting applications.Information provided by Ellsworth Adhe.. |
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| Processing Temperature | 22.2 °C | 72.0 °F | |
| Armstrong A-40 Epoxy Adhesive Is a high viscosity, dark gray, liquid adhesive system that is qualified under Mil. Spec. MMM-A-134, Type II. NOTE: Adhesives qualified under this Specification (A-40, A-706) feature exceptional re.. |
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| Processing Temperature | 22.2 °C | 72.0 °F | |
| Armstrong A-5/A Epoxy Adhesive Information provided by Ellsworth Adhesives. |
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| Processing Temperature | 22.2 °C | 72.0 °F | |
| Armstrong A-7 Epoxy Adhesive Clear, flexible, 5-minute cure structural bonding plastic adhesive. Develops high performance, high impact durable bonds for operating temperatures from -65° to +250°. Supplied in 1:1 ratio dispe.. |
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| Processing Temperature | 22.2 °C | 72.0 °F | |
| Armstrong C-1/H20 Epoxy Adhesive A versatile, low viscosity, unfilled resin used for electrical potting and laminating applications. It is an excellent insulator, and provides outstanding chemical resistance to most compoundsInfor.. |
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| Processing Temperature | 22.2 °C | 72.0 °F | |
| Armstrong C-4/W Epoxy Adhesive A low viscosity, clear amber, unfilled adhesive, recommended for use with activators D or W. C-4 with Activator W offers maximum versatility in that differing degrees of flexibility can be achieved .. |
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| Processing Temperature | 22.2 °C | 72.0 °F | |
| Armstrong C-7/H20 Epoxy Adhesive A clear, unfilled, medium viscosity adhesive recommended for use with any Armstrong Activator. Physical property data included covers C-7 used with Activators W and H-20. All other Activators may .. |
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| Processing Temperature | 22.2 °C | 72.0 °F | |
| Armstrong C-7/W Epoxy Adhesive, 1:1 Mix Ratio A clear, unfilled, medium viscosity adhesive recommended for use with any Armstrong Activator. Physical property data included covers C-7 used with Activators W and H-20. All other Activators may .. |
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| Processing Temperature | 22.2 °C | 72.0 °F | |
| Armstrong C-7/W Epoxy Adhesive, 2:3 Mix Ratio A clear, unfilled, medium viscosity adhesive recommended for use with any Armstrong Activator. Physical property data included covers C-7 used with Activators W and H-20. All other Activators may .. |
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| Processing Temperature | 22.2 °C | 72.0 °F | |
| Armstrong C-7/W Epoxy Adhesive, 3:2 Mix Ratio A clear, unfilled, medium viscosity adhesive recommended for use with any Armstrong Activator. Physical property data included covers C-7 used with Activators W and H-20. All other Activators may .. |
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| Processing Temperature | 22.2 °C | 72.0 °F | |
| Armstrong X-81-A/F Epoxy Adhesive Information provided by Ellsworth Adhesives. |
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