Processing Properties | Metric | English | Comments |
---|---|---|---|
Processing Temperature | 310 - 371 °C | 590 - 700 °F | Injection |
Dyna-Purge® E Purging Compound Designed for Purging High-Temperature Engineering ResinsGeneral Description:DYNA-PURGE E is a high heat-resistant, non-abrasive, non-chemical “engineered†thermoplastic purging compound, f.. |
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Processing Temperature | 310 - 371 °C | 590 - 700 °F | Extrusion |
Dyna-Purge® E Purging Compound Designed for Purging High-Temperature Engineering ResinsGeneral Description:DYNA-PURGE E is a high heat-resistant, non-abrasive, non-chemical “engineered†thermoplastic purging compound, f.. |