Songhan Plastic Technology Co.,Ltd.
 POLYMER SEARCH

Polymer Property : Processing Temperature = 300 °F Product List

Processing Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.
Processing Properties Metric English Comments
Processing Temperature 149 - 177 °C
300 - 351 °F
Thermoforming surface
Chevron Phillips Marlex® HHM 5202 Polyethylene, Sheet/Thermoforming Grade, HDPE  (discontinued **)
Meets FDA Regulation 177.1520.Data provided by the manufacturer
Processing Temperature 149 - 177 °C
300 - 351 °F
Thermoforming surface
Chevron Phillips Marlex® HHM 5502-01 Polyethylene, Sheet/Thermoforming Grade, HDPE  (discontinued **)
Meets FDA Regulation 177.1520.Data provided by the manufacturer
Processing Temperature 149 °C
300 °F
Hopper
Solvay Specialty Polymers Udel® P-3700 HC Polysulfone (PSU)
Udel® P-3700 HC is a high-clarity grade of polysulfone (PSU) that is nearly water-white in color. This grade was designed to eliminate the yellow cast and provide design flexibility and improved ..
Processing Temperature 149 °C
300 °F
Hot Forming Temperature
Spartech Polycast Solarcryl (0.187") Cell Cast Acrylic
Description: Cell Cast AcrylicInformation provided by Spartech.
Processing Temperature >= 149 °C
>= 300 °F
DayGlo GloPrill Hyperdispersed Colorant
GloPrill is a high-performance fluorescent colorant developed especially for polyolefins. Designed with the plastics concentrate/masterbatch producer in mind, these supercharged colorants develop br..
Processing Temperature 149 °C
300 °F
Fast cure is 10 min. @ 300°F
Armstrong A-1/V Epoxy Adhesive
A brown epoxy paste formulated with enhanced wetting capabilities to hard rubbers and rigid thermoplastics. Has low outgassing characteristics at temperatures below 250°FInformation provided by El..
Processing Temperature 149 °C
300 °F
Fast cure is 5 min. @ 300°F
Armstrong A-12 Epoxy Adhesive, at 1:1 Mix Ratio
Our most popular general-purpose, high viscosity adhesive for industry. Combines low toxicity with excellent physical properties, and offers a non-critical mixing ratio of 1:1 by weight. This rati..
Processing Temperature 149 °C
300 °F
Fast cure is 5 min. @ 300°F
Armstrong A-12 Epoxy Adhesive, at 3:2 Mix Ratio
Our most popular general-purpose, high viscosity adhesive for industry. Combines low toxicity with excellent physical properties, and offers a non-critical mixing ratio of 1:1 by weight. This rati..
Processing Temperature 149 °C
300 °F
Fast cure is 5 min. @ 300°F
Armstrong A-12-T Epoxy Adhesive
Provides the same basic properties as A-12, but in thixotropic, non-sag, easily-brushable paste form. An ideal material for use where adhesive flow during cure cannot be tolerated. A-12-T meets t..
Processing Temperature 149 °C
300 °F
Fast cure is 5 min. @ 300°F
Armstrong A-2/W Epoxy Adhesive
This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac..
Processing Temperature 149 °C
300 °F
Fast cure is 5 min. @ 300°F
Armstrong A-271 Epoxy Adhesive
A clear amber adhesive system. A-271 is a medium viscosity liquid with excellent wetting ability. It is ideal for bonding glass or similar smooth surfaces. It features very low shrinkage coupled ..
Processing Temperature 149 °C
300 °F
Fast cure is 5 min. @ 300°F
Armstrong A-31 Epoxy Adhesive
Is a neutral-colored thixotropic paste material having a creamy or buttery consistency that will not flow even when cured at elevated temperatures A-31 also features Extremely low outgassing charact..
Processing Temperature 149 °C
300 °F
Fast cure is 5 min. @ 300°F
Armstrong A-34 Epoxy Adhesive
This white paste material is a fast-curing adhesive with a working life of 20-25 minutes in a 100-gram mass. Mixing ratio is a convenient 1:1. A-34 has excellent wetting properties and is suggeste..
Processing Temperature 149 °C
300 °F
Fast cure is 5 min. @ 300°F
Armstrong A-40 Epoxy Adhesive
Is a high viscosity, dark gray, liquid adhesive system that is qualified under Mil. Spec. MMM-A-134, Type II. NOTE: Adhesives qualified under this Specification (A-40, A-706) feature exceptional re..
Processing Temperature 149 °C
300 °F
Optimum cure is 10 min. @ 300°F
Armstrong A-661 Epoxy Adhesive
A truly unique, two-component, room temperature curing thixotropic epoxy adhesive system, which exhibits good bond strength at service temperatures up to 400°F. Ideal for applications where resist..
Processing Temperature 149 °C
300 °F
Fast cure is 30 min. @ 300°F
Armstrong C-1/H20 Epoxy Adhesive
A versatile, low viscosity, unfilled resin used for electrical potting and laminating applications. It is an excellent insulator, and provides outstanding chemical resistance to most compoundsInfor..
Processing Temperature 149 °C
300 °F
Fast cure is 5 min. @ 300°F
Armstrong C-4/D Epoxy Adhesive
A low viscosity, clear amber, unfilled adhesive, recommended for use with activators D or W. C-4 with Activator W offers maximum versatility in that differing degrees of flexibility can be achieved ..
Processing Temperature 149 °C
300 °F
Fast cure is 5 min. @ 300°F
Armstrong C-4/W Epoxy Adhesive
A low viscosity, clear amber, unfilled adhesive, recommended for use with activators D or W. C-4 with Activator W offers maximum versatility in that differing degrees of flexibility can be achieved ..
Processing Temperature 149 °C
300 °F
Fast cure is 5 min. @ 300°F
Armstrong C-7/H20 Epoxy Adhesive
A clear, unfilled, medium viscosity adhesive recommended for use with any Armstrong Activator. Physical property data included covers C-7 used with Activators W and H-20. All other Activators may ..
Processing Temperature 149 °C
300 °F
Fast cure is 5 min. @ 300°F
Armstrong C-7/W Epoxy Adhesive, 1:1 Mix Ratio
A clear, unfilled, medium viscosity adhesive recommended for use with any Armstrong Activator. Physical property data included covers C-7 used with Activators W and H-20. All other Activators may ..
Processing Temperature 149 °C
300 °F
Fast cure is 5 min. @ 300°F
Armstrong C-7/W Epoxy Adhesive, 2:3 Mix Ratio
A clear, unfilled, medium viscosity adhesive recommended for use with any Armstrong Activator. Physical property data included covers C-7 used with Activators W and H-20. All other Activators may ..
Processing Temperature 149 °C
300 °F
Fast cure is 5 min. @ 300°F
Armstrong C-7/W Epoxy Adhesive, 3:2 Mix Ratio
A clear, unfilled, medium viscosity adhesive recommended for use with any Armstrong Activator. Physical property data included covers C-7 used with Activators W and H-20. All other Activators may ..
Copyright © lookpolymers.com All Rights Reserved