Polymer Property : Processing Temperature = 200 °F Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Processing Temperature	93.3 °C	200 °F
Plasma Coatings 10000 Surface Material Information provided by Plasma Coatings
Processing Temperature	93.3 °C	200 °F
Plasma Coatings 12000 Surface Material Information provided by Plasma Coatings
Processing Temperature	93.3 °C	200 °F
Plasma Coatings 19000 Surface Material Information provided by Plasma Coatings
Processing Temperature	93.3 °C	200 °F
Plasma Coatings 21000 Surface Material Information provided by Plasma Coatings
Processing Temperature	93.3 °C	200 °F
Plasma Coatings 28000 Surface Material Information provided by Plasma Coatings
Processing Temperature	93.3 °C	200 °F
Plasma Coatings 400 Surface Material Information provided by Plasma Coatings
Processing Temperature	93.3 °C	200 °F
Plasma Coatings 900 Surface Material Information provided by Plasma Coatings
Processing Temperature	93.3 °C	200 °F
Plasma Coatings D/E Surface Material Information provided by Plasma Coatings
Processing Temperature	93.3 °C	200 °F
Plasma Coatings 600 Surface Material Information provided by Plasma Coatings
Processing Temperature	93.3 °C	200 °F	Optimum cure is 20 min. @ 200°F
Armstrong A-12 Epoxy Adhesive, at 3:2 Mix Ratio Our most popular general-purpose, high viscosity adhesive for industry. Combines low toxicity with excellent physical properties, and offers a non-critical mixing ratio of 1:1 by weight. This rati..
Processing Temperature	93.3 °C	200 °F	Fast cure is 10 min. @ 200°F
Armstrong A-2/A Epoxy Adhesive This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac..
Processing Temperature	93.3 °C	200 °F	Optimum cure is 1 hr. @ 200°F
Armstrong A-2/E Epoxy Adhesive This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac..
Processing Temperature	93.3 °C	200 °F	Fast cure is 10 min. @ 200°F
Armstrong A-2/H20 Epoxy Adhesive This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac..
Processing Temperature	93.3 °C	200 °F	Optimum cure is 30 min. @ 200°F
Armstrong A-2/H20 Epoxy Adhesive This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac..
Processing Temperature	93.3 °C	200 °F	Optimum cure is 30 min. @ 200°F
Armstrong A-2/W Epoxy Adhesive This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac..
Processing Temperature	93.3 °C	200 °F	Optimum cure is 5min. @ 200°F
Armstrong A-271 Epoxy Adhesive A clear amber adhesive system. A-271 is a medium viscosity liquid with excellent wetting ability. It is ideal for bonding glass or similar smooth surfaces. It features very low shrinkage coupled ..
Processing Temperature	93.3 °C	200 °F	Fast cure is 10 min. @ 200°F
Armstrong A-3/A Epoxy Adhesive A Jet black epoxy paste especially formulated for bonding rigid materials. When used with Activator A or E, A-3 exhibits excellent bonding properties to phenolics, precious stones, ceramics, glass,..
Processing Temperature	93.3 °C	200 °F	Optimum cure is 30 min. @ 200°F
Armstrong A-34 Epoxy Adhesive This white paste material is a fast-curing adhesive with a working life of 20-25 minutes in a 100-gram mass. Mixing ratio is a convenient 1:1. A-34 has excellent wetting properties and is suggeste..
Processing Temperature	93.3 °C	200 °F	Optimum cure is 1 hr. @ 200°F
Armstrong A-4/E Epoxy Adhesive Is a heavy, non-metallic filled, gray paste epoxy that provides excellent thixotropic non-sag bond lines. It can be used for small volume casting applications.Information provided by Ellsworth Adhe..
Processing Temperature	93.3 °C	200 °F	Optimum cure is 1 hr. @ 200°F
Armstrong A-5/E Epoxy Adhesive Information provided by Ellsworth Adhesives.
Processing Temperature	93.3 °C	200 °F	Optimum cure is 1 hr. @ 200°F
Armstrong C-1/E Epoxy Adhesive A versatile, low viscosity, unfilled resin used for electrical potting and laminating applications. It is an excellent insulator, and provides outstanding chemical resistance to most compoundsInfor..
Processing Temperature	93.3 °C	200 °F	Optimum cure is 15 min. @ 200°F
Armstrong C-7/W Epoxy Adhesive, 1:1 Mix Ratio A clear, unfilled, medium viscosity adhesive recommended for use with any Armstrong Activator. Physical property data included covers C-7 used with Activators W and H-20. All other Activators may ..
Processing Temperature	93.3 °C	200 °F	Optimum cure is 15 min. @ 200°F
Armstrong C-7/W Epoxy Adhesive, 2:3 Mix Ratio A clear, unfilled, medium viscosity adhesive recommended for use with any Armstrong Activator. Physical property data included covers C-7 used with Activators W and H-20. All other Activators may ..
Processing Temperature	93.3 °C	200 °F	Optimum cure is 15 min. @ 200°F
Armstrong C-7/W Epoxy Adhesive, 3:2 Mix Ratio A clear, unfilled, medium viscosity adhesive recommended for use with any Armstrong Activator. Physical property data included covers C-7 used with Activators W and H-20. All other Activators may ..
Processing Temperature	93.3 °C	200 °F	Optimum cure is 1 hr. @ 200°F
Armstrong X-6/E Epoxy Adhesive Thixotropic.Information provided by Ellsworth Adhesives.
Processing Temperature	93.3 °C	200 °F	Optimum cure is 1 hr. @ 200°F
Armstrong A-1/E Epoxy Adhesive A brown epoxy paste formulated with enhanced wetting capabilities to hard rubbers and rigid thermoplastics. Has low outgassing characteristics at temperatures below 250°FInformation provided by El..
Processing Temperature	93.3 °C	200 °F	Optimum cure is 1 hr. @ 200°F
Armstrong A-3/E Epoxy Adhesive A Jet black epoxy paste especially formulated for bonding rigid materials. When used with Activator A or E, A-3 exhibits excellent bonding properties to phenolics, precious stones, ceramics, glass,..