Thermal Properties | Metric | English | Comments |
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CTE, linear, Transverse to Flow | 20.0 µm/m-°C @Temperature 23.0 - 60.0 °C |
11.1 µin/in-°F @Temperature 73.4 - 140 °F |
ISO 11359-2 |
SABIC Innovative Plastics LNP THERMOCOMP DC006 PC (Asia Pacific) LNP THERMOCOMP* DC006 is a compound based on Polycarbonate resin containing Carbon Fiber.This product is also known as Thermocomp* DC-1006. |
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CTE, linear, Transverse to Flow | 20.0 µm/m-°C @Temperature -40.0 - 40.0 °C |
11.1 µin/in-°F @Temperature -40.0 - 104 °F |
ISO 11359-2 |
SABIC Innovative Plastics LNP THERMOCOMP DC006H PC LNP* THERMOCOMP* DC006H is a compound based on Polycarbonate resin containing 30% Carbon Fiber. Added features of this material include: Electrically Conductive, Healthcare. |
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CTE, linear, Transverse to Flow | 20.0 µm/m-°C @Temperature -40.0 - 40.0 °C |
11.1 µin/in-°F @Temperature -40.0 - 104 °F |
ISO 11359-2 |
SABIC Innovative Plastics LNP THERMOCOMP DC006H PC (Asia Pacific) LNP* Thermocomp* DC006H is a compound based on Polycarbonate resin containing Carbon Fiber. Added features of this material include: Electrically Conductive. |
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CTE, linear, Transverse to Flow | 20.0 µm/m-°C @Temperature -40.0 - 40.0 °C |
11.1 µin/in-°F @Temperature -40.0 - 104 °F |
ISO 11359-2 |
SABIC Innovative Plastics LNP THERMOCOMP IC006 PA 6/12 LNP* THERMOCOMP* IC006 is a compound based on Nylon 6/12 resin containing 30% Carbon Fiber. Added features of this material include: Electrically Conductive. |
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CTE, linear, Transverse to Flow | 20.0 µm/m-°C @Temperature -40.0 - 40.0 °C |
11.1 µin/in-°F @Temperature -40.0 - 104 °F |
ISO 11359-2 |
SABIC Innovative Plastics LNP THERMOCOMP IC006 PA 6/12 (Asia Pacific) LNP* Thermocomp* IC006 is a compound based on Nylon 6/12 resin containing Carbon Fiber. Added features of this material include: Electrically Conductive. |
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CTE, linear, Transverse to Flow | 20.0 µm/m-°C @Temperature <=190 °C |
11.1 µin/in-°F @Temperature <=374 °F |
z (< Tg); IPC TM-650 2.4.24 |
Arlon MULTICLAD™ HF Halogen-Free Low-Loss Laminate and Prepreg System MULTICLAD™ HF represents the next generation low-loss thermoset and prepreg system for high-speed and high-frequency printed circuit boards. This technology combines a low-loss, high reliability t.. |
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CTE, linear, Transverse to Flow | 20.0 µm/m-°C @Thickness 2.00 mm, Temperature 75.0 °C |
11.1 µin/in-°F @Thickness 0.0787 in, Temperature 167 °F |
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BASF Ultrason® KR 4113 PESU with 10/10% Carbon Fibers/Graphite and 10% PTFE Description: Compound based on PES with 30 % filler. The filler system, a mixture of carbon fibers, graphite and PTFE powder, considerably improves Ultrason’s tribological properties. In addition, .. |
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CTE, linear, Transverse to Flow | 20.0 µm/m-°C @Thickness 2.00 mm, Temperature 25.0 °C |
11.1 µin/in-°F @Thickness 0.0787 in, Temperature 77.0 °F |
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BASF Ultrason® KR 4113 PESU with 10/10% Carbon Fibers/Graphite and 10% PTFE Description: Compound based on PES with 30 % filler. The filler system, a mixture of carbon fibers, graphite and PTFE powder, considerably improves Ultrason’s tribological properties. In addition, .. |
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CTE, linear, Transverse to Flow | 20.0 µm/m-°C @Temperature -100 °C |
11.1 µin/in-°F @Temperature -148 °F |
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Chevron Phillips Ryton® R10 7006A PPS Polyphenylene Sulfide
(discontinued **) Ryton® PPS is used in many electronic and automotive applications because of its high strength, favorable electrical properties, and high temperature stability.Data provided by the manufacturer.Sol.. |