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Polymer Property : Thermal Conductivity = 6.94 BTU-in/hr-ft²-°F Product List

Thermal Properties

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Thermal Properties Metric English Comments
Thermal Conductivity 1.00 - 2.00 W/m-K
6.94 - 13.9 BTU-in/hr-ft²-°F
Through Plane; ASTM E1461
PolyOne Trilliant™ HC HC0200-5001 XR Grey Thermoplastic Elastomer (TPE)
The Trilliant® specialty compounds offer a complete system of specialty engineered materials, certified processes, services and technical support that enable healthcare OEM's to get to market ahead..
Thermal Conductivity 1.00 W/m-K
6.94 BTU-in/hr-ft²-°F
ASTM D5470
Parker Chomerics THERM-A-GAP™ G174 Cost Effective Gap Filler
Description: THERM-A-GAP™ elastomers are used to fill air gaps between PC boards or other components and heat sinks, metal enclosures, and chassis. The exceptional conformability of these advanced ..
Thermal Conductivity 1.00 - 3.00 W/m-K

@Temperature 50.0 - 100 °C
6.94 - 20.8 BTU-in/hr-ft²-°F

@Temperature 122 - 212 °F
Average value: 1.94 W/m-K Grade Count:14
Overview of materials for Silicone, Molded, Glass Fiber Filled
This property data is a summary of similar materials in the MatWeb database for the category "Silicone, Molded, Glass Fiber Filled". Each property range of values reported is minimum and maximum val..
Thermal Conductivity 1.00 - 2.00 W/m-K
6.94 - 13.9 BTU-in/hr-ft²-°F
ASTM C177
PolyOne Therma-Tech™ SFC-5000 TC Polyphenylene Sulfide (PPS)  (discontinued **)
Therma-Tech™ Thermal Management Compounds have been engineered to combine the heat transfer and cooling capabilities of metals with the design freedom, weight reduction and cost advantages of therm..
Thermal Conductivity <= 1.00 W/m-K
<= 6.94 BTU-in/hr-ft²-°F
MarkeTech MC-LD and MC-MD Ultra High Temperature Machinable Ceramics
For very high temperatures or where thermal conductivity or thermal shock is important, these machinable alkaline/alkaline earth zirconium phosphate ceramics (NaZr2P3O12 or BaZr4P6O24) are recommend..
Thermal Conductivity 1.00 W/m-K
6.94 BTU-in/hr-ft²-°F
HOT-DISK || 60x60x3 mm
Lehmann & Voss LUVOCOM® 1/CF/20 Polyamide 66, with carbon fiber
Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Reduced moment of inertia comp..
Thermal Conductivity 1.00 W/m-K
6.94 BTU-in/hr-ft²-°F
Schott N-SF5 Glass
Information Provided by SCHOTT North America, Inc.
Thermal Conductivity 1.00 W/m-K

@Temperature 90.0 °C
6.94 BTU-in/hr-ft²-°F

@Temperature 194 °F
Schott Glass 8337B Borosilicate Glass
Borosilicate glass for sealing to Kovar metal and tungsten, highly UV-transmitting photomultiplier and UV detectors The heavy metal content for the elements lead, cadmium, mercury, and hexavalent ..
Thermal Conductivity 1.00 W/m-K

@Temperature 121 °C
6.94 BTU-in/hr-ft²-°F

@Temperature 250 °F
Tra-Con Tra-Bond 933-1 Moisture Resistant Chip Encapsulant
TRA-BOND 933-1 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical..
Thermal Conductivity 1.00 W/m-K
6.94 BTU-in/hr-ft²-°F
through plane; ASTM E1461
DSM Stanyl® TC153 PA46 FR(17)
Thermal conductive material, Flame Retardant, Heat Stabilized
Thermal Conductivity 1.00 W/m-K
6.94 BTU-in/hr-ft²-°F
through plane; ASTM E1461
DSM Stanyl® TC155 PA46 FR(17)
Thermal conductive material, Flame Retardant, Heat Stabilized
Thermal Conductivity 1.00 W/m-K
6.94 BTU-in/hr-ft²-°F
ASTM E1530
Eurostar Starflam RF0023E PA66/6, 10% Glass Filled, Injection Molded
Starflam RF0023E is a Mineral Flame Retardant, Halogen Free and Phosphorous Free, Glass Fiber Reinforced, Polyamide 66/6 Injection Molding (also known as RF1002Z230EM)Information provided by Polymer..
Thermal Conductivity 1.00 W/m-K

@Temperature 100 °C
6.94 BTU-in/hr-ft²-°F

@Temperature 212 °F
Silicone Property; ASTM E 1530
Arlon Thermabond® 99A30N008 0.008" (0.203 mm) Uncured Silicone Rubber with PTFE Coated Fiberglass Carrier
Description: Primerless Thermabond®: Electrically insulating, thermally conductive, electronic adhesive. Bonds without primer.Design/Construction: Liner: FEPProduct: Uncured Silicone Rubber Carrier..
Thermal Conductivity 1.00 W/m-K

@Temperature 100 °C
6.94 BTU-in/hr-ft²-°F

@Temperature 212 °F
Silicone Property; ASTM E1530
Arlon Thermabond® R37260N008 0.008" Uncured Silicone Rubber on Fiberglass Carrier
Primerless Thermabond®: Electrically insulating, thermally conductive, electronic adhesive. Bonds without primer.Design/Construction:Liner: 1 mil FEPProduct: Uncured Silicone RubberCarrier: 3 m..
Thermal Conductivity 1.00 W/m-K
6.94 BTU-in/hr-ft²-°F
Atom Adhesives AA-BOND 2153 Epoxy Adhesive
AA-BOND 2153 is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits..
Thermal Conductivity 1.00 W/m-K

@Pressure 2.07 MPa
6.94 BTU-in/hr-ft²-°F

@Pressure 300 psi
ASTM D5470
Parker Chomerics CHO-SEAL® 6502 Conductive Elastomer
Description: Highest performance in harsh environments; excellent shielding; best choice for corrosion requirements against aluminum.Molded and ExtrudedRoHS CompliantInformation provided by Chomeric..
Thermal Conductivity 1.00 W/m-K
6.94 BTU-in/hr-ft²-°F
Resinlab® EP1285HD-14 Highly Filled, Medium Viscosity Casting Resin
Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C..
Thermal Conductivity 1.00 W/m-K
6.94 BTU-in/hr-ft²-°F
DIN 52612
BASF Ultramid® B3UGM210 GR 22866 10/50% Glass/Mineral Filled PA6 FR (Dry)
Description: Halogen- and phosphorus-free injection-molding grade with very high rigidity, low smoke density and outstanding electrical properties.Information provided by BASF
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