Thermal Properties | Metric | English | Comments |
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Thermal Conductivity | 1.00 - 2.00 W/m-K | 6.94 - 13.9 BTU-in/hr-ft²-°F | Through Plane; ASTM E1461 |
PolyOne Trilliant™ HC HC0200-5001 XR Grey Thermoplastic Elastomer (TPE) The Trilliant® specialty compounds offer a complete system of specialty engineered materials, certified processes, services and technical support that enable healthcare OEM's to get to market ahead.. |
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Thermal Conductivity | 1.00 W/m-K | 6.94 BTU-in/hr-ft²-°F | ASTM D5470 |
Parker Chomerics THERM-A-GAP™ G174 Cost Effective Gap Filler Description: THERM-A-GAP™ elastomers are used to fill air gaps between PC boards or other components and heat sinks, metal enclosures, and chassis. The exceptional conformability of these advanced .. |
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Thermal Conductivity | 1.00 - 3.00 W/m-K @Temperature 50.0 - 100 °C |
6.94 - 20.8 BTU-in/hr-ft²-°F @Temperature 122 - 212 °F |
Average value: 1.94 W/m-K Grade Count:14 |
Overview of materials for Silicone, Molded, Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Silicone, Molded, Glass Fiber Filled". Each property range of values reported is minimum and maximum val.. |
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Thermal Conductivity | 1.00 - 2.00 W/m-K | 6.94 - 13.9 BTU-in/hr-ft²-°F | ASTM C177 |
PolyOne Therma-Tech™ SFC-5000 TC Polyphenylene Sulfide (PPS)
(discontinued **) Therma-Tech™ Thermal Management Compounds have been engineered to combine the heat transfer and cooling capabilities of metals with the design freedom, weight reduction and cost advantages of therm.. |
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Thermal Conductivity | <= 1.00 W/m-K | <= 6.94 BTU-in/hr-ft²-°F | |
MarkeTech MC-LD and MC-MD Ultra High Temperature Machinable Ceramics For very high temperatures or where thermal conductivity or thermal shock is important, these machinable alkaline/alkaline earth zirconium phosphate ceramics (NaZr2P3O12 or BaZr4P6O24) are recommend.. |
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Thermal Conductivity | 1.00 W/m-K | 6.94 BTU-in/hr-ft²-°F | HOT-DISK || 60x60x3 mm |
Lehmann & Voss LUVOCOM® 1/CF/20 Polyamide 66, with carbon fiber Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Reduced moment of inertia comp.. |
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Thermal Conductivity | 1.00 W/m-K | 6.94 BTU-in/hr-ft²-°F | |
Schott N-SF5 Glass Information Provided by SCHOTT North America, Inc. |
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Thermal Conductivity | 1.00 W/m-K @Temperature 90.0 °C |
6.94 BTU-in/hr-ft²-°F @Temperature 194 °F |
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Schott Glass 8337B Borosilicate Glass Borosilicate glass for sealing to Kovar metal and tungsten, highly UV-transmitting photomultiplier and UV detectors The heavy metal content for the elements lead, cadmium, mercury, and hexavalent .. |
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Thermal Conductivity | 1.00 W/m-K @Temperature 121 °C |
6.94 BTU-in/hr-ft²-°F @Temperature 250 °F |
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Tra-Con Tra-Bond 933-1 Moisture Resistant Chip Encapsulant TRA-BOND 933-1 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical.. |
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Thermal Conductivity | 1.00 W/m-K | 6.94 BTU-in/hr-ft²-°F | through plane; ASTM E1461 |
DSM Stanyl® TC153 PA46 FR(17) Thermal conductive material, Flame Retardant, Heat Stabilized |
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Thermal Conductivity | 1.00 W/m-K | 6.94 BTU-in/hr-ft²-°F | through plane; ASTM E1461 |
DSM Stanyl® TC155 PA46 FR(17) Thermal conductive material, Flame Retardant, Heat Stabilized |
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Thermal Conductivity | 1.00 W/m-K | 6.94 BTU-in/hr-ft²-°F | ASTM E1530 |
Eurostar Starflam RF0023E PA66/6, 10% Glass Filled, Injection Molded Starflam RF0023E is a Mineral Flame Retardant, Halogen Free and Phosphorous Free, Glass Fiber Reinforced, Polyamide 66/6 Injection Molding (also known as RF1002Z230EM)Information provided by Polymer.. |
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Thermal Conductivity | 1.00 W/m-K @Temperature 100 °C |
6.94 BTU-in/hr-ft²-°F @Temperature 212 °F |
Silicone Property; ASTM E 1530 |
Arlon Thermabond® 99A30N008 0.008" (0.203 mm) Uncured Silicone Rubber with PTFE Coated Fiberglass Carrier Description: Primerless Thermabond®: Electrically insulating, thermally conductive, electronic adhesive. Bonds without primer.Design/Construction: Liner: FEPProduct: Uncured Silicone Rubber Carrier.. |
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Thermal Conductivity | 1.00 W/m-K @Temperature 100 °C |
6.94 BTU-in/hr-ft²-°F @Temperature 212 °F |
Silicone Property; ASTM E1530 |
Arlon Thermabond® R37260N008 0.008" Uncured Silicone Rubber on Fiberglass Carrier Primerless Thermabond®: Electrically insulating, thermally conductive, electronic adhesive. Bonds without primer.Design/Construction:Liner: 1 mil FEPProduct: Uncured Silicone RubberCarrier: 3 m.. |
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Thermal Conductivity | 1.00 W/m-K | 6.94 BTU-in/hr-ft²-°F | |
Atom Adhesives AA-BOND 2153 Epoxy Adhesive AA-BOND 2153 is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits.. |
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Thermal Conductivity | 1.00 W/m-K @Pressure 2.07 MPa |
6.94 BTU-in/hr-ft²-°F @Pressure 300 psi |
ASTM D5470 |
Parker Chomerics CHO-SEAL® 6502 Conductive Elastomer Description: Highest performance in harsh environments; excellent shielding; best choice for corrosion requirements against aluminum.Molded and ExtrudedRoHS CompliantInformation provided by Chomeric.. |
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Thermal Conductivity | 1.00 W/m-K | 6.94 BTU-in/hr-ft²-°F | |
Resinlab® EP1285HD-14 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C.. |
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Thermal Conductivity | 1.00 W/m-K | 6.94 BTU-in/hr-ft²-°F | DIN 52612 |
BASF Ultramid® B3UGM210 GR 22866 10/50% Glass/Mineral Filled PA6 FR (Dry) Description: Halogen- and phosphorus-free injection-molding grade with very high rigidity, low smoke density and outstanding electrical properties.Information provided by BASF |