Polymer Property : Thermal Conductivity = 5.55 BTU-in/hr-ft²-°F Product List

Thermal Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.

Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.800 W/m-K @Temperature 13.0 °C	5.55 BTU-in/hr-ft²-°F @Temperature 55.4 °F
Pyrotek Dense Fused Silica Pre-Cast Shapes Pyrocast Dense Fused Silica is an economical product for shapes demanding thermal shock resistance at temperatures. Pyrocast DFS stands up to repeated use in molten metal casting in aluminum, coppe..
Thermal Conductivity	0.800 W/m-K @Pressure 2.07 MPa	5.55 BTU-in/hr-ft²-°F @Pressure 300 psi	ASTM D5470
Parker Chomerics CHO-SEAL L6303 Conductive Elastomer Good performance in moderately corrosive environments; material of choice for flange finishes needing “bite-through” for good electrical contact.Molded and ExtrudedRoHS CompliantInformation provid..
Thermal Conductivity	0.800 W/m-K @Pressure 2.07 MPa	5.55 BTU-in/hr-ft²-°F @Pressure 300 psi	ASTM D5470
Parker Chomerics CHO-SEAL S6305 Conductive Elastomer Good performance in moderately corrosive environments; material of choice for flange finishes needing “bite-through” for good electrical contact.Molded and Extruded.RoHS CompliantInformation provi..
Thermal Conductivity	0.800 W/m-K @Pressure 2.07 MPa	5.55 BTU-in/hr-ft²-°F @Pressure 300 psi	ASTM D5470
Parker Chomerics CHO-SEAL® 1270 Conductive Elastomer Description: Material of choice for high-end commercial applications; superior performance, in non-corrosive environments; tear trim compression and injection molding. A low durometer hardness elast..
Thermal Conductivity	0.800 W/m-K	5.55 BTU-in/hr-ft²-°F
Cookson Group Plaskon® 1031 Conventional Encapsulant (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A low cost, conventional molding compound recommended for high volume commodity-type packages that house simple linear and discre..
Thermal Conductivity	0.800 W/m-K	5.55 BTU-in/hr-ft²-°F	DIN 52 612
3M Dyneon™ TF 4303 PTFE 15% Graphite Filled (discontinued **) Type II PTFE. Applications include sliding surfaces, bearings, seals/gaskets.Data provided by Dyneon.
Thermal Conductivity	0.800 W/m-K	5.55 BTU-in/hr-ftÂ²-Â°F
Lord Adhesives Thermosetâ„¢ ME-542 Underfill Encapsulant LORD Thermosetâ„¢ ME-542 encapsulant is an anhydridefree, thermally conductive, semiconductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip ch..
Thermal Conductivity	0.800 W/m-K	5.55 BTU-in/hr-ftÂ²-Â°F	Hot Disc Transient Method
Lord Adhesives Thermosetâ„¢ SC-303 Silicone Encapsulant, Flame Retardant Lord SC-303 is a two component silicone elastomer that provides excellent thermal conductivity, while retaining the other desirable properties associated with silicones. It is a low viscosity, easil..
Thermal Conductivity	0.800 W/m-K	5.55 BTU-in/hr-ftÂ²-Â°F
Schott N-SF66 Glass Information Provided by SCHOTT North America, Inc.
Thermal Conductivity	0.800 W/m-K	5.55 BTU-in/hr-ftÂ²-Â°F
Schott N-LAF33 Glass Information Provided by SCHOTT North America, Inc.
Thermal Conductivity	0.800 W/m-K	5.55 BTU-in/hr-ftÂ²-Â°F
Schott N-LAF35 Glass Information Provided by SCHOTT North America, Inc.
Thermal Conductivity	0.800 W/m-K	5.55 BTU-in/hr-ft²-°F
Tra-Con Tra-Bond 872-7TN1 Flexible Thixotropic Epoxy Adhesive TRA-BOND 872-7TN1 is a flexible thixotropic epoxy. The high viscosity and long worklife make this material easy to handle. Also, the high thermal conductivity makes this product ideal for electronic..
Thermal Conductivity	0.800 W/m-K	5.55 BTU-in/hr-ft²-°F
Loctite® Output™ 315 Acrylic Adhesive Thermally Conductive BondersLoctite® Thermally Conductive Adhesives eliminate the need for mechanical fasteners and clips, while providing the most efficient thermal transfer between transistors or..
Thermal Conductivity	0.800 W/m-K	5.55 BTU-in/hr-ft²-°F
Dow Corning SC 102 White, non-flowing, highly filled compound, good thermal conductivity.Information provided by Dow Corning
Thermal Conductivity	0.800 W/m-K	5.55 BTU-in/hr-ft²-°F	through plane; ASTM E1461
DSM Arnite® AV2 370 XL-T PET-GF35 35% Glass Reinforced, Low Outgassing, Thermal conductive material
Thermal Conductivity	0.800 W/m-K	5.55 BTU-in/hr-ft²-°F	Silicone Property; ASTM E 1530
Arlon Thermabond® T20 (99710W008) 0.008" (0.203 mm) Uncured Silicone Rubber with PTFE Coated Fiberglass Carrier Description: 8 mil thick Thermabond® T20 electrically insulating electronic adhesive.Design/Construction: Liner: FEP Product: Uncured Silicone Rubber Carrier: PTFE Coated FiberglassRecommended Prim..
Thermal Conductivity	0.800 W/m-K	5.55 BTU-in/hr-ft²-°F	Silicone Property; ASTM E 1530
Arlon Thermabond® T20 (99710W015) 0.015" (0.381 mm) Uncured Silicone Rubber with PTFE Coated Fiberglass Carrier Description: 15 mil thick Thermabond® T20 electrically insulating electronic adhesive.Design/Construction: Liner: FEP Product: Uncured Silicone Rubber Carrier: PTFE Coated FiberglassRecommended Pri..
Thermal Conductivity	0.800 W/m-K	5.55 BTU-in/hr-ft²-°F	Silicone Property; ASTM E 1530
Arlon Thermabond® T-20 NP (99770W008) 0.008" (0.203 mm) Uncured Silicone Rubber with PTFE Coated Fiberglass Carrier Description: 8 mil Primerless Thermabond®. T-20 NP. Thermally conductive, electrically insulating electronic adhesive. Bonds with primer.Design/Construction: Liner: FEP Product: Uncured Silicone Ru..
Thermal Conductivity	0.800 W/m-K	5.55 BTU-in/hr-ft²-°F	Silicone Property; ASTM E 1530
Arlon Thermabond® T-20 NP (99770W015) 0.015" (0.381 mm) Uncured Silicone Rubber with PTFE Coated Fiberglass Carrier Description: 15 mil Primerless Thermabond®. T-20 NP. Thermally conductive, electrically insulating electronic adhesive. Bonds with primer.Design/Construction:Liner: FEPProduct: Uncured Silicone Rub..
Thermal Conductivity	0.800 W/m-K	5.55 BTU-in/hr-ft²-°F	in perpendicular (002) direction
Momentive Performance Materials HOPG Graphite Monochromator Advanced Ceramics' graphite monochromators are highly oriented forms of high purity pyrolytic graphite which diffract x-rays and neutrons with greater efficiency than any other material. In x-r..