Thermal Properties | Metric | English | Comments |
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Thermal Conductivity | 0.623 W/m-K | 4.32 BTU-in/hr-ft²-°F | |
Abatron AboCast 8708-10 One-Component Structural/Dielectric Epoxy AboCast 8708-10 is a highly filled, class H (180°C) structural, castable adhesive compound for FAST high-temperature curing. Suggested Uses: Structural bonding; Casting; Potting; Encapsulating; Em.. |
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Thermal Conductivity | 0.623 W/m-K | 4.32 BTU-in/hr-ft²-°F | |
Abatron AboCast 8708-6 One-Component Structural/Dielectric Epoxy AboCast 8708-6 is a highly filled, class H (180°C) structural, castable adhesive compound for SLOW high-temperature curing. Suggested Uses: Structural bonding; Casting; Potting; Encapsulating; Emb.. |
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Thermal Conductivity | 0.623 W/m-K | 4.32 BTU-in/hr-ft²-°F | |
Abatron AboCast 8708-9 One-Component Structural/Dielectric Epoxy AboCast 8708-9 is a highly filled, class H (180°C) structural, castable adhesive compound for FASTER high-temperature curing. Suggested Uses: Structural bonding; Casting; Potting; Encapsulating; E.. |