Thermal Properties | Metric | English | Comments |
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Thermal Conductivity | 0.600 W/m-K @Temperature 80.0 °C |
4.16 BTU-in/hr-ft²-°F @Temperature 176 °F |
Z Direction; ASTM C518 |
Rogers Corporation RO4450B Prepreg Prepreg is commonly used to inexpensively form less critical signal layers in antenna designs. A high post-cure Tg makes RO4400 series prepreg an excellent choice for multi-layers requiring sequent.. |
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Thermal Conductivity | 0.600 W/m-K @Temperature 80.0 °C |
4.16 BTU-in/hr-ft²-°F @Temperature 176 °F |
ASTM C518 |
Rogers Corporation RO4533 Ceramic-Filled, Glass-Reinforced Hydrocarbon Laminate The RO4500™ Series Cost Performance Antenna Grade Laminates are ceramic-filled, glass-reinforced hydrocarbon based materials that provides the controlled dielectric constant, low loss performance a.. |
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Thermal Conductivity | 0.600 W/m-K @Temperature 80.0 °C |
4.16 BTU-in/hr-ft²-°F @Temperature 176 °F |
ASTM C518 |
Rogers Corporation RO4534 Ceramic-Filled, Glass-Reinforced Hydrocarbon Laminate The RO4500™ Series Cost Performance Antenna Grade Laminates are ceramic-filled, glass-reinforced hydrocarbon based materials that provides the controlled dielectric constant, low loss performance a.. |
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Thermal Conductivity | 0.600 W/m-K @Temperature 80.0 °C |
4.16 BTU-in/hr-ft²-°F @Temperature 176 °F |
ASTM C518 |
Rogers Corporation RT/duroid® 6002 High Frequency Laminate Features:Low loss for excellent high frequency performanceTight dielectric constant and thickness controlExcellent electrical and mechanical propertiesExtremely low thermal coefficient of dielectric.. |
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Thermal Conductivity | 0.600 - 0.800 W/m-K | 4.16 - 5.55 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group 3505 Epoxy Glass-fiber reinforced epoxy molding compound. Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures. This product meets the allowed.. |
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Thermal Conductivity | 0.600 - 0.800 W/m-K | 4.16 - 5.55 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group 3535 Epoxy Glass fiber-reinforced epoxy molding compound. Good mechanical strength, very good electrical isolation properties adn dimensional stability even at high temperatures. Form: Low dust granulate pack.. |
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Thermal Conductivity | 0.600 - 0.700 W/m-K | 4.16 - 4.86 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group AMPLA® 2000 melamine-modified polyester Halogen-free, organically and inorganically filled melamine-modified Polyester molding compound. Low post-shrinkage, very good electrical values, high heat resistance, very good sliding behavior, ve.. |
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Thermal Conductivity | 0.600 - 0.700 W/m-K | 4.16 - 4.86 BTU-in/hr-ft²-°F | ASTM E1461 |
Raschig Group AMPLA® 2500 melamine-modified polyester Halogen-free, organically and inorganically filled melamine-modified Polyester molding compound. Excellent elasticity and shock resistance, low post-shrinkage, very good electrical values, high heat.. |
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Thermal Conductivity | 0.600 W/m-K | 4.16 BTU-in/hr-ft²-°F | ISO 8302 |
Solvay Specialty Polymers Primef® 7010 Polyphenylene Sulfide (PPS), 65% GlassMineral
(discontinued **) Primef 7010 is a 65% mineral/glass fiber reinforced polyphenylene sulfide (PPS). This grade offers improved mechanical properties versus Primef 7002 (also 65% mineral/glass fiber), but with less flu.. |
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Thermal Conductivity | 0.600 W/m-K @Pressure 2.07 MPa |
4.16 BTU-in/hr-ft²-°F @Pressure 300 psi |
ASTM D5470 |
Parker Chomerics CHO-SEAL® 6307 Conductive Elastomer Description: Good performance in moderately corrosive environments; excellent NBC fluid resistance; good physical properties.Molded onlyRoHS CompliantInformation provided by Chomerics |
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Thermal Conductivity | 0.600 W/m-K | 4.16 BTU-in/hr-ft²-°F | |
Cookson Group Plaskon® PPF-165A Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A conventional molding compound specifically formulated for semiconductor devices which are molded with preplated leadframes. Lo.. |
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Thermal Conductivity | 0.600 W/m-K | 4.16 BTU-in/hr-ft²-°F | DIN 52 612 |
3M Dyneon™ TF 4220 PTFE 2% Cond. Pigm. Filled
(discontinued **) Applications include antistat linings, seals, gaskets, moldings.Data provided by Dyneon. |
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Thermal Conductivity | 0.600 W/m-K | 4.16 BTU-in/hr-ft²-°F | DIN 52612 |
Lehmann & Voss LUVOCOM® 1105-7766 PEEK, with carbon fiber, easy flowing Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.High-strength and high-stiff parts; low coefficient of expansion.Dynamic stressed parts at.. |
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Thermal Conductivity | 0.600 W/m-K | 4.16 BTU-in/hr-ft²-°F | HOT-DISK || 60x60x3 mm |
Lehmann & Voss LUVOCOM® 80-7626 Polyacetal-copolymer, with carbon fiber Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.Electrically conductive, suitable for continuous discharging of statically generated electricit.. |
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Thermal Conductivity | 0.600 W/m-K | 4.16 BTU-in/hr-ft²-°F | DIN 52612 |
Lehmann & Voss LUVOCOM® 1114-0717 PAEK, with carbon fiber and PTFE Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Good friction and wear behaviour especially at increased temperatures.Electrically conduct.. |
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Thermal Conductivity | 0.600 W/m-K | 4.16 BTU-in/hr-ft²-°F | DIN 52612 |
Lehmann & Voss LUVOCOM® 1-0890 Polyamide 66, with carbon fiber, low-warpage, heat stabilized Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.Stiff parts, low coefficient of expansion, low viscose, anisotropic.Reduced moment of inertia c.. |
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Thermal Conductivity | 0.600 W/m-K | 4.16 BTU-in/hr-ft²-°F | ASTM C-518 |
Sumitomo Bakelite North America E 8353-706R-1 Hardware Grade Epoxy Fiberglass and mineral reinforced epoxy molding compound with excellent dimensional stability and good strength at elevated temperatures.Information provided by Vyncolit, a Sumitomo Bak Group |
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Thermal Conductivity | 0.600 W/m-K | 4.16 BTU-in/hr-ft²-°F | ASTM F433 |
Sumitomo Bakelite North America RX® 630 Fiberglass Reinforced Phenolic RX 630 is a fiberglass reinforced phenolic molding compound, with good dimensional stability and good strength at elevated temperatures. Information supplied by Sumitomo Bak North America. |
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Thermal Conductivity | 0.600 W/m-K @Temperature 800 °C |
4.16 BTU-in/hr-ft²-°F @Temperature 1470 °F |
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Zircar Refractory Composites RS-Cloth Refractory Sheet Refractory Sheet RS-Cloth is ceramic fiber reinforced alumina composite. It offers the strength, durability, flexibility and versatility required by many high temperature applications up to 1300°C(.. |
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Thermal Conductivity | 0.600 W/m-K @Temperature 800 °C |
4.16 BTU-in/hr-ft²-°F @Temperature 1470 °F |
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Zircar Refractory Composites RS-Tape Refractory Sheet Refractory Sheet RS-Tape is ceramic fiber reinforced alumina composite. It offers the strength, durability, flexibility and versatility required by many high temperature applications up to 1300°C(2.. |
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Thermal Conductivity | 0.600 W/m-K | 4.16 BTU-in/hr-ft²-°F | |
Trelleborg Emerson & Cuming Stycast® G-508-1 One-Component Epoxy Flame Retardant Encapsulant Features and Typical ApplicationsProvide flame resistance down to 1/8 of an inch. These products also offer various other features such as thermal shock protection, low viscosity, and thermal conduc.. |
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Thermal Conductivity | 0.600 W/m-K @Pressure 2.07 MPa |
4.16 BTU-in/hr-ft²-°F @Pressure 300 psi |
ASTM D5470 |
Parker Chomerics CHO-SEAL® S6600 Conductive Elastomer Description: Low-end shielding and ESD protection; high tensile strength; no corrosion or fluid resistance.Molded onlyRoHS CompliantInformation provided by Chomerics |
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Thermal Conductivity | 0.600 W/m-K | 4.16 BTU-in/hr-ft²-°F | ASTM C177 |
Solvay Specialty Polymers Algoflon® 25CAR B PTFE; Carbon Filled
(discontinued **) Data provided by the manufacturer.25 wt.% Electrog. Carbon. Suspension polymer powder grade recommended for compression molding. Pure PTFE possesses high inertness, excellent dielectric properties, .. |
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Thermal Conductivity | 0.600 W/m-K | 4.16 BTU-in/hr-ft²-°F | |
Trelleborg Emerson & Cuming Stycast® 2651MM/11 Two-Component General Purpose Encapsulant Features and Typical Applications: Designed as general purpose encapsulants, these products offer a wide range of features including thermal conductivity, mechanical shock and impact resistance, as .. |
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Thermal Conductivity | 0.600 W/m-K | 4.16 BTU-in/hr-ft²-°F | |
Chevron Phillips Ryton® R-7 02 Polyphenylene Sulfide Compound
(discontinued **) Black Polyphenylene Sulfide CompoundRyton® R-7 02 is polyphenylene sulfide compounded with glass fibers and mineral fibers to produce an injection moldable high temperature engineering compound wit.. |
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Thermal Conductivity | 0.600 W/m-K | 4.16 BTU-in/hr-ft²-°F | |
Loctite® Output™ 383 Acrylic Adhesive Acrylic Bonding Adhesives and Thermally Conductive BondersLoctite® Acrylic Adhesives were developed for bonding applications that require tensile, shear and peel strength combined with maximum impa.. |