Polymer Property : Thermal Conductivity = 3.40 BTU-in/hr-ft²-°F Product List

Thermal Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.

Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.490 W/m-K @Temperature 80.0 °C	3.40 BTU-in/hr-ft²-°F @Temperature 176 °F	ASTM C518
Rogers Corporation RT/duroid® 6006 Ceramic-PTFE Composite Microwave Laminate Features:High dielectric constant for circuit size reductionLow loss - Ideal for operating at X-band or belowTight dielectric constant and thickness control for repeatable circuit performanceLow moi..
Thermal Conductivity	0.490 W/m-K	3.40 BTU-in/hr-ftÂ²-Â°F	DIN 52612
Lehmann & Voss LUVOCOMÂ® 1106-7227 Polyether imide, with carbon fiber and PTFE Applications: High-strength and high-stiff parts; low coefficient of expansion.High continuous use and heat distortion temperature. Non flammable.Dynamic stressed parts at high movement velocity.Hig..
Thermal Conductivity	0.490 W/m-K @Temperature 100 °C	3.40 BTU-in/hr-ft²-°F @Temperature 212 °F	ASTM E1461
Plenco 4599 Phenolic, Granular, Injection Molded PLENCO 04599 is a mineral filled, phenolic molding compound offering excellent heat resistance and dimensional stability, typically required for automotive ashtray applications. 04599 is formulated ..
Thermal Conductivity	0.490 W/m-K	3.40 BTU-in/hr-ft²-°F	ASTM E1461
Vyncolit Neopreg Kinel® SK80 L8G Glass Fiber Reinforced Molding Compound Epoxy based molding compound long glass fiber reinforced with excellent long term property retention over a wide temperature range and climate conditions. It is particularly suited for over mold..
Thermal Conductivity	0.490 W/m-K @Temperature 100 °C	3.40 BTU-in/hr-ft²-°F @Temperature 212 °F	ASTM E1461
Plenco 4311 Phenolic, Granular, Injection Molded PLENCO 04311 is a heat resistant, mineral filled phenolic molding compound offering excellent processability, mechanical strength, and improved cold powder pourability characteristics. UL recognized..
Thermal Conductivity	0.490 W/m-K @Temperature 40.0 °C	3.40 BTU-in/hr-ft²-°F @Temperature 104 °F	ISO 8302
Ensinger TECASINT™ 2022 Polyimide, Black, 15% Graphite (PI) TECASINT™ 2000 series of polyimide stock shapes provide a superior combination of high temperature and bearing and wear, properties that make it an ideal choice for the most demanding applications...
Thermal Conductivity	0.490 W/m-K	3.40 BTU-in/hr-ft²-°F
3M Scotch-Weld™ 2158 B/A Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive 2158 B/A is a gray, two-part, high strength adhesive that chemically cures at room temperature. It has good adhesion to a variety of substrates including metals, ma..
Thermal Conductivity	0.490 - 0.530 W/m-K @Temperature 40.0 - 40.0 °C	3.40 - 3.68 BTU-in/hr-ft²-°F @Temperature 104 - 104 °F	Average value: 0.510 W/m-K Grade Count:2
Overview of materials for Polyimide, Graphite Filled This property data is a summary of similar materials in the MatWeb database for the category "Polyimide, Graphite Filled". Each property range of values reported is minimum and maximum values of app..