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Polymer Property : Thermal Conductivity = 3.19 BTU-in/hr-ft²-°F Product List

Thermal Properties

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Thermal Properties Metric English Comments
Thermal Conductivity 0.460 W/m-K
3.19 BTU-in/hr-ft²-°F
ASTM E1461-92
Park Electrochemical Nelco® N4000-29 BC® Buried Capacitance™ Multifunctional Epoxy
The Nelco N4000-29 is a lead-free, low-CTE, high Tg multifunctional epoxy substrate which has been designed for use in standard multilayer PWB designs and today’s toughest, high-performance, lead-f..
Thermal Conductivity 0.460 W/m-K
3.19 BTU-in/hr-ft²-°F
Micropol Isoplas P501 Crosslinkable Polyethylene
Information provided by Micropol Limited
Thermal Conductivity 0.460 W/m-K
3.19 BTU-in/hr-ft²-°F
Micropol Isoplas P651 Crosslinkable Polyethylene
Information provided by Micropol Limited
Thermal Conductivity 0.460 - 0.480 W/m-K
3.19 - 3.33 BTU-in/hr-ft²-°F
ASTM C177
Solvay Specialty Polymers Polidan® S/I 20 Polyethylene, Crosslinked (XLPE)
POLIDAN® S/I 20 is a silane crosslinkable PE compound which is used together with a catalyst masterbatch to accelerate the crosslinking reaction. It is used for injection molding.Features: Crossl..
Thermal Conductivity 0.460 - 0.480 W/m-K
3.19 - 3.33 BTU-in/hr-ft²-°F
ASTM C177
Solvay Specialty Polymers Polidan® T/A-LV Polyethylene, Crosslinked (XLPE)
POLIDAN® T/A-LV is a silane crosslinkable PE compound which is used together with a catalyst masterbatch to accelerate the crosslinking reaction. It is used for flexible crosslinkable pipes.Featu..
Thermal Conductivity 0.460 W/m-K

@Temperature 100 °C
3.19 BTU-in/hr-ft²-°F

@Temperature 212 °F
ASTM E1461
Plenco 7507 Phenolic, Granular, Injection Molded
PLENCO 07507 is an organic reinforced phenolic molding compound offering improved dimensional stability under humid conditions. 07507 offers excellent resistance to degradation from detergent solut..
Thermal Conductivity 0.460 W/m-K
3.19 BTU-in/hr-ft²-°F
of solid
DuPont Performance Polymers Zytel® FG70G50HSLA BK309 Nylon 66  (Unverified Data**)
50% Glass Reinforced Heat Stabilized Polyamide 66 with Developed for Food Contact Applications Information provided by DuPont Performance Polymers
Thermal Conductivity 0.460 W/m-K

@Temperature 100 °C
3.19 BTU-in/hr-ft²-°F

@Temperature 212 °F
ASTM E1225
Arlon AD600 PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards
Ceramic Filled High Dielectric ConstantMechanically Robust; replaces brittle laminates that cannot withstand processing, impact or High G forcesLarge Panel SizesHigh Peel Strength for Narrow LinesBe..
Thermal Conductivity 0.460 W/m-K
3.19 BTU-in/hr-ft²-°F
Arlon AD410 Glass, PTFE and Micro-Dispersed Ceramic
High Dielectric Constant for Circuit Militarization & Patch Antenna ApplicationsInformation provided by Arlon Materials for Electronics (MED).
Thermal Conductivity 0.460 W/m-K
3.19 BTU-in/hr-ft²-°F
Arlon AD430 Glass, PTFE and Micro-Dispersed Ceramic
High Dielectric Constant for Circuit Militarization & Patch Antenna ApplicationsInformation provided by Arlon Materials for Electronics (MED).
Thermal Conductivity 0.460 W/m-K
3.19 BTU-in/hr-ft²-°F
ASTM E1461-92
Park Electrochemical Nelco® N4000-29 Multifunctional Epoxy
The Nelco N4000-29 is an advanced, lead-free, low-CTE, high Tg (185º C by DSC) multifunctional epoxy dielectric substrate. This material has been designed for use not only in standard multilayer PW..
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