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Polymer Property : Thermal Conductivity = 22.0 BTU-in/hr-ft²-°F Product List

Thermal Properties

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Thermal Properties Metric English Comments
Thermal Conductivity 3.17 - 3.60 W/m-K
22.0 - 25.0 BTU-in/hr-ft²-°F
Master Bond EP112FLAN-1 Two Component Flexibilized Heat Curing Epoxy
Master Bond EP112FLAN-1 is a toughened two component, high performance epoxy resin system featuring good temperature resistance, high thermal conductivity, fine electrical insulation values and soun..
Thermal Conductivity 3.17 - 3.46 W/m-K
22.0 - 24.0 BTU-in/hr-ft²-°F
Master Bond EP21ANHT Two Component, Room Temperature Curing Epoxy Adhesive
Product Description: Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that combines high thermal conductivity and electrical insulation ..
Thermal Conductivity 3.17 - 3.60 W/m-K
22.0 - 25.0 BTU-in/hr-ft²-°F
Master Bond EP30ANHT Two Part, Electrically Isolating Epoxy Adhesive
Description: Master Bond Polymer System EP30ANHT is a two part epoxy system with terrific thermal conductivity, while maintaining electrical insulation. One noteworthy property is its wide service t..
Thermal Conductivity 3.17 - 3.46 W/m-K
22.0 - 24.0 BTU-in/hr-ft²-°F
Master Bond EP37-3FLFAN Electrically Isolating, Flexible Epoxy
Description: Master Bond Polymer System EP37-3FLFAN is a two component system for high performance potting, bonding, sealing and coating that is formulated to cure at room temperature or more rapidl..
Thermal Conductivity 3.17 - 3.46 W/m-K
22.0 - 24.0 BTU-in/hr-ft²-°F
Master Bond Supreme 11ANHT Fast Curing Epoxy Paste System
Description: Master Bond Polymer System SUPREME 11ANHT is a two component epoxy resin system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevat..
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