Thermal Properties | Metric | English | Comments |
---|---|---|---|
Thermal Conductivity | 3.17 - 3.60 W/m-K | 22.0 - 25.0 BTU-in/hr-ft²-°F | |
Master Bond EP112FLAN-1 Two Component Flexibilized Heat Curing Epoxy Master Bond EP112FLAN-1 is a toughened two component, high performance epoxy resin system featuring good temperature resistance, high thermal conductivity, fine electrical insulation values and soun.. |
|||
Thermal Conductivity | 3.17 - 3.46 W/m-K | 22.0 - 24.0 BTU-in/hr-ft²-°F | |
Master Bond EP21ANHT Two Component, Room Temperature Curing Epoxy Adhesive Product Description: Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that combines high thermal conductivity and electrical insulation .. |
|||
Thermal Conductivity | 3.17 - 3.60 W/m-K | 22.0 - 25.0 BTU-in/hr-ft²-°F | |
Master Bond EP30ANHT Two Part, Electrically Isolating Epoxy Adhesive Description: Master Bond Polymer System EP30ANHT is a two part epoxy system with terrific thermal conductivity, while maintaining electrical insulation. One noteworthy property is its wide service t.. |
|||
Thermal Conductivity | 3.17 - 3.46 W/m-K | 22.0 - 24.0 BTU-in/hr-ft²-°F | |
Master Bond EP37-3FLFAN Electrically Isolating, Flexible Epoxy Description: Master Bond Polymer System EP37-3FLFAN is a two component system for high performance potting, bonding, sealing and coating that is formulated to cure at room temperature or more rapidl.. |
|||
Thermal Conductivity | 3.17 - 3.46 W/m-K | 22.0 - 24.0 BTU-in/hr-ft²-°F | |
Master Bond Supreme 11ANHT Fast Curing Epoxy Paste System Description: Master Bond Polymer System SUPREME 11ANHT is a two component epoxy resin system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevat.. |