Thermal Properties | Metric | English | Comments |
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Thermal Conductivity | 0.430 W/m-K @Temperature 500 °C |
2.98 BTU-in/hr-ft²-°F @Temperature 932 °F |
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Pyrotek RFM Light density refractory composite material The RFM material is a composite made of fiberglass fabric and a wollastonite slurry. It can be shaped to very complex and thin parts. It has a very good behavior against molten aluminum alloys.App.. |
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Thermal Conductivity | 0.430 W/m-K @Temperature 750 °C |
2.98 BTU-in/hr-ft²-°F @Temperature 1380 °F |
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Pyrotek RFM™ Autopour Ladle Light density refractory composite material ApplicationsHigh pressure die casting Gravity die casting Sand casting AdvantagesLight weight No pre-heating required Low thermal heat sink Excellent mechanical properties Excellent resistance to er.. |
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Thermal Conductivity | 0.429 W/m-K | 2.98 BTU-in/hr-ft²-°F | ASTM F433 |
Quadrant EPP Ketron® CM GF30 Compression Molded, 30% Glass Reinforces Polyethererther Ketone(ASTM Product Data Sheet) |
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Thermal Conductivity | 0.429 W/m-K | 2.98 BTU-in/hr-ft²-°F | ASTM F433 |
Quadrant EPP Ketron® GF30 PEEK, Extruded 30% Glass-Reinforced Polyetherether Ketone (ASTM Product Data Sheet) |
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Thermal Conductivity | 0.429 W/m-K | 2.98 BTU-in/hr-ft²-°F | ASTM C177 |
Quantum PEEK 30% Glass Fiber Filled Information provided by Quantum Advanced Engineering Plastics |
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Thermal Conductivity | 0.429 W/m-K | 2.98 BTU-in/hr-ft²-°F | |
Quadrant EPP Ketron® GF30 LSG PEEK, Extruded 30% Glass-Reinforced Polyetherether Ketone (ASTM Product Data Sheet) |
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Thermal Conductivity | 0.430 W/m-K | 2.98 BTU-in/hr-ft²-°F | Through Plane; ASTM E1461 |
Victrex® APTIV® 1102-050M Polyetheretherketone (PEEK) Polymer Film, Semi-Crystalline, 20% Mineral Filled APTIV PEEK 1100 series films are the mineral filled semi-crystalline films made from VICTREX® PEEK polymer. The film provides a material solution for engineers in ultra-high performance application.. |
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Thermal Conductivity | 0.430 W/m-K | 2.98 BTU-in/hr-ft²-°F | DIN 52612 |
Lehmann & Voss LUVOCOM® 1-RG 1 Polyamide 66, with PAN-carbon fiber, RG-standard Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Reduced moment of inertia comp.. |
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Thermal Conductivity | 0.430 W/m-K | 2.98 BTU-in/hr-ft²-°F | DIN 52612 |
Lehmann & Voss LUVOCOM® TPI-0953 Thermoplastic polyimide, with carbon fiber, PTFE, lubricant modified Applications: Automotive industry, textile machinery, apparatus- and precision engineering medical- and electrical enineering, aircraft- and aerospace industry.Very high continuous use and heat dist.. |
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Thermal Conductivity | 0.430 W/m-K | 2.98 BTU-in/hr-ft²-°F | DIN 52612 |
LG Chemical LUTENE-H BE0350 HDPE Description: LUTENE-H BE0350 is an excellent material for blow-molded articles with high density and rigidity. It has good flow characteristics, high parison stability and impact resistance.Applicat.. |
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Thermal Conductivity | 0.430 W/m-K | 2.98 BTU-in/hr-ft²-°F | DIN 52612 |
Isoflon PEHD 500 High Density Polyethylene Products with excellent friction, anti-stick, abrasion and chemical inertia characteristicsVery good impact resistanceNo moisture regainProduct for the food industryInformation provided by Isoflon. |
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Thermal Conductivity | 0.430 W/m-K | 2.98 BTU-in/hr-ft²-°F | DIN 52612 |
Lehmann & Voss LUVOCOM® 1/CF/20/HS Polyamide 66, with carbon fiber, heat stabilized Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Reduced moment of inertia comp.. |
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Thermal Conductivity | 0.430 W/m-K | 2.98 BTU-in/hr-ft²-°F | DIN 52612 |
Lehmann & Voss LUVOCOM® 1/CF/20/TF/5 Polyamide 66, with carbon fiber and PTFE, heat stabilized Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Improved friction and wear beh.. |
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Thermal Conductivity | 0.430 W/m-K | 2.98 BTU-in/hr-ft²-°F | DIN 52612 |
GEHR Plastics PEEK-30GF Polyetheretherketone, 30% Glass Fiber Polyether etherketone can be used at very high temperatures and it shows a good mechanical strength, toughness, hardness, flexural strength, and torsional strength. PEEK exhibits excellent chemical .. |
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Thermal Conductivity | 0.430 W/m-K | 2.98 BTU-in/hr-ft²-°F | DIN 52612 |
Isoflon PEHD 300 High Density Polyethylene Products with excellent friction, anti-stick, abrasion and chemical inertia characteristicsVery good impact resistanceNo moisture regainProduct for the food industryInformation provided by Isoflon. |
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Thermal Conductivity | 0.430 W/m-K | 2.98 BTU-in/hr-ft²-°F | ISO 8302 |
SABIC Innovative Plastics ULTEM 4000 PEI (Europe-Africa-Middle East) Glass fiber, PTFE, and Graphite filled, standard flow Polyetherimide (Tg 217C). Resin is RoHS compliant. UL94 V0 listing. |
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Thermal Conductivity | 0.430 W/m-K @Temperature 121 °C |
2.98 BTU-in/hr-ft²-°F @Temperature 250 °F |
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Tra-Con Tra-Bond Ablebond 481-20 B-Stageable Epoxy Adhesive Ablebond 481-20 flexible epoxy adhesive is a modification of Ablebond 481-19 adhesive. This adhesive is designed to absorb stresses between adherends with mismatched coefficients of thermal expansio.. |
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Thermal Conductivity | 0.430 W/m-K | 2.98 BTU-in/hr-ft²-°F | |
Epoxy Technology EPO-TEK® T7139 Glob Top Epoxy Product Description: EPO-TEK® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.Advantages & Application N.. |
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Thermal Conductivity | 0.430 W/m-K | 2.98 BTU-in/hr-ft²-°F | |
CENTROPLAST CENTROMID 6.6 CF 20 Polyamide 6.6 carbon fiber This material has very high strength and a high operating temperature. It can be used for precision components, drive parts and housings.Information provided by CENTROPLAST Engineering Plastics GMB.. |
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Thermal Conductivity | 0.429 W/m-K | 2.98 BTU-in/hr-ft²-°F | |
3M Scotch-Weld™ 2214 Hi-Temp New Formula Epoxy Adhesive 3M™ Scotch-Weld™ Adhesive 2214 Hi-Temp Formula is an aluminum filled, deaerated products fro use where higher strengths are required between 82-177°C. One part 250°F (121°C) curing 100% solids,.. |
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Thermal Conductivity | 0.429 W/m-K | 2.98 BTU-in/hr-ft²-°F | |
3M Scotch-Weld™ EC-2086 Structural Adhesive 3M™ Scotch-Weld™ Structural Adhesive EC-2086 is a one-part, 100% solids thermosetting liquid adhesives.Information provided by 3M |
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Thermal Conductivity | 0.430 W/m-K | 2.98 BTU-in/hr-ft²-°F | |
Quadrant EPP Ketron® GF30 PEEK + glassfibres, extruded (ISO Data) This 30 % glass fibre reinforced grade offers a higher stiffness and creep resistance than Ketron PEEK-1000 and has a much better dimensional stability. This grade is very appropriate for structural.. |
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Thermal Conductivity | 0.430 W/m-K | 2.98 BTU-in/hr-ft²-°F | C518/C177 |
Saint-Gobain Meldin® 2001 Bearing General Notes on Meldin 2000 Series Bearing Products:For High-Temperature, Close-Tolerance Applications. Able to withstand temperatures of 600°F with excursions to 900°F, the Medlin 2000 Series ca.. |