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Polymer Property : Thermal Conductivity = 2.98 BTU-in/hr-ft²-°F Product List

Thermal Properties

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Thermal Properties Metric English Comments
Thermal Conductivity 0.430 W/m-K

@Temperature 500 °C
2.98 BTU-in/hr-ft²-°F

@Temperature 932 °F
Pyrotek RFM Light density refractory composite material
The RFM material is a composite made of fiberglass fabric and a wollastonite slurry. It can be shaped to very complex and thin parts. It has a very good behavior against molten aluminum alloys.App..
Thermal Conductivity 0.430 W/m-K

@Temperature 750 °C
2.98 BTU-in/hr-ft²-°F

@Temperature 1380 °F
Pyrotek RFM™ Autopour Ladle Light density refractory composite material
ApplicationsHigh pressure die casting Gravity die casting Sand casting AdvantagesLight weight No pre-heating required Low thermal heat sink Excellent mechanical properties Excellent resistance to er..
Thermal Conductivity 0.429 W/m-K
2.98 BTU-in/hr-ft²-°F
ASTM F433
Quadrant EPP Ketron® CM GF30 Compression Molded, 30% Glass Reinforces Polyethererther Ketone(ASTM Product Data Sheet)
Thermal Conductivity 0.429 W/m-K
2.98 BTU-in/hr-ft²-°F
ASTM F433
Quadrant EPP Ketron® GF30 PEEK, Extruded 30% Glass-Reinforced Polyetherether Ketone (ASTM Product Data Sheet)
Thermal Conductivity 0.429 W/m-K
2.98 BTU-in/hr-ft²-°F
ASTM C177
Quantum PEEK 30% Glass Fiber Filled
Information provided by Quantum Advanced Engineering Plastics
Thermal Conductivity 0.429 W/m-K
2.98 BTU-in/hr-ft²-°F
Quadrant EPP Ketron® GF30 LSG PEEK, Extruded 30% Glass-Reinforced Polyetherether Ketone (ASTM Product Data Sheet)
Thermal Conductivity 0.430 W/m-K
2.98 BTU-in/hr-ft²-°F
Through Plane; ASTM E1461
Victrex® APTIV® 1102-050M Polyetheretherketone (PEEK) Polymer Film, Semi-Crystalline, 20% Mineral Filled
APTIV PEEK 1100 series films are the mineral filled semi-crystalline films made from VICTREX® PEEK polymer. The film provides a material solution for engineers in ultra-high performance application..
Thermal Conductivity 0.430 W/m-K
2.98 BTU-in/hr-ft²-°F
DIN 52612
Lehmann & Voss LUVOCOM® 1-RG 1 Polyamide 66, with PAN-carbon fiber, RG-standard
Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Reduced moment of inertia comp..
Thermal Conductivity 0.430 W/m-K
2.98 BTU-in/hr-ft²-°F
DIN 52612
Lehmann & Voss LUVOCOM® TPI-0953 Thermoplastic polyimide, with carbon fiber, PTFE, lubricant modified
Applications: Automotive industry, textile machinery, apparatus- and precision engineering medical- and electrical enineering, aircraft- and aerospace industry.Very high continuous use and heat dist..
Thermal Conductivity 0.430 W/m-K
2.98 BTU-in/hr-ft²-°F
DIN 52612
LG Chemical LUTENE-H BE0350 HDPE
Description: LUTENE-H BE0350 is an excellent material for blow-molded articles with high density and rigidity. It has good flow characteristics, high parison stability and impact resistance.Applicat..
Thermal Conductivity 0.430 W/m-K
2.98 BTU-in/hr-ft²-°F
DIN 52612
Isoflon PEHD 500 High Density Polyethylene
Products with excellent friction, anti-stick, abrasion and chemical inertia characteristicsVery good impact resistanceNo moisture regainProduct for the food industryInformation provided by Isoflon.
Thermal Conductivity 0.430 W/m-K
2.98 BTU-in/hr-ft²-°F
DIN 52612
Lehmann & Voss LUVOCOM® 1/CF/20/HS Polyamide 66, with carbon fiber, heat stabilized
Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Reduced moment of inertia comp..
Thermal Conductivity 0.430 W/m-K
2.98 BTU-in/hr-ft²-°F
DIN 52612
Lehmann & Voss LUVOCOM® 1/CF/20/TF/5 Polyamide 66, with carbon fiber and PTFE, heat stabilized
Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Improved friction and wear beh..
Thermal Conductivity 0.430 W/m-K
2.98 BTU-in/hr-ft²-°F
DIN 52612
GEHR Plastics PEEK-30GF Polyetheretherketone, 30% Glass Fiber
Polyether etherketone can be used at very high temperatures and it shows a good mechanical strength, toughness, hardness, flexural strength, and torsional strength. PEEK exhibits excellent chemical ..
Thermal Conductivity 0.430 W/m-K
2.98 BTU-in/hr-ft²-°F
DIN 52612
Isoflon PEHD 300 High Density Polyethylene
Products with excellent friction, anti-stick, abrasion and chemical inertia characteristicsVery good impact resistanceNo moisture regainProduct for the food industryInformation provided by Isoflon.
Thermal Conductivity 0.430 W/m-K
2.98 BTU-in/hr-ft²-°F
ISO 8302
SABIC Innovative Plastics ULTEM 4000 PEI (Europe-Africa-Middle East)
Glass fiber, PTFE, and Graphite filled, standard flow Polyetherimide (Tg 217C). Resin is RoHS compliant. UL94 V0 listing.
Thermal Conductivity 0.430 W/m-K

@Temperature 121 °C
2.98 BTU-in/hr-ft²-°F

@Temperature 250 °F
Tra-Con Tra-Bond Ablebond 481-20 B-Stageable Epoxy Adhesive
Ablebond 481-20 flexible epoxy adhesive is a modification of Ablebond 481-19 adhesive. This adhesive is designed to absorb stresses between adherends with mismatched coefficients of thermal expansio..
Thermal Conductivity 0.430 W/m-K
2.98 BTU-in/hr-ft²-°F
Epoxy Technology EPO-TEK® T7139 Glob Top Epoxy
Product Description: EPO-TEK® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.Advantages & Application N..
Thermal Conductivity 0.430 W/m-K
2.98 BTU-in/hr-ft²-°F
CENTROPLAST CENTROMID 6.6 CF 20 Polyamide 6.6 carbon fiber
This material has very high strength and a high operating temperature. It can be used for precision components, drive parts and housings.Information provided by CENTROPLAST Engineering Plastics GMB..
Thermal Conductivity 0.429 W/m-K
2.98 BTU-in/hr-ft²-°F
3M Scotch-Weld™ 2214 Hi-Temp New Formula Epoxy Adhesive
3M™ Scotch-Weld™ Adhesive 2214 Hi-Temp Formula is an aluminum filled, deaerated products fro use where higher strengths are required between 82-177°C. One part 250°F (121°C) curing 100% solids,..
Thermal Conductivity 0.429 W/m-K
2.98 BTU-in/hr-ft²-°F
3M Scotch-Weld™ EC-2086 Structural Adhesive
3M™ Scotch-Weld™ Structural Adhesive EC-2086 is a one-part, 100% solids thermosetting liquid adhesives.Information provided by 3M
Thermal Conductivity 0.430 W/m-K
2.98 BTU-in/hr-ft²-°F
Quadrant EPP Ketron® GF30 PEEK + glassfibres, extruded (ISO Data)
This 30 % glass fibre reinforced grade offers a higher stiffness and creep resistance than Ketron PEEK-1000 and has a much better dimensional stability. This grade is very appropriate for structural..
Thermal Conductivity 0.430 W/m-K
2.98 BTU-in/hr-ft²-°F
C518/C177
Saint-Gobain Meldin® 2001 Bearing
General Notes on Meldin 2000 Series Bearing Products:For High-Temperature, Close-Tolerance Applications. Able to withstand temperatures of 600°F with excursions to 900°F, the Medlin 2000 Series ca..
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