Polymer Property : Thermal Conductivity = 2.91 BTU-in/hr-ft²-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.420 W/m-K	2.91 BTU-in/hr-ft²-°F
Pyrotek MCX-40 Insulating Board MCX-40 is a bonded-mica composite for use in glass contact applications. Its high operating temperature, low porosity, and low thermal conductivity make it ideal for all areas of hot glass transfer..
Thermal Conductivity	0.420 - 0.570 W/m-K @Temperature 100 - 100 °C	2.91 - 3.96 BTU-in/hr-ft²-°F @Temperature 212 - 212 °F	Average value: 0.490 W/m-K Grade Count:5
Overview of materials for Phenolic, Novolac, Mineral/Flock Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Mineral/Flock Filled". Each property range of values reported is minimum and maximum ..
Thermal Conductivity	0.420 W/m-K	2.91 BTU-in/hr-ftÂ²-Â°F	DIN 52612
Lehmann & Voss LUVOCOMÂ® 19-7276 Polyamide 46, with carbon fiber and PTFE Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Reduced moment of inertia comp..
Thermal Conductivity	0.420 W/m-K	2.91 BTU-in/hr-ftÂ²-Â°F	DIN 52612
Lehmann & Voss LUVOCOMÂ® 50/CF/10/GF/10/TF/10/BK Polycarbonate, with carbon fiber, glass fiber and PTFE Applications: Data processing machinery, precision engineering, film and photo industry, sporting and leisure goods, medical enineering.High-strength and high-stiff parts; low coefficient of expansi..
Thermal Conductivity	0.420 W/m-K	2.91 BTU-in/hr-ftÂ²-Â°F	DIN 52612
Lehmann & Voss LUVOCOMÂ® 50/CF/10/GF/20/BK Polycarbonate, with carbon fiber and glass fiber Applications: Data processing machinery, precision engineering, film and photo industry, sporting and leisure goods, medical enineering.High-strength and high-stiff parts; low coefficient of expansi..
Thermal Conductivity	0.420 W/m-K	2.91 BTU-in/hr-ftÂ²-Â°F	DIN 52612
Lehmann & Voss LUVOCOMÂ® 50-1375 Polycarbonate, with carbon fiber, glass fiber and PTFE Applications: Data processing machinery, precision engineering, film and photo industry, sporting and leisure goods, medical enineering.High-strength and high-stiff parts; low coefficient of expansi..
Thermal Conductivity	0.420 W/m-K	2.91 BTU-in/hr-ftÂ²-Â°F	DIN 52612
GEHR Plastics PE-HD Polyethylene HDPE Polyethylene has a good chemical resistance against almost all acids and bases, detergents and hot water. PE has good insulation properties and is easy to weld. The operating temperature is from -50..
Thermal Conductivity	0.420 W/m-K	2.91 BTU-in/hr-ftÂ²-Â°F	DIN 52612
GEHR Plastics PE-UHMW Polyethylene, Ultra High Molecular Weight The ultra high molecular weight Polyethylene has a high abrasion resistance and a high toughness at the same time. The chemical and the crack resistance are optimized in comparison to the standard P..
Thermal Conductivity	0.420 W/m-K	2.91 BTU-in/hr-ftÂ²-Â°F	DIN 52612
Isoflon PEHD 1000 High Density Polyethylene Products with excellent friction, anti-stick, abrasion and chemical inertia characteristicsVery good impact resistanceNo moisture regainProduct for the food industryInformation provided by Isoflon.
Thermal Conductivity	0.420 W/m-K	2.91 BTU-in/hr-ftÂ²-Â°F	DIN 52612
Lehmann & Voss LUVOCOMÂ® 1105/GF/40 PEEK, with glass fiber Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts; impact resistance.Dynamic stressed parts at high movement velocity.Ch..
Thermal Conductivity	0.420 W/m-K	2.91 BTU-in/hr-ftÂ²-Â°F
Shin-Etsu Silicones KE-40RTV Silicone, RTV Information Provided by Shin-Etsu Silicones of America, Inc.
Thermal Conductivity	0.420 W/m-K	2.91 BTU-in/hr-ftÂ²-Â°F	ASTM C-518
Sumitomo Bakelite North America EM 7302 Hardware Grade Epoxy Long fiberglass reinforced epoxy molding compound which features high strength and toughness for structural components. This compound is designed for applications requiring Mil-M-46069 certificatio..
Thermal Conductivity	0.420 W/m-K	2.91 BTU-in/hr-ftÂ²-Â°F
Shin-Etsu Silicones KE-3494 Silicone, RTV Information Provided by Shin-Etsu Silicones of America, Inc.
Thermal Conductivity	0.420 W/m-K	2.91 BTU-in/hr-ftÂ²-Â°F	ASTM F433
Saint-Gobain MeldinÂ® 5320 Thermoplastic Bearing Material General Notes on Meldin 3000/5000 Series Bearing Products:Injection Moldable, High-Performance Bearings. Can withstand environments of high temperature, corrosive, and water.Specific Notes on Meldin..
Thermal Conductivity	0.420 W/m-K @Temperature 100 °C	2.91 BTU-in/hr-ft²-°F @Temperature 212 °F	ASTM E1461
Plenco 7080 Phenolic, Nodular, Compression Molded PLENCO 07080 is an organic fiber reinforced phenolic molding compound, offering improved mechanical strength properties along with outstanding resistance to cracking and degradation from soap and de..
Thermal Conductivity	0.420 W/m-K @Temperature 100 °C	2.91 BTU-in/hr-ft²-°F @Temperature 212 °F	ASTM E1461
Plenco 7591 Phenolic, Briquette, Injection Molded PLENCO 07591 is a mineral and flock cotton filled novolac phenolic molding compound. UL recognized under component file E40654.Information supplied by Plenco.
Thermal Conductivity	0.420 W/m-K	2.91 BTU-in/hr-ft²-°F
Trelleborg Emerson & Cuming Stycast® 2072 Two-Component Easy Mix Ratio Encapsulant Features and Typical ApplicationsPrimarily designed for ease of use in either meter mix or manual dispense operations. These products also offer a wide range of features including heat dissipation, ..