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Polymer Property : Thermal Conductivity = 2.57 BTU-in/hr-ft²-°F Product List

Thermal Properties

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Thermal Properties Metric English Comments
Thermal Conductivity 0.370 W/m-K
2.57 BTU-in/hr-ft²-°F
ASTM E1530
Solvay Specialty Polymers KetaSpire® KT-820 CF30 Polyetheretherketone (PEEK)  (Unverified Data**)
KetaSpire KT-820 CF30 is the low-flow, 30% carbon-fiber reinforced grade of polyetheretherketone (PEEK). Carbon- fiber reinforcement of KetaSpire PEEK provides the maximum levels of mechanical prope..
Thermal Conductivity 0.370 W/m-K
2.57 BTU-in/hr-ft²-°F
ASTM C177
Solvay Specialty Polymers KetaSpire® KT-880 CF30 Polyetheretherketone (PEEK)  (Unverified Data**)
KetaSpire KT-880 CF30 is a high flow, 30% carbon fiber reinforced grade of polyetheretherketone (PEEK). Carbon-fiber reinforcement of KetaSpire PEEK provides the maximum levels of mechanical propert..
Thermal Conductivity 0.370 W/m-K
2.57 BTU-in/hr-ft²-°F
ACC QSil 551 QSI Quantum Silicones Silicone Potting Material  (discontinued **)
Part of the Amber Chemical Group. Data provided by manufacturer.Characteristics: 100% solid, long pot life, low modulus, good elongation.
Thermal Conductivity 0.370 - 0.400 W/m-K

@Temperature 100 - 100 °C
2.57 - 2.78 BTU-in/hr-ft²-°F

@Temperature 212 - 212 °F
Average value: 0.385 W/m-K Grade Count:2
Overview of materials for Phenolic, Novolac, Flock Filled
This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Flock Filled". Each property range of values reported is minimum and maximum values o..
Thermal Conductivity 0.370 - 0.460 W/m-K

@Temperature 100 - 100 °C
2.57 - 3.19 BTU-in/hr-ft²-°F

@Temperature 212 - 212 °F
Average value: 0.400 W/m-K Grade Count:4
Overview of materials for Phenolic, Resole, Wood Filled
This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Resole, Wood Filled". Each property range of values reported is minimum and maximum values of ..
Thermal Conductivity 0.370 - 1.70 W/m-K
2.57 - 11.8 BTU-in/hr-ft²-°F
Average value: 0.657 W/m-K Grade Count:17
Overview of materials for Polyphenylene Sulfide (PPS), Mineral/Glass-Fiber Filled
This property data is a summary of similar materials in the MatWeb database for the category "Polyphenylene Sulfide (PPS), Mineral/Glass-Fiber Filled". Each property range of values reported is mini..
Thermal Conductivity 0.370 W/m-K
2.57 BTU-in/hr-ft²-°F
ASTM D177
Manifattura Cattaneo RULON® 641 Polytetrafluoroethylene
Manifattura Cattaneo products are available in semi-finished forms such as bars, profiles, sheets and plates.Information provided by Manifattura Cattaneo s.p.a.
Thermal Conductivity 0.370 W/m-K
2.57 BTU-in/hr-ft²-°F
ASTM C177
Solvay Specialty Polymers KetaSpire® KT-820 CF30 Polyetheretherketone (PEEK), 30% Carbon Fiber
KetaSpire® KT-820 CF30 is the low-flow, 30% carbon-fiber reinforced grade of polyetheretherketone (PEEK). Carbon- fiber reinforcement of KetaSpire® PEEK provides the maximum levels of mechanic..
Thermal Conductivity 0.370 W/m-K
2.57 BTU-in/hr-ft²-°F
ASTM C177
Solvay Specialty Polymers KetaSpire® KT-880 CF30 Polyetheretherketone (PEEK), 30% Carbon Fiber
KetaSpire® KT-880 CF30 is a high flow, 30% carbon fiber reinforced grade of polyetheretherketone (PEEK). Carbon-fiber reinforcement of KetaSpire® PEEK provides the maximum levels of mechanical..
Thermal Conductivity 0.370 W/m-K
2.57 BTU-in/hr-ft²-°F
ASTM C177
Solvay Specialty Polymers Ryton® XE4050BL Polyphenylene Sulfide Alloy (PPS Alloy), GlassMineral Filled
Ryton® XE4050BL glass fiber and mineral filled polyphenylene sulfide alloy compound provides high ductility and impact strength along with good thermal stability.Features: Ductile; Good Thermal S..
Thermal Conductivity 0.370 W/m-K
2.57 BTU-in/hr-ft²-°F
Cenco Fitch
Sumitomo Bakelite Durez® 31735 Phenolic, Compression Grade
Durez 31735 is a special purpose phenolic molding compound developed for automotive and industrial pulleys. This material is designed to optimize pulley performance relating to belt life, dimension..
Thermal Conductivity 0.370 W/m-K
2.57 BTU-in/hr-ft²-°F
Cenco Fitch
Sumitomo Bakelite Durez® 31735 Phenolic, Injection Grade
Durez 31735 is a special purpose phenolic molding compound developed for automotive and industrial pulleys. This material is designed to optimize pulley performance relating to belt life, dimension..
Thermal Conductivity 0.370 W/m-K

@Temperature 100 °C
2.57 BTU-in/hr-ft²-°F

@Temperature 212 °F
ASTM E1461
Plenco 2369 Phenolic, Granular, Compression Molded
PLENCO 02369 is a general purpose, organic filled phenolic molding compound, formulated to minimize the generation of free ammonia for applications that are sensitive to such formation. PLENCO 02369..
Thermal Conductivity 0.370 W/m-K

@Temperature 100 °C
2.57 BTU-in/hr-ft²-°F

@Temperature 212 °F
ASTM E1461
Plenco 2535 Phenolic, Granular, Compression Molded
PLENCO 02535 is a general purpose, organic filled phenolic molding compound offering optimized cure characteristics and excellent electrical properties. Type ASTM 5948 CFG, and UL recognized under c..
Thermal Conductivity 0.370 W/m-K

@Temperature 100 °C
2.57 BTU-in/hr-ft²-°F

@Temperature 212 °F
ASTM E1461
Plenco 2567 Phenolic, Granular, Compression Molded
PLENCO 02567 is a general purpose, organic filled phenolic molding compound offering excellent cosmetic characteristics as typically required for vacuum metalized closures. UL recognized under compo..
Thermal Conductivity 0.370 W/m-K

@Temperature 100 °C
2.57 BTU-in/hr-ft²-°F

@Temperature 212 °F
ASTM E1461
Plenco 2571 Phenolic, Granular, Compression Molded
PLENCO 02571 is a general purpose, organic filled phenolic molding compound offering optimum cure characteristics while maintaining excellent mechanical and electrical properties. UL recognized unde..
Thermal Conductivity 0.370 W/m-K

@Temperature 100 °C
2.57 BTU-in/hr-ft²-°F

@Temperature 212 °F
ASTM E1461
Plenco 3554 Phenolic, Granular, Compression Molded
PLENCO 03554 is an organic reinforced phenolic molding compound modified with PTFE to offer improved coefficient of friction values. 03554 is available in black. It is UL listed. 03554 is a re-numbe..
Thermal Conductivity 0.370 W/m-K
2.57 BTU-in/hr-ft²-°F
Elisto THERMOSTAR® HD 550 C Frame Press Insulation Material
Pattern material. Insulation materials for mechanical engineering.Information provided by elisto
Thermal Conductivity 0.370 W/m-K
2.57 BTU-in/hr-ft²-°F
Daelim H&L Plavis-C CM Conductive Polyimide Bearing
Compression Molded. Plavis-C: Conductive, Electrical conductive, high thermal resistance and superior mechanical properties. Surface resistivity 10²-10³ OhmGeneral Plavis information for all grad..
Thermal Conductivity 0.370 W/m-K
2.57 BTU-in/hr-ft²-°F
Daelim H&L Plavis-ESD CM Polyimide Bearing
Compression Molded. Plavis-ESD: Electrostatic dissipative, Electrostatic dissipative, high thermal resistance and superior mechanical properties. And surface resistivity 10²-10³ OhmGeneral Plavis..
Thermal Conductivity 0.370 W/m-K

@Temperature 200 °C
2.57 BTU-in/hr-ft²-°F

@Temperature 392 °F
DIN 52612
Brandenburger BL 70 Slide Bearing Material
BL 70 is a low friction material that exhibits stability at high temperatures. Its applications include high-load low friction tracks and linings in transport and conveying systems, high-stressed b..
Thermal Conductivity 0.370 W/m-K
2.57 BTU-in/hr-ft²-°F
DIN 52612
BASF Ultramid® A3EG10 50% Glass Filled PA66 (Conditioned)
Description: 50% glass-fiber reinforced injection-molding grade for technical articles of very high stiffness as well as for electric insulating parts.Information provided by BASF
Thermal Conductivity 0.370 W/m-K
2.57 BTU-in/hr-ft²-°F
DIN 52612
BASF Ultramid® A3EG10 50% Glass Filled PA66 (Dry)
Description: 50% glass-fiber reinforced injection-molding grade for technical articles of very high stiffness as well as for electric insulating parts.Information provided by BASF
Thermal Conductivity 0.370 W/m-K
2.57 BTU-in/hr-ft²-°F
ASTM C 177
Adamas Adalon® 410 PTFE+ PEEK
Information provided by Adamas, HPM
Thermal Conductivity 0.370 W/m-K
2.57 BTU-in/hr-ft²-°F
DIN 52612
BASF Ultramid® A3WG10 BK 00564 50% Glass Filled PA66 (Conditioned)
Description: 50% glass-fiber reinforced injection-molding grade with high heat aging resistance for technical articles of very high stiffness.Information provided by BASF
Thermal Conductivity 0.370 W/m-K
2.57 BTU-in/hr-ft²-°F
ACC QSil 550 QSI Quantum Silicones Silicone Potting Material
QSil 550 is a 100% silicone solids elastomer designed for electrical potting applications. The two-component system offers a hard, thermally conductive, low modulus material that is readily repairab..
Thermal Conductivity 0.370 W/m-K
2.57 BTU-in/hr-ft²-°F
ACC QSil 550R QSI Quantum Silicones Silicone Potting Material
QSil 550Ris a 100% silicone solids elastomer designed for electronic potting applications. The two-component system offers a hard, thermally conductive, low modulus material that is readily repairab..
Thermal Conductivity 0.370 W/m-K
2.57 BTU-in/hr-ft²-°F
ACC QSil 550SB QSI Quantum Silicones Self-Priming Silicone Potting Material
QSil 550SB is a 100% silicone solids elastomer designed for electronic potting applications. The two-component system offers a hard, thermally conductive, low modulus material that is readily repair..
Thermal Conductivity 0.370 W/m-K
2.57 BTU-in/hr-ft²-°F
CENTROPLAST CENTROLEN PE-HD Polyethylene high density
This material is a low density, easily machined plastic that can be welded and has good chemical resistance. Applications include apparatus engineering, and machines in the foodstuff industry.Infor..
Thermal Conductivity 0.370 W/m-K

@Temperature 100 °C
2.57 BTU-in/hr-ft²-°F

@Temperature 212 °F
Plenco 6554 Phenolic, Granular, Compression Molded  (discontinued **)
Two-Stage Phenolic. PLENCO 06554 is an organic reinforced phenolic molding compound modified with PTFE to offer improved coefficient of friction values. 06554 is available in black.Information supp..
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