Thermal Properties | Metric | English | Comments |
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Thermal Conductivity | 1.80 W/m-K | 12.5 BTU-in/hr-ft²-°F | ASTM E-1461 |
Ovation Polymers Nemcon™ H PC DP113/X5 Polycarbonate Polycarbonate-Thermally conducting, electrically insulating grade with high HDT and improved processability.Information provided by Ovation Polymers |
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Thermal Conductivity | 1.80 W/m-K @Pressure 2.07 MPa |
12.5 BTU-in/hr-ft²-°F @Pressure 300 psi |
ASTM D5470 |
Parker Chomerics CHO-SEAL 1212 Conductive Elastomer High strength, hard (80 shore A) material for waveguide, choke, cover, and flanges with grooves for EMI and pressure sealing.Molded onlyRoHS Compliant Information provided by Chomerics |
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Thermal Conductivity | 1.80 W/m-K | 12.5 BTU-in/hr-ft²-°F | in-plane, ø25*0.4mm disc; ASTM E 1461-07 |
SABIC Innovative Plastics LNP KONDUIT PX11313 PA 6 (Asia Pacific) Thermally conductive mineral filled PA6 FR compounding |
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Thermal Conductivity | 1.80 W/m-K | 12.5 BTU-in/hr-ft²-°F | |
Aremco Aremco-Bond™ 597 Conductive Epoxy Adhesive
(discontinued **) Electrically and thermally conductive, silver-filled, one-part paste. Inorganic system for adhesive (597A) & coating (597C) applications to 1200 ºF (650 °C). |
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Thermal Conductivity | 1.80 W/m-K @Pressure 2.07 MPa |
12.5 BTU-in/hr-ft²-°F @Pressure 300 psi |
ASTM D5470 |
Parker Chomerics CHO-SEAL® 6435 Conductive Elastomer Description: Material of choice for high shielding effectiveness where NBC fluid resistance is needed; good performance in corrosive environments.Molded onlyRoHS CompliantInformation provided by Cho.. |
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Thermal Conductivity | 1.80 W/m-K | 12.5 BTU-in/hr-ft²-°F | |
Epoxyset Epoxiohm EO-23M Electrically Conductive Epoxy Adhesive EO-23M is an electrically conductive, low viscosity silver-filled epoxy adhesive. Used for hybrid / micro-electronic adhesive including die-attach and substrate attach for Rf and Microwave devices.I.. |
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Thermal Conductivity | 1.80 W/m-K | 12.5 BTU-in/hr-ft²-°F | |
Epoxyset Epoxiohm EO-98HT Electrically Conductive Epoxy Adhesive EO-98HT is a one component, electrically and thermally conductive, snap cure, die attach epoxy. It was designed for IC plastic packaging of semiconductors, hybrid micro-electronics, and photonic dev.. |
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Thermal Conductivity | 1.80 W/m-K | 12.5 BTU-in/hr-ft²-°F | |
China-Yixing Longly Refractories ASM-130 Cordierite-Mullite Featured mullite, cordierite as the main raw material, the use of advanced production technology, professionally manufacturing the kiln furniture of ceramic and powder metallurgy with load bearing b.. |
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Thermal Conductivity | 1.80 W/m-K | 12.5 BTU-in/hr-ft²-°F | in-plane, ø25*0.4mm disc; ASTM E 1461-07 |
SABIC Innovative Plastics LNP KONDUIT PX11313 PA 6 (Europe-Africa-Middle East) Thermally conductive mineral and glass fiber filled PA6, FR, compliant with ECO protocols, non-brominated, non-chlorinated |