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Polymer Property : Thermal Conductivity = 1.80 W/m-K Product List

Thermal Properties

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Thermal Properties Metric English Comments
Thermal Conductivity 1.80 W/m-K
12.5 BTU-in/hr-ft²-°F
ASTM E-1461
Ovation Polymers Nemcon™ H PC DP113/X5 Polycarbonate
Polycarbonate-Thermally conducting, electrically insulating grade with high HDT and improved processability.Information provided by Ovation Polymers
Thermal Conductivity 1.80 W/m-K

@Pressure 2.07 MPa
12.5 BTU-in/hr-ft²-°F

@Pressure 300 psi
ASTM D5470
Parker Chomerics CHO-SEAL 1212 Conductive Elastomer
High strength, hard (80 shore A) material for waveguide, choke, cover, and flanges with grooves for EMI and pressure sealing.Molded onlyRoHS Compliant Information provided by Chomerics
Thermal Conductivity 1.80 W/m-K
12.5 BTU-in/hr-ft²-°F
in-plane, ø25*0.4mm disc; ASTM E 1461-07
SABIC Innovative Plastics LNP KONDUIT PX11313 PA 6 (Asia Pacific)
Thermally conductive mineral filled PA6 FR compounding
Thermal Conductivity 1.80 W/m-K
12.5 BTU-in/hr-ft²-°F
Aremco Aremco-Bond™ 597 Conductive Epoxy Adhesive  (discontinued **)
Electrically and thermally conductive, silver-filled, one-part paste. Inorganic system for adhesive (597A) & coating (597C) applications to 1200 ºF (650 °C).
Thermal Conductivity 1.80 W/m-K

@Pressure 2.07 MPa
12.5 BTU-in/hr-ft²-°F

@Pressure 300 psi
ASTM D5470
Parker Chomerics CHO-SEAL® 6435 Conductive Elastomer
Description: Material of choice for high shielding effectiveness where NBC fluid resistance is needed; good performance in corrosive environments.Molded onlyRoHS CompliantInformation provided by Cho..
Thermal Conductivity 1.80 W/m-K
12.5 BTU-in/hr-ft²-°F
Epoxyset Epoxiohm EO-23M Electrically Conductive Epoxy Adhesive
EO-23M is an electrically conductive, low viscosity silver-filled epoxy adhesive. Used for hybrid / micro-electronic adhesive including die-attach and substrate attach for Rf and Microwave devices.I..
Thermal Conductivity 1.80 W/m-K
12.5 BTU-in/hr-ft²-°F
Epoxyset Epoxiohm EO-98HT Electrically Conductive Epoxy Adhesive
EO-98HT is a one component, electrically and thermally conductive, snap cure, die attach epoxy. It was designed for IC plastic packaging of semiconductors, hybrid micro-electronics, and photonic dev..
Thermal Conductivity 1.80 W/m-K
12.5 BTU-in/hr-ft²-°F
China-Yixing Longly Refractories ASM-130 Cordierite-Mullite
Featured mullite, cordierite as the main raw material, the use of advanced production technology, professionally manufacturing the kiln furniture of ceramic and powder metallurgy with load bearing b..
Thermal Conductivity 1.80 W/m-K
12.5 BTU-in/hr-ft²-°F
in-plane, ø25*0.4mm disc; ASTM E 1461-07
SABIC Innovative Plastics LNP KONDUIT PX11313 PA 6 (Europe-Africa-Middle East)
Thermally conductive mineral and glass fiber filled PA6, FR, compliant with ECO protocols, non-brominated, non-chlorinated
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