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Polymer Property : Thermal Conductivity = 1.20 W/m-K Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Thermal Conductivity | 1.20 - 1.50 W/m-K | 8.33 - 10.4 BTU-in/hr-ft²-°F | |
| Parker Chomerics CHO-BOND 584-29 Conductive Adhesive Two-component, highly conductive adhesive system that combines the good adhesive characteristics of epoxy with the superior conductivity of silver. In addition to being available in bulk form, the m.. |
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| Thermal Conductivity | 1.20 W/m-K @Pressure 2.07 MPa |
8.33 BTU-in/hr-ft²-°F @Pressure 300 psi |
ASTM D5470 |
| Parker Chomerics CHO-SEAL 1298 EMI Shielding Material Corrosion Resistant EMI Shielding Gasket. Through the use of new proprietary particle painting and elastomer compounding technology, CHO-SEAL® 1298 shielding elastomer offers a six-fold increase in.. |
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| Thermal Conductivity | 1.20 W/m-K @Pressure 2.07 MPa |
8.33 BTU-in/hr-ft²-°F @Pressure 300 psi |
ASTM D5470 |
| Parker Chomerics CHO-SEAL 1350 Conductive Elastomer Standard material for high volume injection and compression molding and small extrusions; high performance in non-corrosive environments; used in grounding applications with little or no vibration.R.. |
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| Thermal Conductivity | 1.20 W/m-K | 8.33 BTU-in/hr-ft²-°F | JIS-R-2618; ASTM D2326 |
| Fujipoly Industries Sarcon® GR-Hk Gap Filler Pad Sarcon GR-k is a general type of thermal conductive gel material (no electicity conductive) in a versatile sheet form that easily fits and adheres to most all shapes and sizes of components, and mak.. |
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| Thermal Conductivity | 1.20 W/m-K | 8.33 BTU-in/hr-ft²-°F | HOT-DISK || 60x60x3 mm |
| Lehmann & Voss LUVOCOM® 1/CF/30 Polyamide 66, with carbon fiber, heat stabilized Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Reduced moment of inertia comp.. |
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| Thermal Conductivity | 1.20 W/m-K | 8.33 BTU-in/hr-ft²-°F | HOT-DISK; 60x60x3 mm |
| Lehmann & Voss LUVOCOM® 1-7893/GY Polyamide 66, with carbon fiber, heat stabilized Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Reduced moment of inertia comp.. |
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| Thermal Conductivity | 1.20 W/m-K | 8.33 BTU-in/hr-ft²-°F | Longitudinal |
| LATI Laticonther 62 CPG/500 PA 6, Glass Fiber Reinforced High thermal conductivity product based on Polyamide 6 (PA6). Special filler. Glass fibers. Availability: Africa & Middle East; Asia Pacific; Europe; Latin America; North AmericaInformation provided.. |
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| Thermal Conductivity | 1.20 W/m-K @Temperature 90.0 °C |
8.33 BTU-in/hr-ft²-°F @Temperature 194 °F |
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| Schott DUROBAX® amber Neutral Glass Tubing Neutral glass tubing, chemically highly resistant, with light protection Containers, test tubes, pipettes, chemical and technical apparatus The heavy metal content for the elements lead, cadmium, .. |
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| Thermal Conductivity | 1.20 W/m-K @Temperature 90.0 °C |
8.33 BTU-in/hr-ft²-°F @Temperature 194 °F |
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| Schott Glass 8245 Borosilicate Glass Borosilicate glass for sealing to Kovar metal and molybdenum, minimum X-ray absorption, low self radiation, good insulator X-ray tubes, video-frequency tubes, photomultiplier tubes The heavy metal.. |
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| Thermal Conductivity | 1.20 W/m-K @Temperature 90.0 °C |
8.33 BTU-in/hr-ft²-°F @Temperature 194 °F |
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| Schott Glass 8347 Borosilicate Glass Borosilicate glass 3.3 acc. To ISO 3585, chemically and thermally highly resistant, highly UV-transmitting The heavy metal content for the elements lead, cadmium, mercury, and hexavalent chromium i.. |
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| Thermal Conductivity | 1.20 W/m-K @Temperature 90.0 °C |
8.33 BTU-in/hr-ft²-°F @Temperature 194 °F |
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| Schott Glass 8487 Borosilicate Glass Borosilicate glass for sealing to tungsten Backlights, flash lamps, lamp bulbs, exhaust and flare bulbs The heavy metal content for the elements lead, cadmium, mercury, and hexavalent chromium is .. |
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| Thermal Conductivity | 1.20 W/m-K @Temperature 90.0 °C |
8.33 BTU-in/hr-ft²-°F @Temperature 194 °F |
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| Schott Glass 8687 Borosilicate Glass Borosilicate glass for sealing to tungsten, defined UV absorption, stabilized against solarization Backlights The heavy metal content for the elements lead, cadmium, mercury, and hexavalent chromi.. |
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| Thermal Conductivity | 1.20 W/m-K @Temperature 90.0 °C |
8.33 BTU-in/hr-ft²-°F @Temperature 194 °F |
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| Schott Glass 8688 Borosilicate Glass Borosilicate glass, highly UV-blocked, stabilized against solarization, sealing glass to Tungsten Backlights The heavy metal content of the elements lead, cadmium, mercury, and hexavalent chromium.. |
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| Thermal Conductivity | 1.20 W/m-K @Temperature 90.0 °C |
8.33 BTU-in/hr-ft²-°F @Temperature 194 °F |
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| Schott KIMAX® Borosilicate Glass Laboratory Glass Drainline from Borosilicate glass 3.3. Chemically and thermally highly resistant.The heavy metal content for the elements lead, cadmium, mercury, and hexavalent chromium is below 10.. |
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| Thermal Conductivity | 1.20 W/m-K | 8.30 BTU-in/hr-ft²-°F | |
| Cotronics Resbond™ 7030 High Temperature Ceramic Adhesive, High Strength |
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| Thermal Conductivity | 1.20 W/m-K | 8.33 BTU-in/hr-ft²-°F | |
| Epoxy Technology EPO-TEK® B912-8 Epoxy Product Description: A single component, thermally and electrically conductive, epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a pot.. |
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| Thermal Conductivity | 1.20 W/m-K | 8.33 BTU-in/hr-ft²-°F | |
| Epoxy Technology EPO-TEK® EM127 Electrically Conductive Epoxy Product Description: EPO-TEK® EM127 is a single component, heat curable, electrically conductive epoxy adhesive for semiconductor IC and LED die attach applications.Advantages & Application Notes: .. |
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| Thermal Conductivity | 1.20 W/m-K | 8.33 BTU-in/hr-ft²-°F | |
| Epoxy Technology EPO-TEK® H27D Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H27D is a two component, silver-filled epoxy adhesive designed for semiconductor and hybrid-microelectronic packaging applications.Advantages & Application Notes: Rheo.. |
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| Thermal Conductivity | >= 1.20 W/m-K | >= 8.33 BTU-in/hr-ft²-°F | |
| Arlon 0.008" (0.2032 mm) Thermabond® E-35 Uncured Silicone (99730N008) 0.008 in., ±0.001 (0.2 mm, ±0.03) uncured silicone on 0.003 in. (0.08 mm) nominal PTFE coated fiberglass; 0.001 in. (0.03 mm) FEP interleave; overall thickness 0.008 in ±0.001(0.2 mm ± 0.03). T.. |
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| Thermal Conductivity | >= 1.20 W/m-K | >= 8.33 BTU-in/hr-ft²-°F | |
| Arlon 0.008" (0.2032 mm) Thermabond®-45 Uncured Silicone (99720W008) 0.008 in., +0.000,-0.002(0.2 mm, +0.00, -0.05) uncured silicone on 0.003 in. (0.08 mm) nominal PTFE coated fiberglass; 0.001 in. (0.03 mm) FEP interleave; overall thickness 0.008 in +0.000,-0.002(0... |
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| Thermal Conductivity | 1.20 W/m-K | 8.33 BTU-in/hr-ft²-°F | |
| Aremco Aremco-Bond™ 598 Conductive Epoxy Adhesive
(discontinued **) Electrically and thermally conductive, nickel-filled, single part system. Low viscosity, inorganic coating for applications to 1000 ºF (540 °C). |
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| Thermal Conductivity | 1.20 W/m-K @Temperature 90.0 °C |
8.33 BTU-in/hr-ft²-°F @Temperature 194 °F |
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| Schott CONTURAX® Borosilicate Glass Borosilicate glass tubing and rod, varying types of inner and outer shapes Lighting, giftware, and decoration The heavy metal content for the elements lead, cadmium, mercury, and hexavalent chromi.. |
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| Thermal Conductivity | 1.20 W/m-K | 8.33 BTU-in/hr-ft²-°F | Longitudinal |
| LATI Laticonther 57 CPG/550 PPA, Glass Fiber Reinforced High thermal conductivity product based on Semi-aromatic polyamide (PPA). Special filler. Glass fibers. Availability: Africa & Middle East; Asia Pacific; Europe; Latin America; North AmericaInformat.. |
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