Polymer Property : Thermal Conductivity = 0.900 W/m-K Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.700 - 0.900 W/m-K	4.86 - 6.25 BTU-in/hr-ft²-°F	ASTM E1461
Raschig Group EN 5004 Epoxy Molding Compound Mica reinforced molding compound. Low mold shrinkage and post-shrinkage, very good electrical values, outstanding heat resistance, very goo pourablity. This product meets the allowed upper limits fo..
Thermal Conductivity	0.700 - 0.900 W/m-K	4.86 - 6.25 BTU-in/hr-ft²-°F	ASTM E1461
Raschig Group EN 5007 Epoxy Molding Compound Mica reinforced molding compound. Low mold shrinkage and post-shrinkage, very good electrical values, outstanding heat resistance, very goo pourablity. This product meets the allowed upper limits fo..
Thermal Conductivity	0.100 - 0.900 W/m-K	0.694 - 6.25 BTU-in/hr-ft²-°F	Dependent on grade and temperature.
Destech Open-Celled Glassy Carbon Foam Destech glassy (vitreous) carbon foam is available in different grades depending on the number of pores per inch (ppi). Standard grades are 10, 45, 100 and 500 ppi. Custom grades are available on a..