Polymer Property : Thermal Conductivity = 0.833 BTU-in/hr-ft²-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F	ASTM C158
Rogers Corporation Bisco™ HT-840 Cellular Silicone Foam Extra firm grade silicone sponge. UL recognized of flame retardance.Applications: High closure-force gaskets, Press-pads where conformable imprinting support is required, such as decal lamination o..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F
Pyrotek Wollite 37 Insulating Castable Wollite material is a solid, light weight mineral foam which is stable during its preparation and during subsequent curing and drying. Because of the foam properties it is well suited for casting c..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F
Parylene Coating Services N Poly (P-Xylylene) Monomer is para-xylylene. Parylene N has a lower coefficient of friction and therefore is recommended where lubricity is needed. Parylene N exhibits a slight haze at thicknesses over 5 microns.Par..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ftÂ²-Â°F	DIN 52612
Isoflon PVC Polyvinyl Chloride Good mechanical propertiesThermoformableGood impact resistanceInformation provided by Isoflon.
Thermal Conductivity	0.120 W/m-K @Temperature 650 °C	0.833 BTU-in/hr-ft²-°F @Temperature 1200 °F
Unifrax XPE® MP Substrate Support Mat XPE®-MP is a multipurpose, third-generation support mat system developed by Unifrax specifically for mechanical support and insulation of ceramic substrates used in diesel and gasoline emission con..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F
Trelleborg Emerson & Cuming Syntac® 350 Composite Materials Syntactic Foam Syntac 350 foam is a rigid, high strength composite of epoxy resin and microscopic hollow glass microspheres designed specifically for fabricating thermoforming plugs and other associated tooling. ..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F	Value for Kapton® HN
DuPont™ Kapton® 100EN Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)Kapton® Type E and EN films have superior dimensional stability, low CHE, a CTE close to copper, and a high modulus. This type is exceptional for applications req..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F	ASTM F433-77
DuPont™ Kapton® 100HN Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).General..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F	Value for Kapton® HN
DuPont™ Kapton® 100VN Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type HN with added dimensional stability. Available i..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F	Value for Kapton® HN
DuPont™ Kapton® 100ZT Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN and HN with superior bondability. Available i..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F	Value for Kapton® HN
DuPont™ Kapton® 200A Polyimide Film, 50 Micron Thickness Film thickness 50 micron 2.0 mil)Kapton® Type A is a lower modulus film, which is conducive to dynamic flex applications.General Kapton® information: Kapton® is synthesized by polymerizing an ar..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F	Value for Kapton® HN
DuPont™ Kapton® 200EN Polyimide Film, 50 Micron Thickness Film thickness 50 micron 2.0 mil)Kapton® Type E and EN films have superior dimensional stability, low CHE, a CTE close to copper, and a high modulus. This type is exceptional for applications requ..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F	Value for Kapton® HN
DuPont™ Kapton® 250FN029 Polyimide/FEP Composite Film 250 Gauge film structure consisting of a 50 µm (2 mil) base polyimide film with a 13 µm (0.5 mil) coating of Teflon® FEP on one side.Kapton® Type HN film coated with Teflon® FEP fluoropolymer r..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F	Value for Kapton® HN
DuPont™ Kapton® 300A Polyimide Film, 75 Micron Thickness Film thickness 75 micron (3.0 mil)Kapton® Type A is a lower modulus film, which is conducive to dynamic flex applications.General Kapton® information: Kapton® is synthesized by polymerizing an a..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F	Value for Kapton® HN
DuPont™ Kapton® 300KN Polyimide Film, 75 Micron Thickness Film thickness 75 micron (3.0 mil)Excellent processability, CTE close to copper, and a moderately high modulus.General Kapton® information: Kapton® is synthesized by polymerizing an aromatic dian..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F	Value for Kapton® HN
DuPont™ Kapton® 300VN Polyimide Film, 75 Micron Thickness Film thickness 75 micron (3.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type HN with added dimensional stability. Available i..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F	Value for Kapton® HN
DuPont™ Kapton® 500A Polyimide Film, 125 Micron Thickness Film thickness 125 micron (5.0 mil)Kapton® Type A is a lower modulus film, which is conducive to dynamic flex applications.General Kapton® information: Kapton® is synthesized by polymerizing an ..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F	Value for Kapton® HN
DuPont™ Kapton® 500FPC Polyimide Film, 125 Micron Thickness Film thickness 125 micron (5.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN with improved bondability. Available in thic..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F	ASTM F433-77
DuPont™ Kapton® 500HN Polyimide Film, 125 Micron Thickness Film thickness 125 micron (5.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).Genera..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F	Value for Kapton® HN
DuPont™ Kapton® 500VN Polyimide Film, 125 Micron Thickness Film thickness 125 micron (5.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type HN with added dimensional stability. Available ..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F	Value for Kapton® HN
DuPont™ Kapton® 50EN Polyimide Film, 13 Micron Thickness Film thickness 13 micron (0.5 mil)Kapton® Type E and EN films have superior dimensional stability, low CHE, a CTE close to copper, and a high modulus. This type is exceptional for applications req..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F	ASTM F433-77
DuPont™ Kapton® 50HN Polyimide Film, 13 Micron Thickness Film thickness 13 micron (0.5 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).General..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F	Value for Kapton® HN
DuPont™ Kapton® 50KN Polyimide Film, 13 Micron Thickness Film thickness 13 micron (0.5 mil)Excellent processability, CTE close to copper, and a moderately high modulus.General Kapton® information: Kapton® is synthesized by polymerizing an aromatic dian..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F	Value for Kapton® HN
DuPont™ Kapton® 50VN Polyimide Film, 13 Micron Thickness Film thickness 13 micron (0.5 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type HN with added dimensional stability. Available i..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F	Value for Kapton® HN
DuPont™ Kapton® 50ZT Polyimide Film, 13 Micron Thickness Film thickness 13 micron (0.5 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN and HN with superior bondability. Available i..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F	Value for Kapton® HN
DuPont™ Kapton® 100FPC Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN with improved bondability. Available in thick..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F	Value for Kapton® HN
DuPont™ Kapton® 200KN Polyimide Film, 50 Micron Thickness Film thickness 50 micron 2.0 mil)Excellent processability, CTE close to copper, and a moderately high modulus.General Kapton® information: Kapton® is synthesized by polymerizing an aromatic dianh..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F	Value for Kapton® HN
DuPont™ Kapton® 200ZT Polyimide Film, 50 Micron Thickness Film thickness 50 micron 2.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN and HN with superior bondability. Available in..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F	ASTM F433-77
DuPont™ Kapton® 200HN Polyimide Film, 50 Micron Thickness Film thickness 50 micron 2.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).General ..
Thermal Conductivity	0.120 W/m-K	0.833 BTU-in/hr-ft²-°F
Pyrotek Wollite 45 Insulating Castable Wollite material is a solid, light weight mineral foam which is stable during its preparation and during subsequent curing and drying. Because of the foam properties it is well suited for casting c..