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Polymer Property : Thermal Conductivity = 0.530 W/m-K Product List

Thermal Properties

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Thermal Properties Metric English Comments
Thermal Conductivity 0.530 W/m-K
3.68 BTU-in/hr-ft²-°F
ASTM C177
PolyOne Edgetek® NN-50GF/000EM L Polyamide 66 (Nylon 66)
Information provided by PolyOne
Thermal Conductivity 0.530 W/m-K
3.68 BTU-in/hr-ft²-°F
ASTM C177
Solvay Specialty Polymers Torlon® 4301 Polyamide-imide (PAI)  (Unverified Data**)
Torlon 4301 is a wear-resistant grade of polyamide-imide (PAI) resin. It has a good balance of mechanical properties and wear resistance. It offers high flexural and compressive strength with a low ..
Thermal Conductivity 0.530 W/m-K
3.68 BTU-in/hr-ft²-°F
Chevron Phillips Xtel® XK2760BL Polyphenylene Sulfide Alloy  (discontinued **)
Xtel® XK2760BL is a high performance, glass fiber and mineral filled PPS based alloy developed to provide excellent mechanical strength with a unique blend of toughness, rigidity, and low flash cha..
Thermal Conductivity 0.530 W/m-K
3.68 BTU-in/hr-ft²-°F
ASTM C177
Solvay Specialty Polymers Torlon® 4301 Polyamide-imide (PAI)
Torlon® 4301 is a wear-resistant grade of polyamide-imide (PAI) resin. It has a good balance of mechanical properties and wear resistance. It offers high flexural and compressive strength with a ..
Thermal Conductivity 0.530 W/m-K

@Temperature 100 °C
3.68 BTU-in/hr-ft²-°F

@Temperature 212 °F
ASTM E1461
Plenco 3597 Phenolic, Granular, Injection Molded
PLENCO 03597 is a mineral filled phenolic molding compound offering excellent flammability ratings even at thin cross sections, along with excellent arc and comparative track resistance values. UL r..
Thermal Conductivity 0.530 W/m-K

@Temperature 40.0 °C
3.68 BTU-in/hr-ft²-°F

@Temperature 104 °F
ISO 8302
Ensinger TECASINT 1021 Polyimide, 15% Graphite Filled (PI)
TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel..
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