Polymer Property : CTE, linear = 87.8 µin/in-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	158 µm/m-°C	87.8 µin/in-°F	Above Tg
Epoxy Technology EPO-TEK® H20E-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-MP is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al..
CTE, linear	158 µm/m-°C	87.8 µin/in-°F	Above Tg
Epoxy Technology EPO-TEK® OE121 Black Epoxy Adhesive Material Description: A two component, low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. ..
CTE, linear	158 µm/m-°C	87.8 µin/in-°F	Above Tg
Epoxy Technology EPO-TEK® OG142-112 UV Cure Optical Epoxy Material Description: Single component, medium viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application. Replacement version of EPO-TE..
CTE, linear	158 µm/m-°C	87.8 µin/in-°F	Above Tg
Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also ..