Polymer Property : CTE, linear = 55.1 µm/m-°C Product List

Thermal Properties

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Thermal Properties	Metric	English
CTE, linear	55.1 µm/m-°C @Temperature 20.0 °C	30.6 µin/in-°F @Temperature 68.0 °F
Westlake Plastics Imidex Thermoplastic Polyimide Made from Aurum® resin. Applications include electronics, acoustics, composites, wire/cable insulation, adhesive film, and washers/gaskets. It will not melt unto itself, is thermoformable, has hi..
CTE, linear	55.1 µm/m-°C	30.6 µin/in-°F
Hexcel® HexPly® 954-3 Curing Cyanate Resin HexPly® 954-3 is a 350°F (177°C) curing cyanate resin with excellent resistance to moisture absorption, outgassing and microcracking. HexPly® 954-3 is formulated for autoclave or press molding u..
CTE, linear	55.1 µm/m-°C	30.6 µin/in-°F
Atom Adhesives AA-BOND 2104 Epoxy Adhesive AA-BOND 2104 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s..
CTE, linear	55.1 µm/m-°C	30.6 µin/in-°F
Atom Adhesives AA-BOND FDA15 Epoxy Adhesive AA-BOND FDA15 is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Administr..
CTE, linear	55.1 µm/m-°C	30.6 µin/in-°F
Atom Adhesives AA-BOND 2116 Epoxy Adhesive AA-BOND 2116 is a thixotropic, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It is recommended for critical electronics, aerospace, and industrial applications where..