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Polymer Property : CTE, linear = 53.9 µin/in-°F Product List

Thermal Properties

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Thermal Properties Metric English Comments
CTE, linear 97.0 µm/m-°C
53.9 µin/in-°F
Below Tg
Epoxy Technology EPO-TEK® B9021-1 Epoxy Paste
Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..
CTE, linear 97.0 µm/m-°C
53.9 µin/in-°F
Above Tg
Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-elec..
CTE, linear 97.0 µm/m-°C
53.9 µin/in-°F
Above Tg
Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive
Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm..
CTE, linear 97.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
53.9 µin/in-°F

@Temperature -22.0 - 86.0 °F
ASTM Test
BASF Ultramid® 8272G HS BK-102 12% Glass Filled PA6 (Dry)
Ultramid 8272G HS BK-102 is a 12% glass fiber reinforced, black pigmented, thermally modified, nylon 6 blow molding compound offering an excellent balance of engineering properties combined with the..
CTE, linear 97.0 µm/m-°C

@Temperature 20.0 °C
53.9 µin/in-°F

@Temperature 68.0 °F
ISO 11359
LG Chemical HG-174 ABS, High Gloss, Super High Flow
Information Provided by LG Chem
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