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Polymer Property : CTE, linear = 43.0 µm/m-°C Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 43.0 µm/m-°C | 23.9 µin/in-°F | Y-Direction; IPC-TM-650 2.4.41 |
| Rogers Corporation RT/duroid® 5880LZ Lightweight, High Frequency PTFE Laminate RT/duroid® 5880LZ filled PTFE composites are designed for exacting stripline and microstrip circuit applications. The unique filler results in a low density, lightweight material for high performa.. |
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| CTE, linear | 43.0 µm/m-°C @Temperature 20.0 °C |
23.9 µin/in-°F @Temperature 68.0 °F |
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| Resin Technology Group KONA 877 Low Viscosity, Low Shrinkage, Vacuum Grade Casting Resin Mix ratio 1 to 1 by weight.KONA 877 with HARDENER #112 is a versatile epoxy casting system developed for high performance production potting and encapsulating applications where low shrinkage and ra.. |
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| CTE, linear | 43.0 - 100 µm/m-°C | 23.9 - 55.6 µin/in-°F | Average value: 67.8 µm/m-°C Grade Count:5 |
| Overview of materials for PETG Copolyester This property data is a summary of similar materials in the MatWeb database for the category "PETG Copolyester". Each property range of values reported is minimum and maximum values of appropriate M.. |
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| CTE, linear | 43.0 - 99.0 µm/m-°C @Temperature 40.0 - 130 °C |
23.9 - 55.0 µin/in-°F @Temperature 104 - 266 °F |
Average value: 62.3 µm/m-°C Grade Count:22 |
| Overview of materials for Phenolic, Novolac, Woodflour Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Woodflour Filled". Each property range of values reported is minimum and maximum valu.. |
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| CTE, linear | 43.0 µm/m-°C | 23.9 µin/in-°F | ASTM D696 |
| Haysite H330 Polyester Composite A thermoset polyester composite that offers superior energy efficiency, temperature control, and durability for high temperature mold and platen thermal applications. A proven, cost effective produ.. |
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| CTE, linear | 43.0 µm/m-°C | 23.9 µin/in-°F | ASTM D696 |
| Samyang Trirex® 3025G10 Polycarbonate, 10% Glass Reinforced TRIREX® polycarbonate resins offer superior transparency, mechanical properties, good dimensional stability and high electrical performance, which allows it to be widely used for electrical, elec.. |
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| CTE, linear | 43.0 µm/m-°C | 23.9 µin/in-°F | ASTM D696 |
| Samyang Trirex® 3025GN10 Polycarbonate, Reinforced Flame Retardancy PC is characterized by its excellent impact resistance, dimensional stability and excellent thermal resistance.3025GN10 is a reinforced flame retardant grade.Applications: LCD Panel Frame (dimensio.. |
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| CTE, linear | 43.0 µm/m-°C | 23.9 µin/in-°F | ASTM D696 |
| Samyang Trirex® 3025GRU10 Polycarbonate, 10% Glass Reinforced TRIREX® polycarbonate resins offer superior transparency, mechanical properties, good dimensional stability and high electrical performance, which allows it to be widely used for electrical, elec.. |
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| CTE, linear | 43.0 µm/m-°C @Temperature 40.0 - 130 °C |
23.9 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
| Plenco 1530 Polyester, Briquette, Injection Molded PLENCO 01530 is a glass and mineral reinforced pelletized polyester molding compound, offering improved mechanical strength properties along with excellent electrical properties and dimensional stab.. |
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| CTE, linear | 43.0 µm/m-°C @Temperature 40.0 - 130 °C |
23.9 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
| Plenco 2535 Phenolic, Granular, Injection Molded PLENCO 02535 is a general purpose, organic filled phenolic molding compound offering optimized cure characteristics and excellent electrical properties. Type ASTM 5948 CFG, and UL recognized under c.. |
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| CTE, linear | 43.0 µm/m-°C @Temperature 40.0 - 130 °C |
23.9 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
| Plenco 7500 Phenolic, Granular, Injection Molded PLENCO 07500 is an organic reinforced phenolic molding compound, offering improved mechanical strength and excellent cosmetic characteristics. Type ASTM 5948 CFG and UL recognized under component fi.. |
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| CTE, linear | 43.0 µm/m-°C @Temperature 20.0 °C |
23.9 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Toyobo T-750 Nylon, Painting Grade Key Feature: Glass fiber and mineral reinforced, high heat distortion gradesInformation provided by Toyobo Co., Ltd |
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| CTE, linear | 43.0 µm/m-°C @Temperature 20.0 °C |
23.9 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Toyobo T-772 Nylon, Plating Grade Key Feature: Plating grade; Glass fiber and mineral reinforced grades; thermal and impact resistantInformation provided by Toyobo Co., Ltd |
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| CTE, linear | 43.0 µm/m-°C @Temperature 50.0 - 200 °C |
23.9 µin/in-°F @Temperature 122 - 392 °F |
DIN 53 752 |
| Ensinger TECASINT 1101 Polyimide (PI) TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel.. |
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| CTE, linear | 43.0 µm/m-°C | 23.9 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® 353ND-T Black High Temperature Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T Black is a two component, high temperature, thixotropic epoxy for fiber optic, PCB and various medical applications. Advantages & Application Notes: This produ.. |
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| CTE, linear | 43.0 µm/m-°C | 23.9 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® 353ND-T High Temperature Thixotropic Epoxy Product Description: EPO TEK® 353ND-T is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. Advantages & Application Notes: Suitable for fiber op.. |
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| CTE, linear | 43.0 µm/m-°C | 23.9 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® 353ND-T1 High Temperature Thixotropic Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed for fiber optic, electronics and medical applications. It is a more viscous alternative to EPO-TEK® 353ND-T.I.. |
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| CTE, linear | 43.0 µm/m-°C | 23.9 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® 353ND-T4 Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T4 is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. This is a higher viscosity version of EPO-TEK® 353.. |
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| CTE, linear | 43.0 µm/m-°C | 23.9 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® 353ND-T5 High Temperature Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T5 is an intermediate viscosity version of EPO-TEK® 353ND and EPO-TEK® 353ND-T. It was designed for high temperature applications in fiber optics, electronics .. |
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| CTE, linear | 43.0 µm/m-°C | 23.9 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® E2116 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E2116 is a two component, silver-filled and stencil printable electrically conductive adhesive for bonding SMDs onto PCB and substrates. Can be used as a “lead-free”.. |
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| CTE, linear | 43.0 µm/m-°C | 23.9 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® H54 High Temperature Epoxy Product Description: EPO-TEK® H54 is a two component, high Tg, electrically and thermally insulating epoxy adhesive for general bonding and high temperature packaging in medical, hybrid, and optica.. |
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| CTE, linear | 43.0 µm/m-°C | 23.9 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® OE100-T High Temperature Epoxy Material Description: A two component, high Tg, high temperature grade epoxy designed for semiconductor, underfill, hard-disk drive and hybrid micro-electronics packaging applications. The epoxy ca.. |
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| CTE, linear | 43.0 µm/m-°C | 23.9 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® OE121 Black Epoxy Adhesive Material Description: A two component, low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. .. |
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| CTE, linear | 43.0 µm/m-°C | 23.9 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® OG133-8 UV Cure Optical Epoxy Material Description: A single component, UV curable, thixotropic flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, and .. |
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| CTE, linear | 43.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
23.9 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM D696 |
| Beijing Chemical Industry KAIFA® 301-G30RF PBT Resin 30% glass fiber reinforced, flame retardant, good toughness, low bleedingInformation provided by Beijing Chemical Industry Research Institute (Group) |
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| CTE, linear | 43.0 µm/m-°C @Temperature -40.0 - 120 °C |
23.9 µin/in-°F @Temperature -40.0 - 248 °F |
ASTM E831 |
| Azdel Plus R401-B01 40% Continuous Random Fiber Mat / PP Resin Matrix AZDEL® R401-B01 is a glass mat thermoplastic laminate based upon a random oriented continuous fiber mat contained within a polypropylene resin matrix. This composite material features high flow pr.. |
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| CTE, linear | 43.0 µm/m-°C @Temperature 20.0 °C |
23.9 µin/in-°F @Temperature 68.0 °F |
TMA; ASTM E831 |
| LNP Thermocomp® SF-1006 Polyamide 12, Glass Fiber Reinforcement
(discontinued **) Forms: PelletsProcessing Method: Injection MoldingInformation provided by LNP, a GE Plastics Company.This data sheet is labeled Discontinued; however many LNP grades are still active under new names.. |
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