Polymer Property : CTE, linear = 42.0 Âµm/m-Â°C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	42.0 Âµm/m-Â°C @Temperature 20.0 Â°C	23.3 Âµin/in-Â°F @Temperature 68.0 Â°F	Vertical Direction; ASTM D696
Mitsui Arlenâ„¢ A350 50% Glass Fiber-Reinforced Modified Nylon 6T (COND) ARLENâ„¢ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320Â°C) and a rigidity level comparable to super engineering plastics, it poss..
CTE, linear	42.0 Âµm/m-Â°C @Temperature 20.0 Â°C	23.3 Âµin/in-Â°F @Temperature 68.0 Â°F	Vertical Direction; ASTM D696
Mitsui Arlenâ„¢ A350 50% Glass Fiber-Reinforced Modified Nylon 6T (DAM) ARLENâ„¢ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320Â°C) and a rigidity level comparable to super engineering plastics, it poss..
CTE, linear	42.0 µm/m-°C	23.3 µin/in-°F	ISO 11359-2
Unitika A1022GFL15 PA6, 15% Glass Fiber Reinforced, Conditioned Information provided by Unitika Ltd.
CTE, linear	42.0 µm/m-°C	23.3 µin/in-°F	ISO 11359-2
Unitika A1022GFL15 PA6, 15% Glass Fiber Reinforced, Dry Information provided by Unitika Ltd.
CTE, linear	42.0 µm/m-°C @Temperature 20.0 °C	23.3 µin/in-°F @Temperature 68.0 °F
Cosmic Plastics 306 Orlon Filled Ortho Diallyl Phthalate Molding Compound Data provided by the manufacturer.
CTE, linear	42.0 µm/m-°C	23.3 µin/in-°F	ISO 11359-2
Unitika A175G15 PA66, 15% Glass Fiber Reinforced, Conditioned Information provided by Unitika Ltd.
CTE, linear	42.0 µm/m-°C	23.3 µin/in-°F	ISO 11359-2
Unitika A175G15 PA66, 15% Glass Fiber Reinforced, Dry Information provided by Unitika Ltd.
CTE, linear	42.0 µm/m-°C @Temperature 40.0 - 130 °C	23.3 µin/in-°F @Temperature 104 - 266 °F	TMA; ASTM E831
Plenco 4466 Phenolic, Granular, Compression Molded PLENCO 04466 is a heat resistant, mineral and flock filled phenolic molding compound, offering excellent mechanical strength and cosmetic properties. UL recognized under component file E40654. 04466..
CTE, linear	42.0 µm/m-°C @Temperature 40.0 - 130 °C	23.3 µin/in-°F @Temperature 104 - 266 °F	TMA; ASTM E831
Plenco 4466 Phenolic, Granular, Transfer Molded PLENCO 04466 is a heat resistant, mineral and flock filled phenolic molding compound, offering excellent mechanical strength and cosmetic properties. UL recognized under component file E40654. 04466..
CTE, linear	42.0 µm/m-°C @Temperature 20.0 °C	23.3 µin/in-°F @Temperature 68.0 °F
Cosmic Plastics ID-40 Orlon Filled Ortho Diallyl Phthalate Molding Compound Data provided by the manufacturer.
CTE, linear	42.0 µm/m-°C	23.3 µin/in-°F	Absolute Drying; ASTM-D696
Toyobo GLAMIDE® T-422VOR Nylon-6 GLAMIDE® is very tough and exhibits high abrasion resistance. It has a high melting point and heat resistance, has well-balanced proportions of mechanical properties, performs self-distinguishing a..
CTE, linear	42.0 µm/m-°C @Temperature -40.0 - 0.000 °C	23.3 µin/in-°F @Temperature -40.0 - 32.0 °F	Alpha 1
Tra-Con Tra-Bond 516H03 Blush-Free Epoxy Adhesive TRA-BOND 516H03 is a modified version of F114 yielding a higher viscosity and lower coefficient of thermal expansion. Information provided by Tra-Con Inc.
CTE, linear	42.0 µm/m-°C	23.3 µin/in-°F	Below Tg
Epoxy Technology EPO-TEK® E3035T-2 Electrically Conductive Epoxy Product Description: EPO-TEK® E3035T-2 is a single component, silver-filled epoxy for semiconductor die attach, as well as SMD attach on hybrid circuits.Advantages & Application Notes: This epoxy c..
CTE, linear	42.0 µm/m-°C	23.3 µin/in-°F	Below Tg
Epoxy Technology EPO-TEK® H31D Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H31D is a single component, electrically conductive silver epoxy designed for die-bonding of semiconductors, including IC’s, resistors, capacitors, transistors, and d..
CTE, linear	42.0 µm/m-°C	23.3 µin/in-°F
Epoxyset Epoxiohm EO-98HT Electrically Conductive Epoxy Adhesive EO-98HT is a one component, electrically and thermally conductive, snap cure, die attach epoxy. It was designed for IC plastic packaging of semiconductors, hybrid micro-electronics, and photonic dev..
CTE, linear	42.0 µm/m-°C @Temperature 20.0 °C	23.3 µin/in-°F @Temperature 68.0 °F
Dow CYCLOTENE™ 3022-35 Bisbenzocyclobutene (BCB) Electronic Resin This product was developed for use as spin-on dieletric materials in microelectronic fabrication.Information provided by Dow
CTE, linear	42.0 µm/m-°C @Temperature 20.0 °C	23.3 µin/in-°F @Temperature 68.0 °F
Dow CYCLOTENE™ 3022-46 Bisbenzocyclobutene (BCB) Electronic Resin This product was developed for use as spin-on dieletric materials in microelectronic fabrication.Information provided by Dow
CTE, linear	42.0 µm/m-°C @Temperature 20.0 °C	23.3 µin/in-°F @Temperature 68.0 °F
Dow CYCLOTENE™ 3022-57 Bisbenzocyclobutene (BCB) Electronic Resin This product was developed for use as spin-on dieletric materials in microelectronic fabrication.Information provided by Dow
CTE, linear	42.0 µm/m-°C @Temperature 20.0 °C	23.3 µin/in-°F @Temperature 68.0 °F
Dow CYCLOTENE™ 3022-63 Bisbenzocyclobutene (BCB) Electronic Resin This product was developed for use as spin-on dieletric materials in microelectronic fabrication.Information provided by Dow
CTE, linear	42.0 µm/m-°C @Temperature 20.0 °C	23.3 µin/in-°F @Temperature 68.0 °F
Dow CYCLOTENE™ 4022-35 Advanced Electronic Resins (PhotoBisbenzocyclobutene BCB) CYCLOTENE™ 4022-35 advanced electronic resin is I-line-, G-line-, and broad band-sensitive photopolymer that has been developed for use as a dielectric in thin film microelectronic applications.Inf..
CTE, linear	42.0 µm/m-°C @Temperature 20.0 °C	23.3 µin/in-°F @Temperature 68.0 °F
Dow CYCLOTENE™ 4024-40 Advanced Electronic Resins (PhotoBisbenzocyclobutene BCB) CYCLOTENE™ 4024-40 advanced electronic resin is I-line-, G-line-, and broad band-sensitive photopolymer that has been developed for use as a dielectric in thin film microelectronic applications.Inf..
CTE, linear	42.0 µm/m-°C @Temperature 20.0 °C	23.3 µin/in-°F @Temperature 68.0 °F
Dow CYCLOTENE™ XU35075 Advanced Electronic Resins (PhotoBisbenzocyclobutene BCB) CYCLOTENE™ XU35075 advanced electronic resin is I-line-, G-line-, and broad band-sensitive photopolymer that has been developed for use as a dielectric in thin film microelectronic applications.Inf..
CTE, linear	42.0 µm/m-°C @Temperature 20.0 °C	23.3 µin/in-°F @Temperature 68.0 °F
Dow CYCLOTENE™ XU35132 Advanced Electronic Resins (PhotoBisbenzocyclobutene BCB) CYCLOTENE™ XU35132 advanced electronic resin is I-line-, G-line-, and broad band-sensitive photopolymer that has been developed for use as a dielectric in thin film microelectronic applications.Inf..
CTE, linear	42.0 µm/m-°C @Temperature 20.0 °C	23.3 µin/in-°F @Temperature 68.0 °F
Dow CYCLOTENE™ XU35133 Advanced Electronic Resins (PhotoBisbenzocyclobutene BCB) CYCLOTENE™ XU35133 advanced electronic resin is I-line-, G-line-, and broad band-sensitive photopolymer that has been developed for use as a dielectric in thin film microelectronic applications.Inf..
CTE, linear	42.0 µm/m-°C @Temperature -30.0 - 30.0 °C	23.3 µin/in-°F @Temperature -22.0 - 86.0 °F	ASTM D696
Beijing Chemical Industry KAIFA® 301-G20F PBT Resin 20% glass fiber reinforced, flame retardant, good flow, low bleedingInformation provided by Beijing Chemical Industry Research Institute (Group)
CTE, linear	42.0 µm/m-°C	23.3 µin/in-°F
Resinlab® EP1195 Flame Retardant Epoxy Casting Resin Resinlab™ EP1195 is a low viscosity, fast gelling, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File # E1..
CTE, linear	42.0 µm/m-°C @Temperature 40.0 - 130 °C	23.3 µin/in-°F @Temperature 104 - 266 °F	TMA; ASTM E831
Plenco 7552 Phenolic, Nodular, Transfer Molded PLENCO 07552 is a glass fiber reinforced novolac phenolic molding compound, exhibiting superior dimensional stability, good impact strength, and good electrical properties. Type ASTM 5948 MFH. UL re..