Thermal Properties | Metric | English | Comments |
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CTE, linear | 4.50 µm/m-°C @Temperature 20.0 - 400 °C |
2.50 µin/in-°F @Temperature 68.0 - 752 °F |
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Hogen Diemitechâ„¢ Tungsten-Based Metal Diemitech is a new tungsten-based material used for high temperature tooling, die casting, extrusion dies, hot upsetting, and electro brazing. It has a higher tungsten content than similar available.. |
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CTE, linear | 4.50 µm/m-°C @Temperature 20.0 - 400 °C |
2.50 µin/in-°F @Temperature 68.0 - 752 °F |
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Hogen HM1250 Tungsten-Based Metal Slightly Magnetic.Manufactured by powder metallurgy methods. The tungsten base offers high thermal conductivity and a low CTE which combine to resist thermal fatigue. The high melting point reduce.. |
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CTE, linear | 4.50 µm/m-°C @Temperature 20.0 - 400 °C |
2.50 µin/in-°F @Temperature 68.0 - 752 °F |
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Hogen HM3750 Tungsten-Based Metal Mil Spec T-21014D Class 4; ASTM B-777-99 Class 4; AMS T-21014 Class 4. Slightly Magnetic.Manufactured by powder metallurgy methods. The tungsten base offers high thermal conductivity and a low CTE.. |
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CTE, linear | 4.50 µm/m-°C | 2.50 µin/in-°F | at Set Pt. |
Ferro EG 2770 Specialty Glass Glass Type: Si-Al-Mg-Ca Typical Powder Form: TF Typical Application: Sintering Aid Ferro offers a wide range of compositions for specialty applications including sintering aids used in the glass-ph.. |
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CTE, linear | 4.50 µm/m-°C @Temperature 25.0 - 260 °C |
2.50 µin/in-°F @Temperature 77.0 - 500 °F |
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Ferro IP 820 Passivation Glasses (Pb-B-Si-Al; Pb-Si-Al; Si-Pb-Al Silicates) Glass Type: Pb-Si-Al Typical Powder Form: TF, REG, RWG, SRRG Ferro's passivation glasses are designed for use on transistors, thyristors, and diodes. These products are formulated and produced to a.. |
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CTE, linear | 4.50 µm/m-°C @Temperature 260 °C |
2.50 µin/in-°F @Temperature 500 °F |
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Ferro IX 2443 Passivation Glasses - High Voltage (Zn-B-Silicates) Typical Powder Form: RWG, DSD Zinc-Boro-Silicate passivation glasses are used for hermetic passivation of high voltage diodes, thyristors, and transistors. They provide high junction temperatures a.. |
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CTE, linear | 4.50 µm/m-°C @Temperature 260 °C |
2.50 µin/in-°F @Temperature 500 °F |
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Ferro IX 2683 Passivation Glasses - High Voltage (Zn-B-Silicates) Typical Powder Form: DSD Zinc-Boro-Silicate passivation glasses are used for hermetic passivation of high voltage diodes, thyristors, and transistors. They provide high junction temperatures and ca.. |
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CTE, linear | 4.50 µm/m-°C @Temperature 20.0 °C |
2.50 µin/in-°F @Temperature 68.0 °F |
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MarkeTech Neodymium Gallium Oxide (NdGaO3) Single Crystal Substrate Data provided by the supplier, MarkeTech International.Developed for deposition of III-V nitrides for LEDs, Lasers, etc. Standard orientation: ; GaN Lattice Mismatch 1.2%. |
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CTE, linear | 4.50 µm/m-°C @Temperature 0.000 - 30.0 °C |
2.50 µin/in-°F @Temperature 32.0 - 86.0 °F |
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Mateck Cadmium Telluride (CdTe) Optical crystals |
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CTE, linear | 4.50 µm/m-°C @Temperature 20.0 - 400 °C |
2.50 µin/in-°F @Temperature 68.0 - 752 °F |
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Mi-Tech Metals HD18.5 Tungsten-Based Metal Mil Spec T-21014D Class 4; ASTM B-777-99 Class 4; ASTM B-777-07 Class 4; AMS T-21014 Class 4. Slightly Magnetic.Manufactured by powder metallurgy methods. The tungsten base offers high thermal con.. |
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CTE, linear | 4.50 µm/m-°C @Temperature 25.0 - 260 °C |
2.50 µin/in-°F @Temperature 77.0 - 500 °F |
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Ferro IP 770 Passivation Glasses (Pb-B-Si-Al; Pb-Si-Al; Si-Pb-Al Silicates) Glass Type: Pb-Si-Al Typical Powder Form: TF, REG, RWG, SRRG Ferro's passivation glasses are designed for use on transistors, thyristors, and diodes. These products are formulated and produced to a.. |
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CTE, linear | 4.50 µm/m-°C @Temperature 20.0 - 300 °C |
2.50 µin/in-°F @Temperature 68.0 - 572 °F |
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Schott AF 45 Thin Borosilicate Glass AF 45 is an alkali-free modified borosilicate glass with a high content of BaO and Al2O3. AF 45 with, its specific properties and large range of different thicknesses with tight tolerances, is exc.. |
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CTE, linear | 4.50 µm/m-°C @Temperature -30.0 - 70.0 °C |
2.50 µin/in-°F @Temperature -22.0 - 158 °F |
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Schott G018-310 Dental Glass Remarks: Zr-containing, high refractive indexApplication: CompositeAdvantagesGreater variety of composition and refractive indiciesOutstanding transparencyBest radiopacitiesInformation Provided by S.. |
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CTE, linear | 4.50 µm/m-°C @Temperature 20.0 - 300 °C |
2.50 µin/in-°F @Temperature 68.0 - 572 °F |
ISO 7991 |
Schott Glass 8449 Intermediate Sealing Glass Intermediate sealing glass Sealing to the glasses 8412, 8447, and 8487Information provided by SCHOTT AG. |
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CTE, linear | 4.50 µm/m-°C @Temperature 20.0 - 300 °C |
2.50 µin/in-°F @Temperature 68.0 - 572 °F |
ISO 7991 |
Schott Glass 8652 Sealing Glass Tungsten sealing glass, lower sealing temperature than glass 8651 Power diodesInformation provided by SCHOTT AG. |
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CTE, linear | 4.50 µm/m-°C @Temperature 20.0 - 300 °C |
2.50 µin/in-°F @Temperature 68.0 - 572 °F |
ISO 7991 |
Schott NEO 1730 Alkaline Earth Aluminosilicate Glass Alkaline earth aluminosilicate glass for high temperature applications in electrical engineering, for sealing to molybdenum, free from alkali Bulb and exhaust tube for halogen lamps for automotive,.. |
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CTE, linear | 4.50 µm/m-°C @Temperature 20.0 °C |
2.50 µin/in-°F @Temperature 68.0 °F |
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Specialty Materials 5505 Boron Epoxy Prepreg Tape Specialty Materials' 5505 is a highly advanced prepreg tape, combining Specialty Materials' 4.0 or 5.6 mil boron filament with a tough, rigid, epoxy resin. Exhibiting exceptional performance at temp.. |
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CTE, linear | 4.50 µm/m-°C @Temperature 20.0 °C |
2.50 µin/in-°F @Temperature 68.0 °F |
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Specialty Materials 5521 Boron Epoxy Prepreg Tape Specialty Materials' 5521 is a highly advanced prepreg tape, combining Specialty Materials' 4.0 or 5.6 mil boron filament with a tough, rigid, epoxy resin. Performing at temperatures up to 350°F,.. |
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CTE, linear | 4.50 µm/m-°C @Temperature 20.0 °C |
2.50 µin/in-°F @Temperature 68.0 °F |
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Specialty Materials Boron Monofilament Exceptional compression strength. Specialty Materials' Chemical Vapor Deposition process uses fine tungsten wire for the substrate and boron trichloride gas as the boron source.Information prov.. |
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CTE, linear | 4.50 µm/m-°C @Temperature 22.8 - 260 °C |
2.50 µin/in-°F @Temperature 73.0 - 500 °F |
ASTM E831 |
Saint-Gobain Meldin® 7021 Direct Formed Graphite Filled Polyimide Finished parts and basic shapes made from 15% by weight graphite filled polyimide material for applications high wear resistance, good thermal oxidative stability, and high temperature resistance. .. |
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CTE, linear | 4.50 µm/m-°C @Temperature 23.0 - 85.0 °C |
2.50 µin/in-°F @Temperature 73.4 - 185 °F |
ASTM D696 |
Solvay TECHNYL® 2412GHF6 PA66, 33% glass fiber, DRY Description: Polyamid 66, reinforced with 33% of glass fiber, heat stabilized for injection moldingAvailable in: Asia PacificProduct Applications: TECHNYL® 2412GHF6 is used in all sectors of indu.. |
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CTE, linear | 4.50 µm/m-°C @Temperature 1000 °C |
2.50 µin/in-°F @Temperature 1830 °F |
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UBE Tyranno Grade SA Ceramic High Temperature Fiber Description: Tyranno Fiber is the continuous ceramic fiber consisting of Si, Ti or Zr,C and O. Advanced composites reinforced by the Tyranno Fiber are expected to play a very important role in the e.. |
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CTE, linear | 4.50 µm/m-°C @Temperature 25.0 - 1000 °C |
2.50 µin/in-°F @Temperature 77.0 - 1830 °F |
ASTM-C372 |
CoorsTek Boron Carbide Reaction-Bonded Boron Carbide Lowest density for ultra-lightweight designs |
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CTE, linear | 4.50 µm/m-°C @Temperature 1000 °C |
2.50 µin/in-°F @Temperature 1830 °F |
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Chosun Refractories SB85S Bricks, Oxide Bonded SiC Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET). |
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CTE, linear | 4.50 µm/m-°C @Temperature 20.0 - 1000 °C |
2.50 µin/in-°F @Temperature 68.0 - 1830 °F |
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Ceradyne CeraTrex™ SC-P2 Silicon Carbide Features:purity>99.9995%corrosion resistancewear resistancenear net shape fabrication to 400 mm OD Applications:semiconductor componentswear componentsInformation provided by Ceradyne Company |
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CTE, linear | 4.50 µm/m-°C @Temperature 20.0 - 1000 °C |
2.50 µin/in-°F @Temperature 68.0 - 1830 °F |
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Ceradyne CeraTrex™ SC-P3 Silicon Carbide Features:purity>99.9995%corrosion resistancewear resistancenear net shape fabrication to 400 mm OD Applications:semiconductor componentswear componentsInformation provided by Ceradyne Company |
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CTE, linear | 4.50 µm/m-°C @Temperature 27.0 - 175 °C |
2.50 µin/in-°F @Temperature 80.6 - 347 °F |
ASTM D696 |
3M 7993MP Hi-Performance Acrylic 200MP This adhesive meets the requirements of most long-term applications. It offers temperature resistance to 400°F (204°C). Peel adhesion values are excellent on most membrane switch substrate materia.. |
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CTE, linear | 4.50 µm/m-°C @Temperature 20.0 - 1000 °C |
2.50 µin/in-°F @Temperature 68.0 - 1830 °F |
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Ceradyne CeraTrex™ 146-S5 Silicon Carbide Features:corrosion resistancewear resistancehardnessnet shape fabricationApplications:wear componentsInformation provided by Ceradyne Company |
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CTE, linear | 4.50 µm/m-°C @Temperature 23.0 - 85.0 °C |
2.50 µin/in-°F @Temperature 73.4 - 185 °F |
ASTM D696 |
Solvay TECHNYL® 2411GF6 PA66, 30% glass fiber, DRY Description: Polyamid 66, 30% glass fiber reinforce, for injection moldingAvailable in: Asia PacificProduct Applications: TECHNYL® 2411GF6 used in all sectors of industry, offering an excellent com.. |
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CTE, linear | 4.50 µm/m-°C @Temperature <=1000 °C |
2.50 µin/in-°F @Temperature <=1830 °F |
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Acerde Tungsten Tungsten key properties: Very high density, High oxidation resistance, Highest melting point of all metals, Lowest vapor pressure of all metals, Highest elasticity modulus of the all metals, Hardest.. |