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Polymer Property : CTE, linear = 34.4 µin/in-°F Product List

Thermal Properties

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Thermal Properties Metric English Comments
CTE, linear 62.0 µm/m-°C
34.4 µin/in-°F
Resinlab® EP1112 Clear Electronic Grade Epoxy Encapsulant
Resinlab™ EP 1112 Clear is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexib..
CTE, linear 62.0 - 100 µm/m-°C
34.4 - 55.6 µin/in-°F
Average value: 74.0 µm/m-°C Grade Count:33
Overview of materials for Polycarbonate/ASA Alloy, Unreinforced
This property data is a summary of similar materials in the MatWeb database for the category "Polycarbonate/ASA Alloy, Unreinforced". Each property range of values reported is minimum and maximum va..
CTE, linear 62.0 µm/m-°C
34.4 µin/in-°F
DIN 52328
Isoflon PEI Polyetherimide
Materials with strong mechanical and electrical performances under high temperatures.Information provided by Isoflon.
CTE, linear 62.0 µm/m-°C

@Temperature 20.0 °C
34.4 µin/in-°F

@Temperature 68.0 °F
ASTM D696
A. Schulman POLYTROPE™ TPP 524 Injection Molding Grade Olefinic Thermoplastic Elastomer
DescriptionPolytrope TPP 524 is an injection molding grade olefinic thermoplastic elastomer. This mineral filled product is recommended for applications requiring high stiffness and low thermal exp..
CTE, linear 62.0 µm/m-°C

@Temperature 20.0 °C
34.4 µin/in-°F

@Temperature 68.0 °F
ASTM D696
A. Schulman POLYTROPE™ TPP 524 Injection Molding Grade Olefinic Thermoplastic Elastomer
DescriptionPolytrope TPP 524 is an injection molding grade olefinic thermoplastic elastomer. This mineral filled product is recommended for applications requiring high stiffness and low thermal exp..
CTE, linear 62.0 µm/m-°C
34.4 µin/in-°F
ASTM D696
Unitika L-1003PA
Heat resistance, creep resistance, and excellent lubricantInformation provided by Unitika Ltd.
CTE, linear 62.0 µm/m-°C
34.4 µin/in-°F
ASTM D696
Unitika P-1001 Engineering Plastic
P series resins are resins succeeding the characteristics of the neat polymer, U100, and improved in flowability and optical properties. Among many super engineering plastics, the resins are few tra..
CTE, linear 62.0 µm/m-°C

@Temperature 20.0 °C
34.4 µin/in-°F

@Temperature 68.0 °F
ASTM D696
A. Schulman POLYTROPE™ TPP 524 Injection Molding Grade Olefinic Thermoplastic Elastomer
DescriptionPolytrope TPP 524 is an injection molding grade olefinic thermoplastic elastomer. This mineral filled product is recommended for applications requiring high stiffness and low thermal exp..
CTE, linear 62.0 µm/m-°C

@Temperature 20.0 °C
34.4 µin/in-°F

@Temperature 68.0 °F
ASTM D696
A. Schulman POLYTROPE™ TPP 524 Injection Molding Grade Olefinic Thermoplastic Elastomer
DescriptionPolytrope TPP 524 is an injection molding grade olefinic thermoplastic elastomer. This mineral filled product is recommended for applications requiring high stiffness and low thermal exp..
CTE, linear 62.0 µm/m-°C

@Temperature 20.0 °C
34.4 µin/in-°F

@Temperature 68.0 °F
ASTM D696
A. Schulman POLYTROPE™ TPP 524 Injection Molding Grade Olefinic Thermoplastic Elastomer
DescriptionPolytrope TPP 524 is an injection molding grade olefinic thermoplastic elastomer. This mineral filled product is recommended for applications requiring high stiffness and low thermal exp..
CTE, linear 62.0 µm/m-°C
34.4 µin/in-°F
Below Tg
Tra-Con Tra-Bond F112 Fiber Optic Epoxy Adhesive
TRA-BOND F112 is a long pot life, impact resistant, fiber-optic adhesive. This two-part, low viscosity epoxy has the distinct advantage of remaining below 3000 cps for a minimum of 40 minutes. This ..
CTE, linear 62.0 µm/m-°C

@Temperature 20.0 °C
34.4 µin/in-°F

@Temperature 68.0 °F
Tra-Con Tra-Cast 3012 Clear Epoxy Casting Compound
TRA-CAST 3012 is a clear, low viscosity epoxy casting compound recommended for industrial embedding and casting applications where its combination of superior properties good clarity, long pot life,..
CTE, linear 62.0 µm/m-°C
34.4 µin/in-°F
ASTM D696
Unitika L-8005
Chemical resistance, and excellent lubricant propertyInformation provided by Unitika Ltd.
CTE, linear 62.0 µm/m-°C
34.4 µin/in-°F
ASTM D696
Unitika P-1001A Engineering Plastic
P series resins are resins succeeding the characteristics of the neat polymer, U100, and improved in flowability and optical properties. Among many super engineering plastics, the resins are few tra..
CTE, linear 62.0 µm/m-°C
34.4 µin/in-°F
Epoxyset Epoxiohm EO-21M-5 Electrically Conductive Epoxy Adhesive
EO-21M-5 is an electrically conductive & thermally conductive, silver filled epoxy adhesive. This two component system is designed to be cured at room temperature or the cure can be accelerated by e..
CTE, linear 62.0 µm/m-°C

@Temperature 50.0 - 150 °C
34.4 µin/in-°F

@Temperature 122 - 302 °F
Dow SiLK™ I 1070 Semiconductor Dielectric Resin
SiLK™ I 1070 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 1070 is compatible wi..
CTE, linear 62.0 µm/m-°C

@Temperature 50.0 - 150 °C
34.4 µin/in-°F

@Temperature 122 - 302 °F
Dow SiLK™ I 130 Semiconductor Dielectric Resin
SiLK™ I 130 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 130 is compatible with..
CTE, linear 62.0 µm/m-°C

@Temperature 50.0 - 150 °C
34.4 µin/in-°F

@Temperature 122 - 302 °F
Dow SiLK™ I 1500 Semiconductor Dielectric Resin
SiLK™ I 1500 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 1500 is compatible wi..
CTE, linear 62.0 µm/m-°C

@Temperature 50.0 - 150 °C
34.4 µin/in-°F

@Temperature 122 - 302 °F
Dow SiLK™ I 550 Semiconductor Dielectric Resin
SiLK™ I 550 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 550 is compatible with..
CTE, linear 62.0 µm/m-°C

@Temperature 50.0 - 150 °C
34.4 µin/in-°F

@Temperature 122 - 302 °F
Dow SiLK™ I 820 Semiconductor Dielectric Resin
SiLK™ I 820 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 820 is compatible with..
CTE, linear 62.0 µm/m-°C

@Temperature 50.0 - 150 °C
34.4 µin/in-°F

@Temperature 122 - 302 °F
Dow SiLK™ I300 280 Semiconductor Dielectric Resin
SiLK™ I300 280 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 280 is compatibl..
CTE, linear 62.0 µm/m-°C

@Temperature 50.0 - 150 °C
34.4 µin/in-°F

@Temperature 122 - 302 °F
Dow SiLK™ I300 380 Semiconductor Dielectric Resin
SiLK™ I300 380 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 380 is compatibl..
CTE, linear 61.9 µm/m-°C
34.4 µin/in-°F
ASTM D-3386
CMT Materials REN Shape® 440 Tooling Board, Modeling Board, Adhesive Products
CMT Materials offers the complete line of REN Shape tooling board, modeling board, and related adhesive products. Vacuum formers and thermoformers use these products as prototype and low volume prod..
CTE, linear 62.0 µm/m-°C

@Temperature 50.0 - 410 °C
34.4 µin/in-°F

@Temperature 122 - 770 °F
Dow SiLK™ I 260 Semiconductor Dielectric Resin
SiLK™ I 260 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 260 is compatible with..
CTE, linear 62.0 µm/m-°C

@Temperature 50.0 - 150 °C
34.4 µin/in-°F

@Temperature 122 - 302 °F
Dow SiLK™ I300 140 Semiconductor Dielectric Resin
SiLK™ I300 140 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 140 is compatibl..
CTE, linear 61.9 µm/m-°C
34.4 µin/in-°F
Atom Adhesives AA-BOND F112 Epoxy Adhesive
AA-BOND F112 is an impact resistant, fiber-optic adhesive. AA-BOND F112 is two-part, low viscosity epoxy has the distinct advantage of remaining below 3000 cps for a minimum of 40 minutes. AA-BOND F..
CTE, linear 62.0 µm/m-°C
34.4 µin/in-°F
Below Tg
Tra-Con Tra-Bond 872-3 Flexible Epoxy Adhesive
TRA-BOND 872-3 transparent, flexible epoxy adhesive is designed for bonding materials with mismatched coefficients of thermal expansion. The long working life of this adhesive makes it ideal for use..
CTE, linear 62.0 µm/m-°C
34.4 µin/in-°F
ASTM D696
Unitika P-3001 Engineering Plastic
P series resins are resins succeeding the characteristics of the neat polymer, U100, and improved in flowability and optical properties. Among many super engineering plastics, the resins are few tra..
CTE, linear 62.0 µm/m-°C
34.4 µin/in-°F
ASTM D696
Unitika U-8000
U series resins are polymer alloys that are improved in resistance to oils and chemicals, the shortcoming of amorphous resins. They are transparent and have a greater moisture blocking property than..
CTE, linear 62.0 µm/m-°C
34.4 µin/in-°F
Resinlab® EP1112 Black Electronic Grade Epoxy Encapsulant
Resinlab™ EP 1112 Black is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexib..
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