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Polymer Property : CTE, linear = 29.0 µm/m-°C Product List

Thermal Properties

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Thermal Properties Metric English Comments
CTE, linear 29.0 µm/m-°C
16.1 µin/in-°F
ISO 11359-2
Polyplastic Armlen® PP GF 20-1EX Polypropylene Copolymer, 20% Glass Fiber
Information provided by PolyPlastic Group.
CTE, linear 29.0 - 53.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
16.1 - 29.4 µin/in-°F

@Temperature -22.0 - 86.0 °F
TMA
SABIC Innovative Plastics Lexan® LGN2000 PC (Asia Pacific)
CTE, linear 29.0 - 53.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
16.1 - 29.4 µin/in-°F

@Temperature -22.0 - 86.0 °F
TMA
SABIC Innovative Plastics Lexan® 3412 PC (Asia Pacific)
This data was supplied by SABIC-IP for the Asia Pacific region.
CTE, linear 29.0 µm/m-°C

@Temperature 20.0 °C
16.1 µin/in-°F

@Temperature 68.0 °F
Indium Corp. Indalloy 170 Pure Lead
Information Provided by Indium Corporation
CTE, linear 29.0 µm/m-°C

@Temperature 20.0 °C
16.1 µin/in-°F

@Temperature 68.0 °F
Indium Corp. Indalloy® 151 Pb-Sn-Ag Solder Alloy
Similar to Indalloy #165 (Standard lead-silver-tin eutectic solder with wide application in semiconductor assembly.)Information provided by the manufacturer, Indium Corporation.
CTE, linear 29.0 µm/m-°C

@Temperature 20.0 °C
16.1 µin/in-°F

@Temperature 68.0 °F
Indium Corp. Indalloy® 228 Pb-Sn-Ag Solder Alloy
(Sn10) High temp solder. Not recommended for applications above 120°C, due to formation of eutectic.Information provided by the manufacturer, Indium Corporation.
CTE, linear 29.0 µm/m-°C

@Temperature 20.0 °C
16.1 µin/in-°F

@Temperature 68.0 °F
Indium Corp. Indalloy® 4 Pure Indium Solder
Soft, ductile metal has good wettability on many surfaces including ceramics, glass and quartz. Deforms indefinitely under load and has no tendency to become brittle, making it valuable for cryogeni..
CTE, linear 29.0 µm/m-°C

@Temperature 20.0 °C
16.1 µin/in-°F

@Temperature 68.0 °F
Indium Corp. Indalloy 11 Lead Solder Alloy
Information Provided by Indium Corporation
CTE, linear 29.0 µm/m-°C

@Temperature 20.0 °C
16.1 µin/in-°F

@Temperature 68.0 °F
Indium Corp. Indalloy 242 Tin-Lead Solder Alloy
Information Provided by Indium Corporation
CTE, linear 29.0 µm/m-°C

@Temperature 20.0 °C
16.1 µin/in-°F

@Temperature 68.0 °F
Indium Corp. Indalloy® 159 Pb-Sn Solder Alloy
High temp solder for BGA applications.Information provided by the manufacturer, Indium Corporation.
CTE, linear 29.0 - 53.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
16.1 - 29.4 µin/in-°F

@Temperature -22.0 - 86.0 °F
TMA
SABIC Innovative Plastics LNP THERMOCOMP Lexan_LGN2000 PC (Asia Pacific)
CTE, linear 29.0 µm/m-°C

@Temperature 20.0 °C
16.1 µin/in-°F

@Temperature 68.0 °F
Williams Advanced Alloys WS314 Solder
All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys
CTE, linear 29.0 µm/m-°C
16.1 µin/in-°F
Below Tg
Epoxy Technology EPO-TEK® 320 Optical, Opaque Epoxy
Product Description: EPO-TEK® 320 is a two component, black-colored and optically opaque epoxy designed for optical, medical, and optoelectronic packaging of semiconductor devices and components. ..
CTE, linear 29.0 µm/m-°C
16.1 µin/in-°F
Below Tg
Epoxy Technology EPO-TEK® H27D Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H27D is a two component, silver-filled epoxy adhesive designed for semiconductor and hybrid-microelectronic packaging applications.Advantages & Application Notes: Rheo..
CTE, linear 29.0 µm/m-°C

@Temperature -40.0 - 120 °C
16.1 µin/in-°F

@Temperature -40.0 - 248 °F
ASTM E831
Azdel Plus R451-B02 45% Continuous Random Fiber Mat / PP Resin Matrix
AZDEL® R451-B01 is a glass mat thermoplastic laminate based upon a random oriented continuous fiber mat contained within a polypropylene resin matrix. This composite material features high flow pr..
CTE, linear 29.0 µm/m-°C

@Temperature 20.0 °C
16.1 µin/in-°F

@Temperature 68.0 °F
AIM 100In Solder for Photonic Packaging
Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials.
CTE, linear 29.0 µm/m-°C

@Temperature 20.0 °C
16.1 µin/in-°F

@Temperature 68.0 °F
TMA; ASTM E831
LNP Thermocomp® JF-1006 E LE BK8-055 Polyethersulfone, Glass Fiber Reinforcement  (discontinued **)
Features: High Viscosity, Low ExtractablesForms: PelletsProcessing Method: Injection MoldingInformation provided by LNP, a GE Plastics Company.This data sheet is labeled Discontinued; however many L..
CTE, linear 29.0 µm/m-°C

@Thickness 1.60 mm
16.1 µin/in-°F

@Thickness 0.0630 in
ASTM D696
E-Polymers SEPAZ® K130HF 30% Glass Fiber Reinforced High Flow PPS Resin
Polyphenylene Sulfide Resin: High-performance engineering plastic SEPAZ PPS boasts excellent high-temperature resistance, flame retardancy and chemical resistance, physical strength, and its fluidit..
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