Thermal Properties | Metric | English | Comments |
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CTE, linear | 29.0 µm/m-°C | 16.1 µin/in-°F | ISO 11359-2 |
Polyplastic Armlen® PP GF 20-1EX Polypropylene Copolymer, 20% Glass Fiber Information provided by PolyPlastic Group. |
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CTE, linear | 29.0 - 53.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
16.1 - 29.4 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
SABIC Innovative Plastics Lexan® LGN2000 PC (Asia Pacific) |
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CTE, linear | 29.0 - 53.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
16.1 - 29.4 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
SABIC Innovative Plastics Lexan® 3412 PC (Asia Pacific) This data was supplied by SABIC-IP for the Asia Pacific region. |
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CTE, linear | 29.0 µm/m-°C @Temperature 20.0 °C |
16.1 µin/in-°F @Temperature 68.0 °F |
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Indium Corp. Indalloy 170 Pure Lead Information Provided by Indium Corporation |
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CTE, linear | 29.0 µm/m-°C @Temperature 20.0 °C |
16.1 µin/in-°F @Temperature 68.0 °F |
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Indium Corp. Indalloy® 151 Pb-Sn-Ag Solder Alloy Similar to Indalloy #165 (Standard lead-silver-tin eutectic solder with wide application in semiconductor assembly.)Information provided by the manufacturer, Indium Corporation. |
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CTE, linear | 29.0 µm/m-°C @Temperature 20.0 °C |
16.1 µin/in-°F @Temperature 68.0 °F |
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Indium Corp. Indalloy® 228 Pb-Sn-Ag Solder Alloy (Sn10) High temp solder. Not recommended for applications above 120°C, due to formation of eutectic.Information provided by the manufacturer, Indium Corporation. |
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CTE, linear | 29.0 µm/m-°C @Temperature 20.0 °C |
16.1 µin/in-°F @Temperature 68.0 °F |
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Indium Corp. Indalloy® 4 Pure Indium Solder Soft, ductile metal has good wettability on many surfaces including ceramics, glass and quartz. Deforms indefinitely under load and has no tendency to become brittle, making it valuable for cryogeni.. |
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CTE, linear | 29.0 µm/m-°C @Temperature 20.0 °C |
16.1 µin/in-°F @Temperature 68.0 °F |
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Indium Corp. Indalloy 11 Lead Solder Alloy Information Provided by Indium Corporation |
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CTE, linear | 29.0 µm/m-°C @Temperature 20.0 °C |
16.1 µin/in-°F @Temperature 68.0 °F |
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Indium Corp. Indalloy 242 Tin-Lead Solder Alloy Information Provided by Indium Corporation |
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CTE, linear | 29.0 µm/m-°C @Temperature 20.0 °C |
16.1 µin/in-°F @Temperature 68.0 °F |
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Indium Corp. Indalloy® 159 Pb-Sn Solder Alloy High temp solder for BGA applications.Information provided by the manufacturer, Indium Corporation. |
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CTE, linear | 29.0 - 53.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
16.1 - 29.4 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
SABIC Innovative Plastics LNP THERMOCOMP Lexan_LGN2000 PC (Asia Pacific) |
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CTE, linear | 29.0 µm/m-°C @Temperature 20.0 °C |
16.1 µin/in-°F @Temperature 68.0 °F |
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Williams Advanced Alloys WS314 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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CTE, linear | 29.0 µm/m-°C | 16.1 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® 320 Optical, Opaque Epoxy Product Description: EPO-TEK® 320 is a two component, black-colored and optically opaque epoxy designed for optical, medical, and optoelectronic packaging of semiconductor devices and components. .. |
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CTE, linear | 29.0 µm/m-°C | 16.1 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® H27D Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H27D is a two component, silver-filled epoxy adhesive designed for semiconductor and hybrid-microelectronic packaging applications.Advantages & Application Notes: Rheo.. |
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CTE, linear | 29.0 µm/m-°C @Temperature -40.0 - 120 °C |
16.1 µin/in-°F @Temperature -40.0 - 248 °F |
ASTM E831 |
Azdel Plus R451-B02 45% Continuous Random Fiber Mat / PP Resin Matrix AZDEL® R451-B01 is a glass mat thermoplastic laminate based upon a random oriented continuous fiber mat contained within a polypropylene resin matrix. This composite material features high flow pr.. |
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CTE, linear | 29.0 µm/m-°C @Temperature 20.0 °C |
16.1 µin/in-°F @Temperature 68.0 °F |
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AIM 100In Solder for Photonic Packaging Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials. |
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CTE, linear | 29.0 µm/m-°C @Temperature 20.0 °C |
16.1 µin/in-°F @Temperature 68.0 °F |
TMA; ASTM E831 |
LNP Thermocomp® JF-1006 E LE BK8-055 Polyethersulfone, Glass Fiber Reinforcement
(discontinued **) Features: High Viscosity, Low ExtractablesForms: PelletsProcessing Method: Injection MoldingInformation provided by LNP, a GE Plastics Company.This data sheet is labeled Discontinued; however many L.. |
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CTE, linear | 29.0 µm/m-°C @Thickness 1.60 mm |
16.1 µin/in-°F @Thickness 0.0630 in |
ASTM D696 |
E-Polymers SEPAZ® K130HF 30% Glass Fiber Reinforced High Flow PPS Resin Polyphenylene Sulfide Resin: High-performance engineering plastic SEPAZ PPS boasts excellent high-temperature resistance, flame retardancy and chemical resistance, physical strength, and its fluidit.. |