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Polymer Property : CTE, linear = 26.1 µin/in-°F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 47.0 µm/m-°C @Temperature 23.0 - 60.0 °C |
26.1 µin/in-°F @Temperature 73.4 - 140 °F |
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| Omnia Plastica PEEK Polyetheretherketone Semicrystalline polymer. Material with high mechanical and thermal properties, up to 240°C. It resists to creep under load and to wear, its friction coefficient is low. The temperature resistance w.. |
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| CTE, linear | 47.0 µm/m-°C | 26.1 µin/in-°F | MD, below Tg; ASTM D696 |
| Victrex® APTIV® 1000-050 Polyetheretherketone (PEEK) Polymer Film, Semi-Crystalline APTIV PEEK 1000 series films are the unfilled semi-crystalline films made from VICTREX® PEEK polymer. The film provides a material solution for engineers in ultra-high performance applications.APTI.. |
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| CTE, linear | 47.0 µm/m-°C @Temperature 20.0 °C |
26.1 µin/in-°F @Temperature 68.0 °F |
NOVA |
| NOVA Chemicals Dylark® 480P20 High Performance Glass Filled Styrenic Very high modulus, High heat resistance, Excellent flow characteristics, Excellent adhesion to urethaneApplications: Instrument panel substrates, consoles, Cluster housing, interior trimInjection Sp.. |
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| CTE, linear | 47.0 µm/m-°C @Temperature 20.0 °C |
26.1 µin/in-°F @Temperature 68.0 °F |
TMA; ASTM E831 |
| LNP Lubricomp® EL-4030 Polyetherimide, PTFE Additive
(discontinued **) Features: LubricatedForms: PelletsProcessing Method: Injection MoldingInformation provided by LNP, a GE Plastics Company.This data sheet is labeled Discontinued; however many LNP grades are still ac.. |
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| CTE, linear | 47.0 µm/m-°C | 26.1 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1105-7301 PEEK, unreinforced, laser markable Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Especially suitable for medical parts, superheated steam sterilizable, hydrolysis resistan.. |
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| CTE, linear | 47.0 µm/m-°C @Temperature 20.0 °C |
26.1 µin/in-°F @Temperature 68.0 °F |
DIN 53752 |
| GEHR Plastics PEEK Polyetheretherketone Polyether etherketone can be used at very high temperatures and it shows good mechanical strength, toughness, hardness, flexural strength, and torsional strength. PEEK exhibits excellent chemical re.. |
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| CTE, linear | 47.0 µm/m-°C | 26.1 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1105/BK0873 PEEK, unreinforced Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.High chemical resistance parts, non flammable.Especially suitable for medical parts, super.. |
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| CTE, linear | 47.0 µm/m-°C | 26.1 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1105-7018/GN PEEK, unreinforced Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Especially suitable for medical parts, superheated steam sterilizable, hydrolysis resistan.. |
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| CTE, linear | 47.0 µm/m-°C @Temperature -30.0 - 100 °C |
26.1 µin/in-°F @Temperature -22.0 - 212 °F |
ASTM D696 |
| LyondellBasell Hifaxâ„¢ RTA3263EC/1 Thermoplastic Polyolefin Elastomer Description: Hifaxâ„¢ RTA3263EC/1 fractional melt flow, 1,700 MPa flexural modulus, mineral-filled, extrusion grade thermoplastic elastomeric olefin (TEO) resin has an excellent balance of stiffn.. |
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| CTE, linear | 47.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
26.1 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM D696 |
| LyondellBasell Hifaxâ„¢ TRA-3263EC/1 Thermoplastic Olefin Resin Key Features: fractional melt flow, high modulus, extrusion grade thermoplastic olefin resin, high flexural modulus, high impact strength, good surface appearance, excellent processabilityApplicatio.. |
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| CTE, linear | 47.0 µm/m-°C @Temperature 40.0 - 130 °C |
26.1 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
| Plenco 3356 Phenolic, Granular, Injection Molded PLENCO 03356 is a mineral filled phenolic molding compound offering excellent arc resistance, comparative tracking, and flame resistant properties. UL recognized under component file E40654. 03356 i.. |
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| CTE, linear | 47.0 µm/m-°C @Temperature 40.0 - 130 °C |
26.1 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
| Plenco 3509 Phenolic, Granular, Transfer Molded PLENCO 03509 is a mineral and flock filled phenolic molding compound offering excellent electrical properties, dimensional stability, and improved heat resistance. UL recognized under component file.. |
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| CTE, linear | 47.0 µm/m-°C @Temperature 20.0 °C |
26.1 µin/in-°F @Temperature 68.0 °F |
DIN 53752 |
| Zell-Metall Engineering Plastics Zellamid 1500 (PEEK) Zellamid® 1500 (Polyetheretherketone - PEEK, natural) is the registered trademark for Zell-Metall’s semi-crystalline high performance thermoplastic which exhibits a unique combination of high m.. |
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| CTE, linear | 47.0 µm/m-°C @Temperature 20.0 °C |
26.1 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Zeus PEEK Tubing PEEK (polyetheretherketone) is a high-performance engineered polymer with excellent endurance to heat and one of the highest strength-to-weight ratios of any thermoplastic. This material can be used.. |
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| CTE, linear | 47.0 µm/m-°C | 26.1 µin/in-°F | Below Tg |
| Tra-Con Tra-Bond Ablebond 933-1.5 Moisture Resistant Encapsulant TRA-BOND 933-1.5 electrically insulating epoxy encapsulant is formulated to provide a smooth crown over the device of wire bonds. This encapsulant provides protection from thermal and mechanical sho.. |
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| CTE, linear | 47.0 µm/m-°C @Temperature 20.0 °C |
26.1 µin/in-°F @Temperature 68.0 °F |
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| Tra-Con Tra-Bond FDA22 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-22 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admini.. |
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| CTE, linear | 47.0 µm/m-°C @Temperature 20.0 °C |
26.1 µin/in-°F @Temperature 68.0 °F |
|
| Tra-Con Tra-Bond FDA22BK01 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-22BK01 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance. This two-part black adhesive is easily mixed, used and cured at .. |
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| CTE, linear | 47.0 µm/m-°C @Temperature 20.0 °C |
26.1 µin/in-°F @Temperature 68.0 °F |
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| Tra-Con Tra-Bond FDA23 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-23 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admini.. |
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| CTE, linear | 47.0 µm/m-°C | 26.1 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® H35-175MPLV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MPLV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-el.. |
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| CTE, linear | 47.0 µm/m-°C | 26.1 µin/in-°F | |
| Hippe PEEK Polyetheretherketone PEEK is a crystalline, easily machinable thermoplastic which is characterized by high tensile and constant good electrical properties between 0°-220°C, as well as due to favorable tribological beh.. |
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| CTE, linear | 47.0 µm/m-°C | 26.1 µin/in-°F | y direction |
| Arlon IsoClad 917 Non-Woven Fiberglass Reinforced PTFE Traditional - Highest Performance, PTFE Coated Light Woven Glass Styles, Interdispersed PTFE FilmInformation provided by Arlon Materials for Electronics (MED). |
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| CTE, linear | 47.0 µm/m-°C @Temperature -18.0 - 27.0 °C |
26.1 µin/in-°F @Temperature -0.400 - 80.6 °F |
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| 3M Scotch-Weld™ EC-2086 Structural Adhesive 3M™ Scotch-Weld™ Structural Adhesive EC-2086 is a one-part, 100% solids thermosetting liquid adhesives.Information provided by 3M |
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| CTE, linear | 47.0 µm/m-°C | 26.1 µin/in-°F | |
| Atom Adhesives AA-BOND FDA22 Epoxy Adhesive AA-BOND FDA22 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Administ.. |
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| CTE, linear | 47.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
26.1 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM D696 |
| Beijing Chemical Industry KAIFA® 301-G15F PBT Resin 15% glass fiber reinforced, flame retardant, good flow, low bleedingInformation provided by Beijing Chemical Industry Research Institute (Group) |
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| CTE, linear | 47.0 µm/m-°C | 26.1 µin/in-°F | |
| Resinlab® EP1306 Acrylic / Epoxy Hybrid Adhesive EP1306 is a two part acrylic / epoxy hybrid adhesive utilizing a 50% weight loading of aluminum powder into both components. It cures quickly at room temperature to a tough, rigid polymer. It has go.. |
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