Polymer Property : CTE, linear = 21.7 µin/in-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	39.0 µm/m-°C @Thickness 1.00 mm, Temperature -125 - 20.0 °C	21.7 µin/in-°F @Thickness 0.0394 in, Temperature -193 - 68.0 °F	ASTM E831-06
NeXolve Novastrat® 400 Polyimide Colorless polyimide with high temperature stability.NeXolve Novastrat® 400 is a colorless polyimide with a higher temperature stability than NeXolve’s LaRC™CP1, exhibiting a glass transition temp..
CTE, linear	39.0 - 58.0 Âµm/m-Â°C @Temperature -30.0 - 30.0 Â°C	21.7 - 32.2 Âµin/in-Â°F @Temperature -22.0 - 86.0 Â°F	TMA
SABIC Innovative Plastics NORYL NC208 PPE+HIPS (Asia Pacific)
CTE, linear	39.0 Âµm/m-Â°C	21.7 Âµin/in-Â°F	ASTM D696
Saint-Gobain MeldinÂ® 3110 Thermoplastic Bearing Material 3110 has a very low coefficient of friction and is particularly well suited for use with soft mating surface materials such as aluminum and soft stainless steel. MeldinÂ® 3100 materials have exce..
CTE, linear	39.0 µm/m-°C	21.7 µin/in-°F	Below Tg
Epoxy Technology EPO-TEK® 301 Spectrally Transparent Epoxy Product Description: EPO-TEK® 301 is a two component, room temperature curing epoxy featuring very low viscosity, and excellent optical-mechanical properties.Advantages & Application Notes: Semicon..
CTE, linear	39.0 µm/m-°C	21.7 µin/in-°F	Below Tg
Epoxy Technology EPO-TEK® 330 Low Viscosity, Optical Epoxy Product Description: EPO-TEK® 330 is a two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications.Advan..
CTE, linear	39.0 µm/m-°C	21.7 µin/in-°F	Below Tg
Epoxy Technology EPO-TEK® 360 Low Viscosity Optical Epoxy Adhesive Product Description: EPO-TEK® 360 is a two component, high-temperature grade epoxy for semiconductor, electronics, fiber optics and medical applications.Advantages & Application Notes: Built in col..
CTE, linear	39.0 µm/m-°C	21.7 µin/in-°F	Below Tg
Epoxy Technology EPO-TEK® E2036 Epoxy Product Description: A two component, slightly flexible, silver-filled, electrically conductive adhesive for semiconductor and electronic assemblies. It is a low Tg epoxy, intended for many kinds o..
CTE, linear	39.0 µm/m-°C	21.7 µin/in-°F	Below Tg
Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.Advantages & Application Notes: A smooth, ..
CTE, linear	39.0 µm/m-°C	21.7 µin/in-°F	Silicone Property; ASTM E 831
Arlon Thermabond® R36300W008 0.008" (0.203 mm) Uncured Silicone Rubber with PTFE Coated Fiberglass Carrier Description: Low Outgassing, Thermally Conductive, Electrically Insulating, Thermabond® Bonds without primerRecommended Primers: Dow Corning S2260Design/Construction: Liner: FEP Product: Uncured S..
CTE, linear	39.0 µm/m-°C	21.7 µin/in-°F	Silicone Property; ASTM E 831
Arlon Thermabond® R36300W015 0.015" (0.381 mm) Uncured Silicone Rubber with PTFE Coated Fiberglass Carrier Design/Construction: Liner: FEP Product: Uncured Silicone Rubber Carrier: PTFE Coated FiberglassRecommended Primers: Dow Corning S2260Appearance: White silicone gumThis data represents typical val..
CTE, linear	39.0 µm/m-°C @Temperature -50.0 - 50.0 °C	21.7 µin/in-°F @Temperature -58.0 - 122 °F
Abatron AboCast 8708-10 One-Component Structural/Dielectric Epoxy AboCast 8708-10 is a highly filled, class H (180°C) structural, castable adhesive compound for FAST high-temperature curing. Suggested Uses: Structural bonding; Casting; Potting; Encapsulating; Em..
CTE, linear	39.0 µm/m-°C @Temperature -50.0 - 50.0 °C	21.7 µin/in-°F @Temperature -58.0 - 122 °F
Abatron AboCast 8708-6 One-Component Structural/Dielectric Epoxy AboCast 8708-6 is a highly filled, class H (180°C) structural, castable adhesive compound for SLOW high-temperature curing. Suggested Uses: Structural bonding; Casting; Potting; Encapsulating; Emb..
CTE, linear	39.0 µm/m-°C @Temperature -50.0 - 50.0 °C	21.7 µin/in-°F @Temperature -58.0 - 122 °F
Abatron AboCast 8708-9 One-Component Structural/Dielectric Epoxy AboCast 8708-9 is a highly filled, class H (180°C) structural, castable adhesive compound for FASTER high-temperature curing. Suggested Uses: Structural bonding; Casting; Potting; Encapsulating; E..