Polymer Property : CTE, linear = 185 µm/m-°C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	185 µm/m-°C @Temperature 23.0 - 100 °C	103 µin/in-°F @Temperature 73.4 - 212 °F
Quadrant EPP Borotron® UH PE-UHMW + boron based additive (ISO Data) Borotron UH and Borotron HM are boron loaded PE-(U)HMW grades, specifically developed for neutron shielding purposes in nuclear installations. The high hydrogen content of PE-(U)HMW makes it very su..
CTE, linear	185 µm/m-°C	103 µin/in-°F	Above Tg
Tra-Con Tra-Bond 216D02 Thixotropic No-Sag Epoxy Adhesive TRA-BOND 216D02 is a thixotropic, two part epoxy adhesive formulated specifically for applications where a nonsagging adhesive is required. TRA-BOND 216D02 works in concert with TRA-CAST 3135 to per..
CTE, linear	185 µm/m-°C	103 µin/in-°F	Above Tg
Epoxy Technology EPO-TEK® OG178 UV Cure Optical Epoxy Material Description: A single component, UV/visible shifted light curable epoxy, designed for adhesive, sealing, coating and encapsulating applications found in semiconductor, electro-optics, fiber..