Thermal Properties | Metric | English | Comments |
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CTE, linear | 32.0 µm/m-°C @Temperature 20.0 °C |
17.8 µin/in-°F @Temperature 68.0 °F |
TMA; ASTM E831 |
LNP Stat-Kon® PDX-E-99689 CCS Polyetherimide, Carbon Fiber Reinforcement
(discontinued **) Features: Low to None Ion Content, Electrically ConductiveForms: PelletsProcessing Method: Injection MoldingInformation provided by LNP, a GE Plastics Company.This data sheet is labeled Discontinued.. |
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CTE, linear | 32.0 - 38.0 µm/m-°C @Temperature 40.0 - 130 °C |
17.8 - 21.1 µin/in-°F @Temperature 104 - 266 °F |
Average value: 34.0 µm/m-°C Grade Count:3 |
Overview of materials for Phenolic, Novolac, Mineral/Graphite Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Mineral/Graphite Filled". Each property range of values reported is minimum and maxim.. |
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CTE, linear | 32.0 - 90.0 µm/m-°C | 17.8 - 50.0 µin/in-°F | Average value: 67.0 µm/m-°C Grade Count:6 |
Overview of materials for Nylon, Amorphous Transparent Alloy This property data is a summary of similar materials in the MatWeb database for the category "Nylon, Amorphous Transparent Alloy". Each property range of values reported is minimum and maximum value.. |
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CTE, linear | 32.0 µm/m-°C | 17.8 µin/in-°F | Alpha 1 |
Lord Adhesives Thermosetâ„¢ ME-541 Underfill Encapsulant LORD Thermosetâ„¢ ME-541 encapsulant is an anhydride free, high purity, semi-conductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip chip devi.. |
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CTE, linear | 32.0 µm/m-°C | 17.8 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 50/GF/20/TF/20/BK 100 Polycarbonate, with glass fiber and PTFE Applications: Data processing machinery, precision engineering, film and photo industry, sporting and leisure goods, medical enineering.High-strength and high-stiff parts; low coefficient of expansi.. |
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CTE, linear | 32.0 µm/m-°C | 17.8 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 50/GF/20/TF/20/GY Polycarbonate, with glass fiber and PTFE Applications: Data processing machinery, precision engineering, film and photo industry, sporting and leisure goods, medical enineering.High-strength and high-stiff parts; low coefficient of expansi.. |
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CTE, linear | 32.0 µm/m-°C @Temperature 23.0 - 85.0 °C |
17.8 µin/in-°F @Temperature 73.4 - 185 °F |
ASTM E831 |
Solvay Technyl® C 216 Nylon 6, 30% Glass Fiber, EH0 Polyamide PA6, reinforced with 30% of glass fiber, for injection molding.It has good mechanical properties. It is used in all sectors of industry, offering an excellent combination between thermal .. |
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CTE, linear | 32.0 µm/m-°C @Temperature -30.0 - 100 °C |
17.8 µin/in-°F @Temperature -22.0 - 212 °F |
ASTM D696 |
A. Schulman POLYTROPE™ TPP 620 Olefinic Elastomer DescriptionPolytrope TPP 620is an olefinic elastomer developed to exhibit very low thermal expansion, high DOI on painted parts with good low temperature impact properties. ApplicationTPP 620 is des.. |
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CTE, linear | 32.0 µm/m-°C @Temperature -30.0 - 80.0 °C |
17.8 µin/in-°F @Temperature -22.0 - 176 °F |
Borealis Method |
Borealis Daplen™ KB4436 Polypropylene TPO Compound Daplen™ KB4436 is a 30% mineral filled elastomer modified polypropylene compound intended for injection molding. This material has an excellent balance between impact strength and stiffness and gi.. |
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CTE, linear | 32.0 µm/m-°C @Temperature -30.0 - 100 °C |
17.8 µin/in-°F @Temperature -22.0 - 212 °F |
ASTM D696 |
A. Schulman POLYTROPE™ TPP 620 Olefinic Elastomer DescriptionPolytrope TPP 620is an olefinic elastomer developed to exhibit very low thermal expansion, high DOI on painted parts with good low temperature impact properties. ApplicationTPP 620 is des.. |
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CTE, linear | 32.0 µm/m-°C @Temperature 40.0 - 130 °C |
17.8 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 5118 Phenolic, Granular, Compression Molded PLENCO 05118 is a mineral and graphite filled phenolic molding compound, formulated for bearing seals. 05118 provides for a low coefficient of friction, abrasion resistance, minimal water absorptio.. |
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CTE, linear | 32.0 µm/m-°C @Temperature -30.0 - 100 °C |
17.8 µin/in-°F @Temperature -22.0 - 212 °F |
ASTM D696 |
A. Schulman POLYTROPE™ TPP 620 Olefinic Elastomer DescriptionPolytrope TPP 620is an olefinic elastomer developed to exhibit very low thermal expansion, high DOI on painted parts with good low temperature impact properties. ApplicationTPP 620 is des.. |
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CTE, linear | 32.0 µm/m-°C @Temperature -30.0 - 100 °C |
17.8 µin/in-°F @Temperature -22.0 - 212 °F |
ASTM D696 |
A. Schulman POLYTROPE™ TPP 620 Olefinic Elastomer DescriptionPolytrope TPP 620is an olefinic elastomer developed to exhibit very low thermal expansion, high DOI on painted parts with good low temperature impact properties. ApplicationTPP 620 is des.. |
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CTE, linear | 32.0 µm/m-°C @Temperature -30.0 - 100 °C |
17.8 µin/in-°F @Temperature -22.0 - 212 °F |
ASTM D696 |
A. Schulman POLYTROPE™ TPP 620 Olefinic Elastomer DescriptionPolytrope TPP 620is an olefinic elastomer developed to exhibit very low thermal expansion, high DOI on painted parts with good low temperature impact properties. ApplicationTPP 620 is des.. |
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CTE, linear | 32.0 µm/m-°C @Temperature 40.0 - 130 °C |
17.8 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 5350 Phenolic, Granular, Compression Molded PLENCO 05350 is a mineral and graphite filled phenolic molding compound, developed for seal applications. PLENCO 05350 offers excellent dimensional stability, lubricity, and low abrasion properties... |
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CTE, linear | 32.0 µm/m-°C @Temperature -30.0 - 100 °C |
17.8 µin/in-°F @Temperature -22.0 - 212 °F |
ASTM D696 |
A. Schulman POLYTROPE™ TPP 620 Olefinic Elastomer DescriptionPolytrope TPP 620is an olefinic elastomer developed to exhibit very low thermal expansion, high DOI on painted parts with good low temperature impact properties. ApplicationTPP 620 is des.. |
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CTE, linear | 32.0 µm/m-°C | 17.8 µin/in-°F | Below Tg |
Tra-Con Tra-Bond 161-3 Temperature Resistant Epoxy Adhesive TRA-BOND 161-3 two component, premixed and frozen, epoxy adhesive is highly filled. This electrically insulating adhesive provides structural strength to 150°C and semi structural strength to 300°.. |
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CTE, linear | 32.0 µm/m-°C | 17.8 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® B9021-6 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta.. |
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CTE, linear | 32.0 µm/m-°C | 17.8 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.Advantages & Appl.. |
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CTE, linear | 32.0 µm/m-°C | 17.8 µin/in-°F | |
Epoxyset Epoxibond EB-301 Low Expansion Epoxy Adhesive EB-301 is a highly filled, low expansion, epoxy adhesive. This low out-gassing adhesive exhibits excellent wettability without preheating metal bonding surfaces and has a good dimensional stability .. |
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CTE, linear | 32.0 µm/m-°C @Temperature 20.0 °C |
17.8 µin/in-°F @Temperature 68.0 °F |
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Armstrong C-4/D Epoxy Adhesive A low viscosity, clear amber, unfilled adhesive, recommended for use with activators D or W. C-4 with Activator W offers maximum versatility in that differing degrees of flexibility can be achieved .. |
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CTE, linear | 32.0 µm/m-°C | 17.8 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 50/GF/20/TF/10/BK Polycarbonate, with glass fiber and PTFE Applications: Data processing machinery, precision engineering, film and photo industry, sporting and leisure goods, medical enineering.High-strength and high-stiff parts; low coefficient of expansi.. |
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CTE, linear | 32.0 µm/m-°C @Temperature 20.0 °C |
17.8 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Solvay Specialty Polymers Ixef® 2010/X914 Polyarylamide, 40% Filler, DAM
(discontinued **) The IXEF compounds are a family of semi-crystalline polyarylamide thermoplastics reinforced with glass fibers and/or mineral fillers for injection molding.Data provided by the manufacturer, Solvay A.. |
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CTE, linear | 32.0 - 40.0 µm/m-°C @Temperature 100 - 300 °C |
17.8 - 22.2 µin/in-°F @Temperature 212 - 572 °F |
Average value: 37.4 µm/m-°C Grade Count:27 |
Overview of materials for Polyimide, Thermoset Film This property data is a summary of similar materials in the MatWeb database for the category "Polyimide, Thermoset Film". Each property range of values reported is minimum and maximum values of appr.. |