Songhan Plastic Technology Co.,Ltd.
 POLYMER SEARCH

Polymer Property : CTE, linear = 17.8 µin/in-°F Product List

Thermal Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.
Thermal Properties Metric English Comments
CTE, linear 32.0 µm/m-°C

@Temperature 20.0 °C
17.8 µin/in-°F

@Temperature 68.0 °F
TMA; ASTM E831
LNP Stat-Kon® PDX-E-99689 CCS Polyetherimide, Carbon Fiber Reinforcement  (discontinued **)
Features: Low to None Ion Content, Electrically ConductiveForms: PelletsProcessing Method: Injection MoldingInformation provided by LNP, a GE Plastics Company.This data sheet is labeled Discontinued..
CTE, linear 32.0 - 38.0 µm/m-°C

@Temperature 40.0 - 130 °C
17.8 - 21.1 µin/in-°F

@Temperature 104 - 266 °F
Average value: 34.0 µm/m-°C Grade Count:3
Overview of materials for Phenolic, Novolac, Mineral/Graphite Filled
This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Mineral/Graphite Filled". Each property range of values reported is minimum and maxim..
CTE, linear 32.0 - 90.0 µm/m-°C
17.8 - 50.0 µin/in-°F
Average value: 67.0 µm/m-°C Grade Count:6
Overview of materials for Nylon, Amorphous Transparent Alloy
This property data is a summary of similar materials in the MatWeb database for the category "Nylon, Amorphous Transparent Alloy". Each property range of values reported is minimum and maximum value..
CTE, linear 32.0 µm/m-°C
17.8 µin/in-°F
Alpha 1
Lord Adhesives Thermosetâ„¢ ME-541 Underfill Encapsulant
LORD Thermosetâ„¢ ME-541 encapsulant is an anhydride free, high purity, semi-conductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip chip devi..
CTE, linear 32.0 µm/m-°C
17.8 µin/in-°F
DIN 53752
Lehmann & Voss LUVOCOM® 50/GF/20/TF/20/BK 100 Polycarbonate, with glass fiber and PTFE
Applications: Data processing machinery, precision engineering, film and photo industry, sporting and leisure goods, medical enineering.High-strength and high-stiff parts; low coefficient of expansi..
CTE, linear 32.0 µm/m-°C
17.8 µin/in-°F
DIN 53752
Lehmann & Voss LUVOCOM® 50/GF/20/TF/20/GY Polycarbonate, with glass fiber and PTFE
Applications: Data processing machinery, precision engineering, film and photo industry, sporting and leisure goods, medical enineering.High-strength and high-stiff parts; low coefficient of expansi..
CTE, linear 32.0 µm/m-°C

@Temperature 23.0 - 85.0 °C
17.8 µin/in-°F

@Temperature 73.4 - 185 °F
ASTM E831
Solvay Technyl® C 216 Nylon 6, 30% Glass Fiber, EH0
Polyamide PA6, reinforced with 30% of glass fiber, for injection molding.It has good mechanical properties. It is used in all sectors of industry, offering an excellent combination between thermal ..
CTE, linear 32.0 µm/m-°C

@Temperature -30.0 - 100 °C
17.8 µin/in-°F

@Temperature -22.0 - 212 °F
ASTM D696
A. Schulman POLYTROPE™ TPP 620 Olefinic Elastomer
DescriptionPolytrope TPP 620is an olefinic elastomer developed to exhibit very low thermal expansion, high DOI on painted parts with good low temperature impact properties. ApplicationTPP 620 is des..
CTE, linear 32.0 µm/m-°C

@Temperature -30.0 - 80.0 °C
17.8 µin/in-°F

@Temperature -22.0 - 176 °F
Borealis Method
Borealis Daplen™ KB4436 Polypropylene TPO Compound
Daplen™ KB4436 is a 30% mineral filled elastomer modified polypropylene compound intended for injection molding. This material has an excellent balance between impact strength and stiffness and gi..
CTE, linear 32.0 µm/m-°C

@Temperature -30.0 - 100 °C
17.8 µin/in-°F

@Temperature -22.0 - 212 °F
ASTM D696
A. Schulman POLYTROPE™ TPP 620 Olefinic Elastomer
DescriptionPolytrope TPP 620is an olefinic elastomer developed to exhibit very low thermal expansion, high DOI on painted parts with good low temperature impact properties. ApplicationTPP 620 is des..
CTE, linear 32.0 µm/m-°C

@Temperature 40.0 - 130 °C
17.8 µin/in-°F

@Temperature 104 - 266 °F
TMA; ASTM E831
Plenco 5118 Phenolic, Granular, Compression Molded
PLENCO 05118 is a mineral and graphite filled phenolic molding compound, formulated for bearing seals. 05118 provides for a low coefficient of friction, abrasion resistance, minimal water absorptio..
CTE, linear 32.0 µm/m-°C

@Temperature -30.0 - 100 °C
17.8 µin/in-°F

@Temperature -22.0 - 212 °F
ASTM D696
A. Schulman POLYTROPE™ TPP 620 Olefinic Elastomer
DescriptionPolytrope TPP 620is an olefinic elastomer developed to exhibit very low thermal expansion, high DOI on painted parts with good low temperature impact properties. ApplicationTPP 620 is des..
CTE, linear 32.0 µm/m-°C

@Temperature -30.0 - 100 °C
17.8 µin/in-°F

@Temperature -22.0 - 212 °F
ASTM D696
A. Schulman POLYTROPE™ TPP 620 Olefinic Elastomer
DescriptionPolytrope TPP 620is an olefinic elastomer developed to exhibit very low thermal expansion, high DOI on painted parts with good low temperature impact properties. ApplicationTPP 620 is des..
CTE, linear 32.0 µm/m-°C

@Temperature -30.0 - 100 °C
17.8 µin/in-°F

@Temperature -22.0 - 212 °F
ASTM D696
A. Schulman POLYTROPE™ TPP 620 Olefinic Elastomer
DescriptionPolytrope TPP 620is an olefinic elastomer developed to exhibit very low thermal expansion, high DOI on painted parts with good low temperature impact properties. ApplicationTPP 620 is des..
CTE, linear 32.0 µm/m-°C

@Temperature 40.0 - 130 °C
17.8 µin/in-°F

@Temperature 104 - 266 °F
TMA; ASTM E831
Plenco 5350 Phenolic, Granular, Compression Molded
PLENCO 05350 is a mineral and graphite filled phenolic molding compound, developed for seal applications. PLENCO 05350 offers excellent dimensional stability, lubricity, and low abrasion properties...
CTE, linear 32.0 µm/m-°C

@Temperature -30.0 - 100 °C
17.8 µin/in-°F

@Temperature -22.0 - 212 °F
ASTM D696
A. Schulman POLYTROPE™ TPP 620 Olefinic Elastomer
DescriptionPolytrope TPP 620is an olefinic elastomer developed to exhibit very low thermal expansion, high DOI on painted parts with good low temperature impact properties. ApplicationTPP 620 is des..
CTE, linear 32.0 µm/m-°C
17.8 µin/in-°F
Below Tg
Tra-Con Tra-Bond 161-3 Temperature Resistant Epoxy Adhesive
TRA-BOND 161-3 two component, premixed and frozen, epoxy adhesive is highly filled. This electrically insulating adhesive provides structural strength to 150°C and semi structural strength to 300°..
CTE, linear 32.0 µm/m-°C
17.8 µin/in-°F
Below Tg
Epoxy Technology EPO-TEK® B9021-6 Epoxy Paste
Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..
CTE, linear 32.0 µm/m-°C
17.8 µin/in-°F
Below Tg
Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide
Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.Advantages & Appl..
CTE, linear 32.0 µm/m-°C
17.8 µin/in-°F
Epoxyset Epoxibond EB-301 Low Expansion Epoxy Adhesive
EB-301 is a highly filled, low expansion, epoxy adhesive. This low out-gassing adhesive exhibits excellent wettability without preheating metal bonding surfaces and has a good dimensional stability ..
CTE, linear 32.0 µm/m-°C

@Temperature 20.0 °C
17.8 µin/in-°F

@Temperature 68.0 °F
Armstrong C-4/D Epoxy Adhesive
A low viscosity, clear amber, unfilled adhesive, recommended for use with activators D or W. C-4 with Activator W offers maximum versatility in that differing degrees of flexibility can be achieved ..
CTE, linear 32.0 µm/m-°C
17.8 µin/in-°F
DIN 53752
Lehmann & Voss LUVOCOM® 50/GF/20/TF/10/BK Polycarbonate, with glass fiber and PTFE
Applications: Data processing machinery, precision engineering, film and photo industry, sporting and leisure goods, medical enineering.High-strength and high-stiff parts; low coefficient of expansi..
CTE, linear 32.0 µm/m-°C

@Temperature 20.0 °C
17.8 µin/in-°F

@Temperature 68.0 °F
ASTM D696
Solvay Specialty Polymers Ixef® 2010/X914 Polyarylamide, 40% Filler, DAM  (discontinued **)
The IXEF compounds are a family of semi-crystalline polyarylamide thermoplastics reinforced with glass fibers and/or mineral fillers for injection molding.Data provided by the manufacturer, Solvay A..
CTE, linear 32.0 - 40.0 µm/m-°C

@Temperature 100 - 300 °C
17.8 - 22.2 µin/in-°F

@Temperature 212 - 572 °F
Average value: 37.4 µm/m-°C Grade Count:27
Overview of materials for Polyimide, Thermoset Film
This property data is a summary of similar materials in the MatWeb database for the category "Polyimide, Thermoset Film". Each property range of values reported is minimum and maximum values of appr..
Copyright © lookpolymers.com All Rights Reserved