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Polymer Property : CTE, linear = 13.3 µin/in-°F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 24.0 µm/m-°C | 13.3 µin/in-°F | Z-Direction; TMA; 10°C/min; ASTM D3386; IPC-TM-650 2.4.41 |
| Rogers Corporation RT/duroid® 6002 High Frequency Laminate Features:Low loss for excellent high frequency performanceTight dielectric constant and thickness controlExcellent electrical and mechanical propertiesExtremely low thermal coefficient of dielectric.. |
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| CTE, linear | 23.9 µm/m-°C @Temperature 20.0 °C |
13.3 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| PolyOne Edgetek® PK-20GF/000 Polyetheretherketone (PEEK), Glass Filled
(discontinued **) Description/Features:Glass Fiber ReinforcedUL 94 (CTI Testing)PolyOne First ChoiceInformation provided by PolyOne Corporation. |
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| CTE, linear | 24.0 µm/m-°C @Temperature 20.0 °C |
13.3 µin/in-°F @Temperature 68.0 °F |
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| Indium Corp. Indalloy® 181 Sn-Pb-Cd Solder Alloy Good general purpose solder in the medium temperature range. Maintains its creep strength well. Not applicable against gold.Information provided by the manufacturer, Indium Corporation. |
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| CTE, linear | 24.0 µm/m-°C @Temperature 20.0 °C |
13.3 µin/in-°F @Temperature 68.0 °F |
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| Indium Corp. Indalloy® 9 Sn-Pb-In Solder Alloy General purpose solder in 160° C range with good physical properties.Information provided by the manufacturer, Indium Corporation. |
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| CTE, linear | 24.0 µm/m-°C @Temperature 20.0 °C |
13.3 µin/in-°F @Temperature 68.0 °F |
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| Indium Corp. Indalloy® 8 In-Sn-Cd Fusible Alloy General purpose fusible alloy.Information provided by the manufacturer, Indium Corporation. |
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| CTE, linear | 24.0 µm/m-°C @Temperature 23.0 - 60.0 °C |
13.3 µin/in-°F @Temperature 73.4 - 140 °F |
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| Sumitomo Bakelite Sumikon® PM-9640 Glass Filled Phenolic Two stage glass fiber filled black phenolic. It is especially designed for applications requiring high strength and dimensional stability with excellent heat resistance. PM-9640 is widely used in .. |
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| CTE, linear | 24.0 µm/m-°C @Temperature 20.0 °C |
13.3 µin/in-°F @Temperature 68.0 °F |
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| Cosmic Plastics 6230 Long Glass Fiber Filled Iso Diallyl Phthalate Molding Compound Data provided by the manufacturer. |
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| CTE, linear | 24.0 µm/m-°C @Temperature 20.0 °C |
13.3 µin/in-°F @Temperature 68.0 °F |
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| Cosmic Plastics K61 Long Glass Fiber Filled Iso Diallyl Phthalate Molding Compound Data provided by the manufacturer. |
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| CTE, linear | 24.0 µm/m-°C @Temperature 20.0 °C |
13.3 µin/in-°F @Temperature 68.0 °F |
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| Cosmic Plastics K66 Long Glass Fiber Filled Iso Diallyl Phthalate Molding Compound Data provided by the manufacturer. |
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| CTE, linear | 24.0 µm/m-°C @Temperature 20.0 °C |
13.3 µin/in-°F @Temperature 68.0 °F |
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| Williams Advanced Alloys WS296 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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| CTE, linear | 24.0 µm/m-°C @Temperature 15.0 - 110 °C |
13.3 µin/in-°F @Temperature 59.0 - 230 °F |
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| Goodfellow Tin 60/Lead 39/Antimony 1 Alloy A general purpose, low melting point soft solder which can also be used as a protective coating and for metal film capacitors.Information provided by Goodfellow. |
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| CTE, linear | 24.0 µm/m-°C | 13.3 µin/in-°F | Absolute Drying; ASTM-D696 |
| Toyobo GLAMIDE® T-521 Nylon-6 GLAMIDE® is very tough and exhibits high abrasion resistance. It has a high melting point and heat resistance, has well-balanced proportions of mechanical properties, performs self-distinguishing a.. |
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| CTE, linear | 24.0 µm/m-°C @Temperature 20.0 °C |
13.3 µin/in-°F @Temperature 68.0 °F |
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| Cosmic Plastics D69 Long Glass Fiber Filled Ortho Diallyl Phthalate Molding Compound Data provided by the manufacturer. |
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| CTE, linear | 24.0 µm/m-°C | 13.3 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.Advantages & Application Notes:Snap cure adhesive or f.. |
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| CTE, linear | 24.0 µm/m-°C | 13.3 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & .. |
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| CTE, linear | 24.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
13.3 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM Test |
| BASF Petra® 130 FR 30% Glass Filled PET Petra 130 FR is a 30% glass fiber reinforced, flame retardant injection molding polyethylene terephthalate feedstocks. It is recognized as UL 94V-0/5VA by Underwriters Laboratories. It is also avail.. |
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| CTE, linear | 24.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
13.3 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM Test |
| BASF Petra® 130 FR BK-112 30% Glass Filled PET Petra 130 FR BK-112 is a 30% glass fiber reinforced, black pigmented, flame retardant injection molding compound based on post-consumer and post-industrial recycle polyethylene erephthalate feedstoc.. |
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| CTE, linear | 24.0 µm/m-°C @Temperature 20.0 °C |
13.3 µin/in-°F @Temperature 68.0 °F |
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| Armstrong A-1/E Epoxy Adhesive A brown epoxy paste formulated with enhanced wetting capabilities to hard rubbers and rigid thermoplastics. Has low outgassing characteristics at temperatures below 250°FInformation provided by El.. |
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| CTE, linear | 24.0 µm/m-°C @Temperature 20.0 °C |
13.3 µin/in-°F @Temperature 68.0 °F |
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| AIM 52In/48Sn Solder for Photonic Packaging Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials. |
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| CTE, linear | 24.0 µm/m-°C @Temperature 20.0 °C |
13.3 µin/in-°F @Temperature 68.0 °F |
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| Cosmic Plastics D62 Long Glass Fiber Filled Ortho Diallyl Phthalate Molding Compound Data provided by the manufacturer. |
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| CTE, linear | 24.0 - 34.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
13.3 - 18.9 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
| SABIC Innovative Plastics NORYL CN5246 PPE+PS (Asia Pacific) |
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| CTE, linear | 24.0 - 35.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
13.3 - 19.4 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
| SABIC Innovative Plastics NORYL FM3020V PPE+PS (Asia Pacific) 30% filled FR high modulus foam grade |
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| CTE, linear | 24.0 µm/m-°C @Temperature 20.0 °C |
13.3 µin/in-°F @Temperature 68.0 °F |
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| Cosmic Plastics 6130 Long Glass Fiber Filled Ortho Diallyl Phthalate Molding Compound Data provided by the manufacturer. |
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