Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear | 100 µm/m-°C @Temperature 20.0 °C |
55.6 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Rochling Engineered Plastics Polystone® MPG Glass filled (UHMW-PE) Polystone® M is a highly versatile polymer that features: Low coefficient of friction Excellent abrasion resistance High-impact strength Chemical resistance Complies with FDA regulations under the .. |
|||
CTE, linear | 100 µm/m-°C @Temperature 20.0 °C |
55.6 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Rochling Engineered Plastics Polystone® XL Cross linked (UHMW-PE) Polystone® M is a highly versatile polymer that features: Low coefficient of friction Excellent abrasion resistance High-impact strength Chemical resistance Complies with FDA regulations under the .. |
|||
CTE, linear | 100 µm/m-°C @Temperature -30.0 - 80.0 °C |
55.6 µin/in-°F @Temperature -22.0 - 176 °F |
ASTM E228 |
Solvay Engineered Polymers DEXFLEX® 810HSF TPO
(discontinued **) Description: DEXFLEX® 810HSF is a thermoplastic olefinic elastomer (TPO) designed for large molded-in-color automotive exterior applications that require high flow characteristics for excellent pro.. |
|||
CTE, linear | 100 - 140 µm/m-°C @Temperature 20.0 °C |
55.6 - 77.8 µin/in-°F @Temperature 68.0 °F |
ASTM E831 |
Polimersan Plastics POLITEF® (PTFE) with 15% Glass As a result of Filled-In POLITEF® alloys, apart from all of its superior properties, POLITEF®, according to its usage areas has gained additional properties as described below:Electrical Conductiv.. |
|||
CTE, linear | 100 µm/m-°C @Temperature 20.0 °C |
55.6 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Asahi Kasei Tenac® 2013A Acetal Homopolymer, UV Stabilized
(discontinued **) Similar to 3013A, but higher in molecular weight.Applications: Pipe fittings, rollers, exterior automotive parts.This product is not a part of the standard product line dated 2003. |
|||
CTE, linear | 100 µm/m-°C | 55.6 µin/in-°F | Below Tg |
EVALCA EVAL® G156A Ethylene Vinyl Alcohol Copolymer Resin
(discontinued **) 48 mol % Ethylene.Data provided by EVALCA. Applications: Cast film, specialty applications. EVOH is used in packaging applications because of its outstanding gas barrier properties.EVAL™ is now p.. |
|||
CTE, linear | 100 - 223.2 µm/m-°C @Temperature 30.0 - 300 °C |
55.6 - 124.0 µin/in-°F @Temperature 86.0 - 572 °F |
Average value: 156 µm/m-°C Grade Count:2 |
Overview of materials for Polytetrafluoroethylene (PTFE), Carbon Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Polytetrafluoroethylene (PTFE), Carbon Fiber Filled". Each property range of values reported is minimum .. |
|||
CTE, linear | 100 µm/m-°C @Temperature 20.0 °C |
55.6 µin/in-°F @Temperature 68.0 °F |
TMA; ASTM E831 |
LNP Stat-Kon® PDX-S-90398 Polyamide 12, Stainless Steel Fiber
(discontinued **) Features: Electrically ConductiveForms: PelletsProcessing Method: Injection MoldingInformation provided by LNP, a GE Plastics Company.This data sheet is labeled Discontinued; however many LNP grades.. |
|||
CTE, linear | 100 µm/m-°C @Temperature 20.0 °C |
55.6 µin/in-°F @Temperature 68.0 °F |
|
Hybrid Plastics POSS® EP 1050 Epoxy Adhesive EP1050 is a POSS® based, high-temperature epoxy adhesive with outstanding resistance to ozone, plasma, or atomic oxygen environments. Major applications include medical devices, optics, semicondu.. |
|||
CTE, linear | 100 µm/m-°C | 55.6 µin/in-°F | Alpha 2 |
Lord Adhesives Thermosetâ„¢ ME-541 Underfill Encapsulant LORD Thermosetâ„¢ ME-541 encapsulant is an anhydride free, high purity, semi-conductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip chip devi.. |
|||
CTE, linear | 100 µm/m-°C | 55.6 µin/in-°F | ASTM E831 |
Lucite International Diakon® ST25H8 Toughened Acrylic Compound The Diakon® impact PMMA series offer the best combination of impact, chemical and heat resistance and provide rigidity and surface hardness.The grades in the Diakon® series can be processed by.. |
|||
CTE, linear | 100 µm/m-°C @Temperature -30.0 - 100 °C |
55.6 µin/in-°F @Temperature -22.0 - 212 °F |
ASTM D696 |
LyondellBasell Hifaxâ„¢ CA187 Thermoplastic Olefin Resin Key Features: medium melt flow, medium modulus, paintable thermoplastic elastomeric olefin resin, excellent paintability, excellent surface appearance, good impact and stiffness balanceApplications:.. |
|||
CTE, linear | 100 µm/m-°C @Temperature 20.0 - 100 °C |
55.6 µin/in-°F @Temperature 68.0 - 212 °F |
DIN 53752 |
Schwartz Technical Plastics LAMIGAMID® 600 Polyoxymethylene Application: friction bearings, wear and sliding linersInformation provided by Schwartz Technical Plastics GmbH |
|||
CTE, linear | 100 µm/m-°C | 55.6 µin/in-°F | ISO 11359 |
Styrolution PS 476L HIPS Styrolution PS 476L is a normal flow and very high impact Polystyrene. It gives good mechanical and heat resistance properties while providing with easy processability and short cycle time.Normal fl.. |
|||
CTE, linear | 100 µm/m-°C @Temperature 20.0 °C |
55.6 µin/in-°F @Temperature 68.0 °F |
|
Zell-Metall Engineering Plastics Zellamid 1200 G at 50% RH Zellamid® 1200 G is manufactured by an activated anionic reaction. Finished and semi-finished parts are produced by a static cast process. This process makes it possible to produce a material wit.. |
|||
CTE, linear | 100 µm/m-°C @Temperature 23.0 - 60.0 °C |
55.6 µin/in-°F @Temperature 73.4 - 140 °F |
ASTM D696 |
Daikin POLYFLON F-104 PTFE Fine Powder Processing Methods: Paste extrusion, calendering.Applications: Unsintered tape, sealing tape, low specific gravity tape, tape for wrapping flat cables, tubes.Information provided by Daikin Industrie.. |
|||
CTE, linear | 100 µm/m-°C @Temperature 23.0 - 60.0 °C |
55.6 µin/in-°F @Temperature 73.4 - 140 °F |
ASTM D696 |
Daikin POLYFLON M-111 PTFE Molding Powder, Fine Cut Fine cut powder.Processing Methods: Compression molding.Features: Produces moldings with extremely smooth and fine surface. Suited to making packing and gaskets since moldings have an especially go.. |
|||
CTE, linear | 100 µm/m-°C @Temperature 23.0 - 60.0 °C |
55.6 µin/in-°F @Temperature 73.4 - 140 °F |
ASTM D696 |
Daikin POLYFLON M-392 PTFE Molding Powder, Free Flow Free flow powder.Processing Methods: Compression molding, automatic or semi-automatic compression molding, isostatic molding, and ram extrusion.Features: Good fill characteristics particularly into .. |
|||
CTE, linear | 100 µm/m-°C @Temperature 23.0 - 60.0 °C |
55.6 µin/in-°F @Temperature 73.4 - 140 °F |
ASTM D696 |
Daikin POLYFLON MG-1040F PTFE 20% Glass Fiber Filled Molding Powder, High Apparent Density, Free Flow 20% glass fiber filled. High apparent density and free-flowing properties. High wear resistance, low friction, good electrical properties.Applications: Mechanical and electrical service. Availabl.. |
|||
CTE, linear | 100 µm/m-°C @Temperature 23.0 - 60.0 °C |
55.6 µin/in-°F @Temperature 73.4 - 140 °F |
ASTM D696 |
Daikin POLYFLON MG-1241 PTFE 20% Glass Fiber and 5% Graphite Filled Molding Powder 20% glass fiber and 5% graphite filled. High wear resistance, low friction, high creep resistance.Applications: Mechanical and chemical service (e.g. piston rings, bearing pads, and packings)Inform.. |
|||
CTE, linear | 100 µm/m-°C @Temperature 23.0 - 60.0 °C |
55.6 µin/in-°F @Temperature 73.4 - 140 °F |
ASTM D696 |
Daikin POLYFLON MG-1431F PTFE 20% Glass Fiber and 5% MoS2 Filled Molding Powder, High Apparent Density, Free Flow 15% glass fiber and 5% MoS2 filled. High apparent density and free-flowing properties. High wear resistance, good electrical properties, low friction, high creep resistance.Applications: Mechanica.. |
|||
CTE, linear | 100 µm/m-°C @Temperature 23.0 - 60.0 °C |
55.6 µin/in-°F @Temperature 73.4 - 140 °F |
ASTM D696 |
Daikin POLYFLON MG-6030 PTFE 15% Carbon Fiber Filled Molding Powder 15% carbon fiber filled. High wear resistance, high load resistance, high bend resistance.Applications: Mechanical service (e.g. bearings, mechanical seals and bearing pads)Information provided by .. |
|||
CTE, linear | 100 µm/m-°C @Temperature 23.0 - 60.0 °C |
55.6 µin/in-°F @Temperature 73.4 - 140 °F |
ASTM D696 |
Daikin POLYFLON MG-6030F PTFE 15% Carbon Fiber Filled Molding Powder, High Apparent Density, Free Flow 15% carbon fiber filled. High apparent density and free-flowing properties. High wear resistance, high load resistance, high bend resistance.Applications: Mechanical service (e.g. bearings, mechan.. |
|||
CTE, linear | 100 µm/m-°C @Temperature 23.0 - 60.0 °C |
55.6 µin/in-°F @Temperature 73.4 - 140 °F |
ASTM D696 |
Daikin POLYFLON MG-6050 PTFE 25% Carbon Fiber Filled Molding Powder 25% carbon fiber filled. High wear resistance, high load resistance, high bend resistance.Applications: Mechanical service (e.g. bearings, mechanical seals and bearing pads)Information provided by .. |
|||
CTE, linear | 100 µm/m-°C @Temperature 20.0 °C |
55.6 µin/in-°F @Temperature 68.0 °F |
ISO 11359 |
CENTROPLAST CENTROMID 12 LE soft Polyamide 12 LE soft This extruded material is suitable for conveying foodstuffs and pharmaceutical products. It is used in flexible tubes for worm gears and spiral conveyors.Information provided by CENTROPLAST Enginee.. |
|||
CTE, linear | >= 100 µm/m-°C @Temperature 20.0 °C |
>= 55.6 µin/in-°F @Temperature 68.0 °F |
|
Loctite® 3887 High Adhesion Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona.. |