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- Polymer Property : CTE, linear = 10.6 µin/in-°F
Polymer Property : CTE, linear = 10.6 µin/in-°F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 19.0 µm/m-°C @Thickness 1.57 mm, Temperature 20.0 °C |
10.6 µin/in-°F @Thickness 0.0620 in, Temperature 68.0 °F |
x-axis; IPC-TM 650-2.4.24 |
| Industrial Laminates/Norplex NP630 Paper Base Laminate Description: Machining grade with good electrical properties and moisture resistance. Low cold flow with good dimensional stability. Thickness Tested: 0.062", 0.125", and 0.500" |
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| CTE, linear | 19.0 µm/m-°C | 10.6 µin/in-°F | Alpha 1; TMA |
| Lord Adhesives Thermosetâ„¢ ME-455 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ ME-455 encapsulant is a onecomponent, semiconductor grade epoxy designed for the encapsulation of wire-bonded or flip chip die in PPGA, BGA, MCM and other cavity packages. It is.. |
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| CTE, linear | 19.0 µm/m-°C @Thickness 1.57 mm, Temperature 20.0 °C |
10.6 µin/in-°F @Thickness 0.0620 in, Temperature 68.0 °F |
x-axis; IPC-TM 650-2.4.24 |
| Industrial Laminates/Norplex NP612 Paper Base Laminate Description: Room temperature punching and shearing grade up to .125" thick. More flexible and lower mechanical properties than NP611. Intended for applications where electrical and moisture require.. |
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| CTE, linear | 19.0 µm/m-°C @Thickness 1.57 mm, Temperature 20.0 °C |
10.6 µin/in-°F @Thickness 0.0620 in, Temperature 68.0 °F |
x-axis; IPC-TM 650-2.4.24 |
| Industrial Laminates/Norplex NP625 Paper Base Laminate Description: Paper phenolic grade with better moisture resistance than NP612. Requires less heat to punch and shear than NP611. |
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| CTE, linear | 19.0 µm/m-°C | 10.6 µin/in-°F | Alpha 1; ASTM D3386 |
| Lord Adhesives CircuitSAFâ„¢ ME-456 Epoxy Dam Encapsulant CircuitSAFâ„¢ ME-456 is a one component, high purity, fast cure, semiconductor grade epoxy encapsulant dam material developed for use in the encapsulation of wire bonded and flip devices where a .. |
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| CTE, linear | 19.0 µm/m-°C | 10.6 µin/in-°F | ASTM D696 |
| Samyang Trirex® 3500G30 Polycarbonate, 30% Glass Reinforced TRIREX® polycarbonate resins offer superior transparency, mechanical properties, good dimensional stability and high electrical performance, which allows it to be widely used for electrical, elec.. |
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| CTE, linear | 19.0 µm/m-°C @Temperature 20.0 °C |
10.6 µin/in-°F @Temperature 68.0 °F |
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| Loctite® 3533 Low viscosity fill encapsulant Fill Encapsulant COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp.. |
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| CTE, linear | 19.0 µm/m-°C @Temperature 20.0 °C |
10.6 µin/in-°F @Temperature 68.0 °F |
|
| Loctite® 3532 High viscosity Dam Encapsulant COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp.. |
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| CTE, linear | 19.1 µm/m-°C @Temperature 20.0 - 300 °C |
10.6 µin/in-°F @Temperature 68.0 - 572 °F |
|
| Eagle Brass 240 Low Brass, 1/2 Hard CDA 240 has excellent ductility, corrosion resistance and strength which allows it to be deep drawn, etched, stamped, blanked and bent. Typical uses include musical instruments, battery caps, flexib.. |
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| CTE, linear | 19.1 µm/m-°C @Temperature 20.0 - 300 °C |
10.6 µin/in-°F @Temperature 68.0 - 572 °F |
|
| Eagle Brass 240 Low Brass, 3/4 Hard CDA 240 has excellent ductility, corrosion resistance and strength which allows it to be deep drawn, etched, stamped, blanked and bent. Typical uses include musical instruments, battery caps, flexib.. |
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| CTE, linear | 19.1 µm/m-°C @Temperature 20.0 - 300 °C |
10.6 µin/in-°F @Temperature 68.0 - 572 °F |
|
| Eagle Brass 240 Low Brass, Annealed CDA 240 has excellent ductility, corrosion resistance and strength which allows it to be deep drawn, etched, stamped, blanked and bent. Typical uses include musical instruments, battery caps, flexib.. |
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| CTE, linear | 19.1 µm/m-°C @Temperature 20.0 - 300 °C |
10.6 µin/in-°F @Temperature 68.0 - 572 °F |
|
| Eagle Brass 240 Low Brass, Extra Spring CDA 240 has excellent ductility, corrosion resistance and strength which allows it to be deep drawn, etched, stamped, blanked and bent. Typical uses include musical instruments, battery caps, flexib.. |
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| CTE, linear | 19.1 µm/m-°C @Temperature 20.0 - 300 °C |
10.6 µin/in-°F @Temperature 68.0 - 572 °F |
|
| Eagle Brass 240 Low Brass, Hard CDA 240 has excellent ductility, corrosion resistance and strength which allows it to be deep drawn, etched, stamped, blanked and bent. Typical uses include musical instruments, battery caps, flexib.. |
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| CTE, linear | 19.1 µm/m-°C @Temperature 20.0 - 300 °C |
10.6 µin/in-°F @Temperature 68.0 - 572 °F |
|
| Eagle Brass 240 Low Brass, Spring CDA 240 has excellent ductility, corrosion resistance and strength which allows it to be deep drawn, etched, stamped, blanked and bent. Typical uses include musical instruments, battery caps, flexib.. |
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| CTE, linear | 19.0 µm/m-°C | 10.6 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® H20-LC Electrically Conductive, Silver Epoxy Product Description: EPO TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used exte.. |
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| CTE, linear | 19.0 µm/m-°C @Temperature 20.0 - 50.0 °C |
10.6 µin/in-°F @Temperature 68.0 - 122 °F |
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| DuPont Teijin Films Melinex® ST328 Polyester Film, 1400 Gauge Melinex® ST328 is an exceptionally white, opaque film with a satin finish. It is pretreated on both surfaces to promote adhesion to a wide range of solvent-based and UV-curable graphics inks and va.. |
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| CTE, linear | 19.0 µm/m-°C @Temperature 20.0 - 300 °C |
10.6 µin/in-°F @Temperature 68.0 - 572 °F |
|
| CLAL-MSX SICLANIC S® TB Quenched Copper Alloy SICLANIC S® is particularly recommended for the production of conductive contact blades. SICLANIC S® offers :electrical conductivity greatly superior to that of bronzes, brasses and nickel silver.. |
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| CTE, linear | 19.0 µm/m-°C @Temperature 20.0 - 300 °C |
10.6 µin/in-°F @Temperature 68.0 - 572 °F |
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| CLAL-MSX SICLANIC S® TF Quenched Copper Alloy, precipitation treated SICLANIC S® is particularly recommended for the production of conductive contact blades. SICLANIC S® offers :electrical conductivity greatly superior to that of bronzes, brasses and nickel silver.. |
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| CTE, linear | 19.0 µm/m-°C @Temperature 20.0 - 300 °C |
10.6 µin/in-°F @Temperature 68.0 - 572 °F |
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| CLAL-MSX SICLANIC S® TH3 Quenched Copper Alloy, 1/2 Hard, precipitation treated SICLANIC S® is particularly recommended for the production of conductive contact blades. SICLANIC S® offers :electrical conductivity greatly superior to that of bronzes, brasses and nickel silver.. |
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| CTE, linear | 19.0 µm/m-°C @Temperature 100 °C |
10.6 µin/in-°F @Temperature 212 °F |
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| CMW® DSC Copper with Dispersed Aluminum Oxide CMW® DSC material is an extruded and cold worked powder metallurgy material consisting of copper and dispersed aluminum oxide. It has exceptional high temperature strength for its electrical conduc.. |
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| CTE, linear | 19.0 µm/m-°C | 10.6 µin/in-°F | ASTM D696 |
| Samyang Trirex® 3025GRU30 Polycarbonate, 30% Glass Reinforced TRIREX® polycarbonate resins offer superior transparency, mechanical properties, good dimensional stability and high electrical performance, which allows it to be widely used for electrical, electr.. |
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| CTE, linear | 19.0 - 570 µm/m-°C | 10.6 - 317 µin/in-°F | Average value: 223 µm/m-°C Grade Count:49 |
| Overview of materials for Thermoset Fluoroelastomer This property data is a summary of similar materials in the MatWeb database for the category "Thermoset Fluoroelastomer". Each property range of values reported is minimum and maximum values of appr.. |
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