Thermal Properties | Metric | English | Comments |
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CTE, linear | 3.20 µm/m-°C @Temperature 20.0 °C |
1.78 µin/in-°F @Temperature 68.0 °F |
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GBC 496 Alumino Silicate Ceramic Propriety composition with CTE equivalent to Pyrex® glass. Can seal directly to 7070 glass, Pyrex®, or other grades of silicon. Has excellent thermal shock resistance, low firing temperature.. |
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CTE, linear | 3.20 µm/m-°C @Temperature 30.0 - 300 °C |
1.78 µin/in-°F @Temperature 86.0 - 572 °F |
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Mo-Sci Corporation GL-0179 Borosilicate Glass Spheres Appearance: Solid clear borosilicate glass microspheres with white color in powder form.Typical applications of GL0179 beads include: calibration, high temperature spacer material for gauge control,.. |
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CTE, linear | 3.20 µm/m-°C @Temperature 30.0 - 300 °C |
1.78 µin/in-°F @Temperature 86.0 - 572 °F |
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Mo-Sci Corporation GL-0186 Borosilicate Glass Spheres Appearance: Solid clear borosilicate glass microspheres with white color in powder form.Typical applications of GL0186 beads include: high temperature spacer material for gauge control, coating, fil.. |
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CTE, linear | 3.20 µm/m-°C @Temperature 30.0 - 300 °C |
1.78 µin/in-°F @Temperature 86.0 - 572 °F |
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Mo-Sci Corporation GL-0261 Ni Coated Borosilicate Glass Spheres Appearance: Solid borosilicate glass microspheres with metallic nickel coatingTypical applications of GL-0261 glass microspheres include: conductive filler for plastic, pigment, and etc.Information .. |
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CTE, linear | 3.20 µm/m-°C @Temperature 30.0 - 300 °C |
1.78 µin/in-°F @Temperature 86.0 - 572 °F |
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Mo-Sci Corporation GL-0263 Cu Coated Borosilicate Glass Spheres Appearance: Solid borosilicate glass microspheres with metallic copper coatingTypical applications of GL-0263 glass microspheres include: conductive filler for plastic, pigment, and etc.Information .. |
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CTE, linear | 3.20 µm/m-°C @Temperature 260 °C |
1.78 µin/in-°F @Temperature 500 °F |
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Ferro EG 0002 Glazes and Sealants Glass Type: Si-Al-Ba Typical Powder Form: VWG Typical Application: SiC Ferro's electronic and specialty glass group has produced over 3,000 formulations. Many are used as protective and insulatin.. |
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CTE, linear | 3.20 µm/m-°C @Temperature 20.0 °C |
1.78 µin/in-°F @Temperature 68.0 °F |
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Sapco Silicon Nitride, Si3N4 Information provided by Sapco. |
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CTE, linear | 3.20 µm/m-°C @Temperature 0.000 - 300 °C |
1.78 µin/in-°F @Temperature 32.0 - 572 °F |
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Corning 7070 Lithia Potash Borosilicate Crushed/Powdered Glass Available in mesh sizes 4 through 325 and can be customized. Devitrifies before reaching a softening point. Used for sealing and other applications.Information provided by Corning Incorporated. |
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CTE, linear | 3.20 µm/m-°C @Temperature 1000 °C |
1.78 µin/in-°F @Temperature 1830 °F |
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Chosun Refractories CRAZ-L43 Shroud Nozzle Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET). |
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CTE, linear | 3.20 µm/m-°C @Temperature 20.0 - 1000 °C |
1.78 µin/in-°F @Temperature 68.0 - 1830 °F |
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Ceradyne Ceralloy® 147-1B Reaction Bonded Silicon Nitride (Si3N4) Ceralloy® 147 Reaction Bonded Silicon Nitride (RBSN) is a high purity grade of silicon nitride. RBSN has excellent thermal shock resistance and outstanding compatibility with non-ferrous molten met.. |
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CTE, linear | 3.20 µm/m-°C @Temperature 20.0 - 1000 °C |
1.78 µin/in-°F @Temperature 68.0 - 1830 °F |
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Ceradyne Ceralloy® 147-5 Silicon Nitride Ceralloy® 147 Hot Pressed Silicon Nitride (HPSN) can be formulated into a variety of compositions having minimal densification aids. These HPSN compositions offer the highest strength of Ceradyne's.. |
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CTE, linear | 3.20 µm/m-°C @Temperature 20.0 - 1000 °C |
1.78 µin/in-°F @Temperature 68.0 - 1830 °F |
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Ceradyne Ceralloy® 147-A Hot Pressed Silicon Nitride (Si3N4) Ceralloy® 147 Reaction Bonded Silicon Nitride (RBSN) is a high purity grade of silicon nitride. RBSN has excellent thermal shock resistance and outstanding compatibility with non-ferrous molten met.. |
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CTE, linear | 3.20 µm/m-°C @Temperature 20.0 - 1000 °C |
1.78 µin/in-°F @Temperature 68.0 - 1830 °F |
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Ceradyne Ceralloy® 147-1E Silicon Nitride Ceralloy® 147 Hot Pressed Silicon Nitride (HPSN) can be formulated into a variety of compositions having minimal densification aids. These HPSN compositions offer the highest strength of Ceradynes .. |