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Polymer Property : Decomposition Temperature = 932 °F Product List

Thermal Properties

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Thermal Properties Metric English Comments
Decomposition Temperature 500 °C
932 °F
TGA; ASTM D3850
Rogers Corporation RO3003 Ceramic-Filled PTFE Composite, High Frequency Circuit Material
Features and Benefits:
Decomposition Temperature 500 °C
932 °F
TGA; ASTM D3850
Rogers Corporation RO3006 Ceramic-Filled PTFE Composite, High Frequency Circuit Material
Features and Benefits:
Decomposition Temperature 500 °C
932 °F
TGA; ASTM D3850
Rogers Corporation RO3010 Ceramic-Filled PTFE Composite, High Frequency Circuit Material
Features and Benefits:
Decomposition Temperature 500 °C
932 °F
TGA; ASTM D3850
Rogers Corporation RO3203 Woven-Glass Reinforced PTFE Laminate
Features and Benefits:Woven glass reinforcement - Improves rigidity for easier handlingUniform electrical and mechanical performance - ideal for complex multi-layer high frequency structuresLow diel..
Decomposition Temperature 500 °C
932 °F
TGA; ASTM D3850
Rogers Corporation RO3206 Woven-Glass Reinforced PTFE Laminate
Features and Benefits:Woven glass reinforcement - Improves rigidity for easier handlingUniform electrical and mechanical performance - ideal for complex multi-layer high frequency structuresLow diel..
Decomposition Temperature 500 °C
932 °F
TGA; ASTM D3850
Rogers Corporation RO3210 Woven-Glass Reinforced PTFE Laminate
Features and Benefits:Woven glass reinforcement - Improves rigidity for easier handlingUniform electrical and mechanical performance - ideal for complex multi-layer high frequency structuresLow diel..
Decomposition Temperature 500 °C
932 °F
TGA; ASTM D3850
Rogers Corporation RT/duroid® 5870 Glass Microfiber Reinforced PTFE High Frequency Laminate
RT/duroid® 5870 and 5880 glass microfiber reinforced PTFE composites are designed for exacting stripline and microstrip circuit applications. Glass reinforcing microfibers are randomly oriented to..
Decomposition Temperature 500 °C
932 °F
TGA; ASTM D3850
Rogers Corporation RT/duroid® 5880 Glass Microfiber Reinforced PTFE High Frequency Laminate
RT/duroid® 5870 and 5880 glass microfiber reinforced PTFE composites are designed for exacting stripline and microstrip circuit applications. Glass reinforcing microfibers are randomly oriented to..
Decomposition Temperature 500 °C
932 °F
TGA; ASTM D3850
Rogers Corporation RT/duroid® 6002 High Frequency Laminate
Features:Low loss for excellent high frequency performanceTight dielectric constant and thickness controlExcellent electrical and mechanical propertiesExtremely low thermal coefficient of dielectric..
Decomposition Temperature 500 °C
932 °F
TGA; ASTM D3850
Rogers Corporation RT/duroid® 6006 Ceramic-PTFE Composite Microwave Laminate
Features:High dielectric constant for circuit size reductionLow loss - Ideal for operating at X-band or belowTight dielectric constant and thickness control for repeatable circuit performanceLow moi..
Decomposition Temperature 500 °C
932 °F
TGA; ASTM D3850
Rogers Corporation RT/duroid® 6010.2LM Ceramic-PTFE Composite Microwave Laminate
Features:High dielectric constant for circuit size reductionLow loss - Ideal for operating at X-band or belowLow Z-axis expansion. Provides reliable plated through holes in multi-layer boardsTight ..
Decomposition Temperature 500 °C
932 °F
TGA; ASTM D3850
Rogers Corporation RT/duroid® 6202 High Frequency Laminate
Features:Low loss for excellent high frequency performanceTight dielectric constant and thickness controlExcellent electrical and mechanical propertiesExtremely low thermal coefficient of dielectric..
Decomposition Temperature 500 °C
932 °F
TGA; ASTM D3850
Rogers Corporation RT/duroid® 6202PR High Frequency Laminate
Features:Low loss for excellent high frequency performanceTight dielectric constant and thickness controlExcellent electrical and mechanical propertiesExtremely low thermal coefficient of dielectric..
Decomposition Temperature 500 °C
932 °F
ASTM D3850
Rogers Corporation RO3730 Antenna Grade Laminate
RO3730™ Laminates have the excellent thermo-mechanical properties and electrical characteristics that antenna designers need. The laminates have a dielectric constant of 3.0 and a loss tangent of..
Decomposition Temperature 500 °C
932 °F
DuPont™ Kevlar® 149 Fiber, diam. 12 µm
Applications: armor, belts, hoses, composite structures, cable sheathing, gaskets, brake pads, clutch linings, friction pads, slot insulation, phase barrier insulation, interturn insulation.KEVLAR®..
Decomposition Temperature >= 500 °C
>= 932 °F
Dow SiLK™ Y 120 Semiconductor Dielectric Resin
SiLK™ Y 120 has an average pore size of < 2nm and a range of 1-3 nm, porous SiLK™ resins enables continuous Tantulum PVD barriers for 65 nm technology and beyond. Information provided by Dow
Decomposition Temperature >= 500 °C
>= 932 °F
Dow SiLK™ Y 250 Semiconductor Dielectric Resin
SiLK™ Y 250 has an average pore size of < 2nm and a range of 1-3 nm, porous SiLK™ resins enables continuous Tantulum PVD barriers for 65 nm technology and beyond. Information provided by Dow
Decomposition Temperature >= 500 °C
>= 932 °F
Dow SiLK™ Y 80 Semiconductor Dielectric Resin
SiLK™ Y 80 has an average pore size of < 2nm and a range of 1-3 nm, porous SiLK™ resins enables continuous Tantulum PVD barriers for 65 nm technology and beyond. Information provided by Dow
Decomposition Temperature >= 500 °C
>= 932 °F
5 percent; IPC TM-650 2.4.24.6
Arlon AD250C PTFE/Woven Fiberglass/Microdispersed Ceramic Filled Laminate for RF & Microwave PCBs
For RF & Microwave Printed Circuit Boards. Very Low Loss PTFE and Ceramic Filled Composite (0.0014 Loss Tangent at 10GHz and Base Station Frequencies)Dielectric Constant (2.50) with Tight Tolerance..
Decomposition Temperature >= 500 °C
>= 932 °F
Onset; IPC TM-650 2.4.24.6
Arlon AD250C PTFE/Woven Fiberglass/Microdispersed Ceramic Filled Laminate for RF & Microwave PCBs
For RF & Microwave Printed Circuit Boards. Very Low Loss PTFE and Ceramic Filled Composite (0.0014 Loss Tangent at 10GHz and Base Station Frequencies)Dielectric Constant (2.50) with Tight Tolerance..
Decomposition Temperature 500 °C
932 °F
Onset; IPC TM-650 2.4.24.6
Arlon AD300C Commercial Microwave and RF Laminate Material
Excellent Thermal Coefficient of Dielectric Constant (TCEr = -25 ppm/°C)Excellent PIM performanceHigh Thermal Conductivity ideal for Higher Power DesignsReduced Coefficient of Thermal Expansion in ..
Decomposition Temperature >= 500 °C
>= 932 °F
5 percent; IPC TM-650 2.4.24.6
Arlon AD1000 PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards
Only Woven Glass Reinforced PTFE/Ceramic with Dk of 10.2 or greaterHigh Copper Peel Strength allows for thinner etched line widthsLowest insertion loss availableLarger Panel sizes availableLow moist..
Decomposition Temperature >= 500 °C
>= 932 °F
Onset; IPC TM-650 2.4.24.6
Arlon AD1000 PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards
Only Woven Glass Reinforced PTFE/Ceramic with Dk of 10.2 or greaterHigh Copper Peel Strength allows for thinner etched line widthsLowest insertion loss availableLarger Panel sizes availableLow moist..
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