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Polymer Property : Decomposition Temperature = 644 °F Product List

Thermal Properties

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Thermal Properties Metric English Comments
Decomposition Temperature 340 - 375 °C
644 - 707 °F
Thermal Stability via TGA : beginning - and at 1% weight loss in air
Solvay Specialty Polymers Solef® 21508 PVDF Copolymer  (discontinued **)
Key features of this grade: High Elongation, Wire & Cable, Plenum, Formulated. Recommended processing is extrusion. Available as powder & granules.General information about SOLEF® PVDF: SOLEF® P..
Decomposition Temperature 340 °C
644 °F
Hybrid Plastics POSS® MA0740 MethacryltrimethylsiloxyCyclopentyl-POSS®
POSS® Nanostructured Chemical Technology has two unique features: (1) the chemical composition is a hybrid, intermediate (RSiO1.5) between that of silica (SiO2) and silicones (R2SiO). (2) POSS®..
Decomposition Temperature 340 °C
644 °F
Degradation Temperature
Epoxy Technology EPO-TEK® 320NC Optically Opaque Epoxy
Material Description: A two component, black-colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modific..
Decomposition Temperature 340 °C
644 °F
Degradation Temperature
Epoxy Technology EPO-TEK® 320NC-2 Optically Opaque Epoxy
Material Description: A two component, black colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modific..
Decomposition Temperature 340 °C
644 °F
Degradation Temperature
Epoxy Technology EPO-TEK® B912-8 Epoxy
Product Description: A single component, thermally and electrically conductive, epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a pot..
Decomposition Temperature 340 °C
644 °F
Degradation Temperature
Epoxy Technology EPO-TEK® EJ2189-LV Electrically Conductive Epoxy
Low Viscosity, two component room temp curing conductive epoxyInformation Provided by Epoxy Technology
Decomposition Temperature 340 °C
644 °F
5 percent; IPC TM-650 2.3.41
Arlon 37N Polyimide Low-Flow
37N is a polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is requir..
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