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Polymer Property : Decomposition Temperature = 350 °C Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Decomposition Temperature | 350 °C | 662 °F | 5% weight loss; TGA; IPC-TM-650.2.4.24.6 |
| Park Electrochemical Nelco® N4000-13 High-Speed Multifunctional Epoxy Laminate and Prepreg The Nelco® N4000-13 series is an enhanced epoxy resin system engineered to provide both outstanding thermal and high signal speed / low signal loss properties. N4000-13 SI® is excellent for applic.. |
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| Decomposition Temperature | 350 °C | 662 °F | 5% weight loss; TGA; IPC-TM-650.2.4.24.6 |
| Park Electrochemical Nelco® N4350-13 RF Microwave Performance, Modified Epoxy The Nelco N4350-13 RF and N4380-13 RF series are enhanced epoxy resin systems specifically engineered to provide a unique solution for design applications that demand outstanding thermal properties,.. |
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| Decomposition Temperature | 350 °C | 662 °F | 5% weight loss; TGA; IPC-TM-650.2.4.24.6 |
| Park Electrochemical Nelco® N4380-13 RF Microwave Performance, Modified Epoxy The Nelco N4350-13 RF and N4380-13 RF series are enhanced epoxy resin systems specifically engineered to provide a unique solution for design applications that demand outstanding thermal properties,.. |
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| Decomposition Temperature | >= 350 °C | >= 662 °F | |
| Solvay Chemicals Ixper® 60C Calcium Peroxide IXPER® 60C is a Calcium Peroxide powder used in a wide range of applications in environmental, seed coating, baking e.g. marketsEINECS Number: 215-139-4/CAS Number: 1305-79-9Information provided .. |
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| Decomposition Temperature | >= 350 °C | >= 662 °F | |
| Solvay Chemicals Ixper® 75C Calcium Peroxide IXPER® 75C is a Calcium Peroxide powder used in a wide range of applications in environmental, seed coating, baking and oil drilling e.g. marketsEINECS Number: 215-139-4/CAS Number: 1305-79-9Info.. |
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| Decomposition Temperature | >= 350 °C | >= 662 °F | |
| Shandong Dongyue Shenzhou New Material Co CHF080 Perfluorosulfonic Acid Ion-Exchange Resin (PFSA) Conformable with: Q/DYS 001-2007Perfluorosulfonic Acid Ion-Exchange Resin is a polymer, with good stability and chemical resistance properties, which are widely used in chlor-alkali industry, proton.. |
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| Decomposition Temperature | >= 350 °C | >= 662 °F | |
| Shandong Dongyue Shenzhou New Material Co CHF095 Perfluorosulfonic Acid Ion-Exchange Resin (PFSA) Conformable with: Q/DYS 001-2007Perfluorosulfonic Acid Ion-Exchange Resin is a polymer, with good stability and chemical resistance properties, which are widely used in chlor-alkali industry, proton.. |
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| Decomposition Temperature | >= 350 °C | >= 662 °F | |
| Shandong Dongyue Shenzhou New Material Co CHFM 050 Perfluorosulfonic Acid Proton Exchange Membrane (PFSAPEM) Conformable with: Q/DYS 013-2007Perfluorosulfonic Acid Proton Exchange Membrane is a special polymer, mainly used for the processing of fuel cell membrane and chlor-alkali ion exchange membrane. Th.. |
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| Decomposition Temperature | >= 350 °C | >= 662 °F | |
| Shandong Dongyue Shenzhou New Material Co CHFM 250 Perfluorosulfonic Acid Proton Exchange Membrane (PFSAPEM) Conformable with: Q/DYS 013-2007Perfluorosulfonic Acid Proton Exchange Membrane is a special polymer, mainly used for the processing of fuel cell membrane and chlor-alkali ion exchange membrane. Th.. |
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| Decomposition Temperature | >= 350 °C | >= 662 °F | |
| Shandong Dongyue Shenzhou New Material Co CHFM 300 Perfluorosulfonic Acid Proton Exchange Membrane (PFSAPEM) Conformable with: Q/DYS 013-2007Perfluorosulfonic Acid Proton Exchange Membrane is a special polymer, mainly used for the processing of fuel cell membrane and chlor-alkali ion exchange membrane. Th.. |
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| Decomposition Temperature | 350 °C | 662 °F | Degradation Temperature |
| Epoxy Technology EPO-TEK® OE121 Black Epoxy Adhesive Material Description: A two component, low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. .. |
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| Decomposition Temperature | 350 °C | 662 °F | 1.7% weight loss per hour |
| Dow CYCLOTENE™ 4026-46 Advanced Electronic Resins (PhotoBisbenzocyclobutene BCB) CYCLOTENE™ 4026-46 advanced electronic resin is I-line-, G-line-, and broad band-sensitive photopolymer that has been developed for use as a dielectric in thin film microelectronic applications.Inf.. |
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| Decomposition Temperature | 350 °C | 662 °F | 1.7% weight loss per hour |
| Dow CYCLOTENE™ XU35075 Advanced Electronic Resins (PhotoBisbenzocyclobutene BCB) CYCLOTENE™ XU35075 advanced electronic resin is I-line-, G-line-, and broad band-sensitive photopolymer that has been developed for use as a dielectric in thin film microelectronic applications.Inf.. |
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| Decomposition Temperature | 350 °C | 662 °F | 1.7% weight loss per hour |
| Dow CYCLOTENE™ XU35132 Advanced Electronic Resins (PhotoBisbenzocyclobutene BCB) CYCLOTENE™ XU35132 advanced electronic resin is I-line-, G-line-, and broad band-sensitive photopolymer that has been developed for use as a dielectric in thin film microelectronic applications.Inf.. |
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| Decomposition Temperature | 350 °C | 662 °F | 1.7% weight loss per hour |
| Dow CYCLOTENE™ XU35133 Advanced Electronic Resins (PhotoBisbenzocyclobutene BCB) CYCLOTENE™ XU35133 advanced electronic resin is I-line-, G-line-, and broad band-sensitive photopolymer that has been developed for use as a dielectric in thin film microelectronic applications.Inf.. |
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| Decomposition Temperature | >= 350 °C | >= 662 °F | |
| BASF Basotect G Foam Basotect® is a flexible, open cell foam made from melamine resin, a thermoset polymer. Its characteristic feature is its three-dimensional network structure consisting of slender and thus easily sh.. |
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| Decomposition Temperature | >= 350 °C | >= 662 °F | |
| BASF Basotect V3012 Foam Basotect® is a flexible, open cell foam made from melamine resin, a thermoset polymer. Its characteristic feature is its three-dimensional network structure consisting of slender and thus easily sh.. |
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| Decomposition Temperature | >= 350 °C | >= 662 °F | |
| BASF Ultramid® KR 4355 G10 BK 23215 50% Glass Filled PA6/6T (Dry) Description: 50% glass-fiber reinforced product for injection molding; high toughness and rigidity; low water absorption, high melting point (285°C); mechanical properties remain constant up to 60°.. |
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| Decomposition Temperature | >= 350 °C | >= 662 °F | |
| BASF Ultramid® KR 4355 G5 BK 00564 25% Glass Filled PA6/6T (Dry) Description: 25% glass-fiber reinforced product for injection-molding; high toughness, strength and stiffness, low water absorption, high melting point (295°C [563°F]). The mechanical properties r.. |
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| Decomposition Temperature | >= 350 °C | >= 662 °F | |
| BASF Ultramid® KR 4355 G7 BK 00564 35% Glass Filled PA6/6T (Conditioned) Description: 35% glass-fiber reinforced product for injection-molding; high toughness, strength and stiffness, low water absorption, high melting point (295°C [563°F]). The mechanical properties r.. |
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| Decomposition Temperature | >= 350 °C | >= 662 °F | |
| BASF Ultramid® KR 4357 G6 30% Glass Filled PA6/6T (Dry) Description: 30% glass-fiber reinforced, impact-modified product for injection-molding; high toughness, strength and stiffness, low water absorption, high melting point (295°C [563°F]). The mechan.. |
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| Decomposition Temperature | >= 350 °C | >= 662 °F | |
| BASF Ultramid® KR 4357 G6 BK 00564 30% Glass Filled PA6/6T (Dry) Description: 30% glass-fiber reinforced, impact-modified product for injection-molding; high toughness, strength and stiffness, low water absorption, high melting point (295°C [563°F]). The mechan.. |
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| Decomposition Temperature | >= 350 °C | >= 662 °F | |
| BASF Ultramid® KR 4365 G5 35% Glass Filled PA6/6T FR (Conditioned) Description: Partially aromatic polyamide; flame retardant based on red phosphorus; low water absorption, high melting point (295°C); low tendency to form deposits on electrical contacts, very resi.. |
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| Decomposition Temperature | >= 350 °C | >= 662 °F | |
| BASF Ultramid® KR 4365 G5 35% Glass Filled PA6/6T FR (Dry) Description: Partially aromatic polyamide; flame retardant based on red phosphorus; low water absorption, high melting point (295°C); low tendency to form deposits on electrical contacts, very resi.. |
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| Decomposition Temperature | >= 350 °C | >= 662 °F | |
| BASF Ultramid® KR 4365 G5 BK 00100 35% Glass Filled PA6/6T FR (Dry) Description: Partially aromatic polyamide; flame retardant based on red phosphorus; low water absorption, high melting point (295°C); low tendency to form deposits on electrical contacts, very resi.. |
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| Decomposition Temperature | >= 350 °C | >= 662 °F | |
| BASF Basotect W Foam Basotect® is a flexible, open cell foam made from melamine resin, a thermoset polymer. Its characteristic feature is its three-dimensional network structure consisting of slender and thus easily sh.. |
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| Decomposition Temperature | 350 °C | 662 °F | 5% weight loss; TGA; IPC-TM-650.2.4.24.6 |
| Park Electrochemical Nelco® N4000-29 Multifunctional Epoxy The Nelco N4000-29 is an advanced, lead-free, low-CTE, high Tg (185º C by DSC) multifunctional epoxy dielectric substrate. This material has been designed for use not only in standard multilayer PW.. |
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