Thermal Properties | Metric | English | Comments |
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CTE, linear | 57.0 µm/m-°C @Thickness 0.0508 mm, Temperature 0.000 - 150 °C |
31.7 µin/in-°F @Thickness 0.00200 in, Temperature 32.0 - 302 °F |
Z-Direction; IPC-TM-650 2.1.41 |
Rogers Corporation Syron™ 7100 Thermoplastic Circuit Material SYRON™ 7100 thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. SYRON 7100 is thermally stable, with a .. |
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CTE, linear | 57.0 µm/m-°C @Temperature 0.000 - 150 °C |
31.7 µin/in-°F @Temperature 32.0 - 302 °F |
Z-Direction; IPC-TM-650 2.1.41 |
Rogers Corporation XT/duroid™ 8100 0.002" Woven Glass Reinforced Thermoplastic Circuit Material XT/duroid™ 8100 woven glass reinforced thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. XT/duroid 81.. |
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CTE, linear | 57.0 µm/m-°C @Temperature 0.000 - 20.0 °C |
31.7 µin/in-°F @Temperature 32.0 - 68.0 °F |
T<Tg; ASTM E831-93 |
Proto3000 Accura® Amethyst™ Material for use with Viper™ SLA® systems Optimized for the rapid and automated production of patterns and master molds for jewelry manufacturing. FEATURES:Outstanding accuracyExceptional detailHigh thermal resistanceDeep purple colorLow as.. |
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CTE, linear | 57.0 µm/m-°C @Temperature 30.0 - 100 °C |
31.7 µin/in-°F @Temperature 86.0 - 212 °F |
ASTM E831 |
3M Dyneon™ TFM™ 1600 Modified PTFE Powder
(discontinued **) Type III, gr. 2 PTFE. Dyneon TFM 1600 PTFE is a free-flowing powder for compression molding, isostatic molding, automatic molding, and ram extrusion. Dyneon™ TFM™ 1600 PTFE is a second-generatio.. |
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CTE, linear | 57.0 µm/m-°C @Temperature 30.0 - 100 °C |
31.7 µin/in-°F @Temperature 86.0 - 212 °F |
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3M Dyneon™ CC603 PTFE, 15% Fiberglass Filled
(discontinued **) Product Form: White, pelletized free-flowing powder. Applications include bearings, valve seats, seals.Data provided by Dyneon. |
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CTE, linear | 57.0 µm/m-°C @Temperature 30.0 - 100 °C |
31.7 µin/in-°F @Temperature 86.0 - 212 °F |
ASTM E831 |
3M Dyneon™ TF 4103 PTFE 15% Glass Fiber Filled
(discontinued **) Type II PTFE. Applications include valve seats, bearings, seals/gaskets, moldings, piston rings.Data provided by Dyneon. |
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CTE, linear | 57.0 µm/m-°C @Temperature 20.0 °C |
31.7 µin/in-°F @Temperature 68.0 °F |
Across Thickness; ASTM D-696 |
Glastic GLASTHERM HT220 Insulation Sheet Glastherm Grade HT220 is a thermal insulation sheet that is a highly heat-resistant material that combines low thermal conductivity with very high compressive strength at molding temperature. It is.. |
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CTE, linear | 57.0 µm/m-°C @Temperature 200 - 300 °C |
31.7 µin/in-°F @Temperature 392 - 572 °F |
DIN 53 752 |
Ensinger TECASINT 3022 Polyimide, Black, 15% Graphite (PI) TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel.. |
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CTE, linear | 57.0 µm/m-°C @Temperature 200 - 300 °C |
31.7 µin/in-°F @Temperature 392 - 572 °F |
DIN 53 752 |
Ensinger TECASINT 3062 Polyimide, Shiny Black, 15% Graphite, 10% PTFE (PI) TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel.. |
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CTE, linear | 57.0 µm/m-°C @Temperature 0.000 - 20.0 °C |
31.7 µin/in-°F @Temperature 32.0 - 68.0 °F |
T<Tg; ASTM E831-93 |
3D Systems Accura® Amethyst™ Plastic for Viper™ SLA® Systems Optimized for the rapid and automated production of patterns and master molds for jewelry manufacturing. For use with Viper™ SLA® systems.ApplicationsPatterns for use with low and high vulcanizing.. |
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CTE, linear | 57.0 µm/m-°C @Temperature 30.0 - 100 °C |
31.7 µin/in-°F @Temperature 86.0 - 212 °F |
ASTM E831 |
3M Dyneon™ TFM™ 1700 Modified PTFE Powder Type III, gr. 1 PTFE. Dyneon™ TFM™ 1700 PTFE is a second-generation modified polytetrafluoro-ethylene (PTFE) that maintains the exceptional chemical and heat resistance properties of first-genera.. |