Thermal Properties | Metric | English | Comments |
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CTE, linear | 54.0 µm/m-°C @Temperature 50.0 - 200 °C |
30.0 µin/in-°F @Temperature 122 - 392 °F |
DIN 53 752 |
Ensinger TECASINT 3012 Polyimide, Ochre Brown (PI) TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel.. |
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CTE, linear | 54.0 µm/m-°C @Temperature 50.0 - 200 °C |
30.0 µin/in-°F @Temperature 122 - 392 °F |
DIN 53 752 |
Ensinger TECASINT™ 2011 Polyimide (PI) TECASINT™ 2000 series of polyimide stock shapes provide a superior combination of high temperature and bearing and wear, properties that make it an ideal choice for the most demanding applications... |
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CTE, linear | 54.0 µm/m-°C @Temperature 20.0 °C |
30.0 µin/in-°F @Temperature 68.0 °F |
Cured property; alpha 1 |
Aptek 2712-A/B Very low stress silicone adhesive Very low stress silicone adhesive; -110ºC to 260ºC operating range; Low outgassing/space gradeAPTEK 2712-A/B is a two component, white, very soft, thixotropic, electrically insulative, silicone ad.. |
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CTE, linear | 54.0 µm/m-°C @Temperature 75.0 °C |
30.0 µin/in-°F @Temperature 167 °F |
DIN 53752 |
BASF Ultrason E 2010 PES Ultrason E 2010 is an unreinforced, medium viscosity standard injection molding PES grade. It flows readily and offers outstanding heat resistance and dimensional stability. It conforms to FDA req.. |
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CTE, linear | 54.0 µm/m-°C @Temperature 22.8 °C |
30.0 µin/in-°F @Temperature 73.0 °F |
MD; ASTM D696 |
Mitsui AURUM® PL450C Polyimide
(discontinued **) AURUM PL450C is a high performance thermoplastic polyimide for precision injection molded components and extruded products. A member of the AURUM family of advanced engineering resins, unfilled AURU.. |
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CTE, linear | 54.0 µm/m-°C @Temperature 73.0 °C |
30.0 µin/in-°F @Temperature 163 °F |
TD; ASTM D696 |
Mitsui AURUM® PL450C Polyimide
(discontinued **) AURUM PL450C is a high performance thermoplastic polyimide for precision injection molded components and extruded products. A member of the AURUM family of advanced engineering resins, unfilled AURU.. |