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Polymer Property : CTE, linear = 50.0 µm/m-°C Product List

Thermal Properties

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Thermal Properties Metric English Comments
CTE, linear 50.0 µm/m-°C

@Temperature 23.0 - 60.0 °C
27.8 µin/in-°F

@Temperature 73.4 - 140 °F
Murtfeldt Murinit® SP Polyphenylene Sulfide
Thanks to the low fiber content and integrated solid lubricant, Murinit® SP offers an excellent combination of good slide and wear behavior, high strength, and dimensional stability – even at high..
CTE, linear 50.0 µm/m-°C

@Temperature 23.0 - 60.0 °C
27.8 µin/in-°F

@Temperature 73.4 - 140 °F
Murtfeldt Murylon® A GF Nylon 66, Glass Reinforced
Murylon® A’s impressive characteristics are enhanced with admixed glass fibers. This results in a clear improvement in cold flow behavior and dimensional stability, enabling higher static pressure..
CTE, linear 50.0 µm/m-°C

@Temperature -55.0 - 280 °C
27.8 µin/in-°F

@Temperature -67.0 - 536 °F
Z Direction, 4.0 mil thickness; IPC-TM-650 2.4.41
Rogers Corporation RO4450B Prepreg
Prepreg is commonly used to inexpensively form less critical signal layers in antenna designs. A high post-cure Tg makes RO4400 series prepreg an excellent choice for multi-layers requiring sequent..
CTE, linear 50.0 µm/m-°C

@Temperature 50.0 - 155 °C
27.8 µin/in-°F

@Temperature 122 - 311 °F
Z-Axis Alpha 1; IPC-TM-650.2.4.41
Park Electrochemical Nelco® N4000-7 SI® FR-4 Epoxy Laminate and Prepreg
The Nelco® N4000-7 low-CTE epoxy laminate and prepreg system is a cost-effective solution for use in a broad range of multilayer PCB designs requiring low Z-axis expansion, excellent thermal stabil..
CTE, linear 50.0 µm/m-°C

@Temperature 23.0 - 100 °C
27.8 µin/in-°F

@Temperature 73.4 - 212 °F
ASTM E831
Quadrant EPP Ketron® 1000 LSG PEEK, Biocompatibility tested (ISO Product Data Sheet)
KETRON® PEEK LSG natural / black stock shapes are produced from batches of Victrex PEEK. This material exhibits a unique combination of mechanical properties, temperature and chemical resistance. ..
CTE, linear 50.0 µm/m-°C

@Temperature -55.0 - 280 °C
27.8 µin/in-°F

@Temperature -67.0 - 536 °F
Z Direction; IPC-TM-650 2.4.41
Rogers Corporation RO4450F Prepreg
Prepreg is commonly used to inexpensively form less critical signal layers in antenna designs. A high post-cure Tg makes RO4400 series prepreg an excellent choice for multi-layers requiring sequent..
CTE, linear 50.0 µm/m-°C

@Temperature 50.0 - 155 °C
27.8 µin/in-°F

@Temperature 122 - 311 °F
Z-Axis Alpha 1; IPC-TM-650.2.4.41
Park Electrochemical Nelco® N4000-7 FR-4 Epoxy Laminate and Prepreg
The Nelco® N4000-7 low-CTE epoxy laminate and prepreg system is a cost-effective solution for use in a broad range of multilayer PCB designs requiring low Z-axis expansion, excellent thermal stabil..
CTE, linear 50.0 µm/m-°C

@Temperature 23.0 - 100 °C
27.8 µin/in-°F

@Temperature 73.4 - 212 °F
ASTM E831
Quadrant EPP Ketron® LSG PEEK-CLASSIX Biocompatibility tested (ASTM Product Data Sheet)
KETRON® PEEK-CLASSIX LSG white stock shapes are produced from Invibio® PEEK-CLASSIX White resin. This material exhibits a unique combination of mechanical properties, temperature and chemical re..
CTE, linear 50.0 µm/m-°C

@Temperature <=143 °C
27.8 µin/in-°F

@Temperature <=289 °F
Average below Tg; ASTM D696
Victrex® PEEK 650CA30 30% Carbon Fiber Filled, PolyEtherEtherKetone
High performance thermoplastic material, 30% carbon fiber reinforced PolyEtherEtherKetone (PEEK), semi crystalline, granules for injection molding and extrusion, low flow, FDA food contact compliant..
CTE, linear 50.0 µm/m-°C

@Temperature 30.0 - 100 °C
27.8 µin/in-°F

@Temperature 86.0 - 212 °F
ASTM E831
3M Dyneon™ CC605 PTFE 25% Fiberglass Filled  (discontinued **)
Product Form: White, pelletized free-flowing powder. Applications include bearings, valve seats, seals.Data provided by Dyneon.
CTE, linear 50.0 µm/m-°C

@Temperature <=150 °C
27.8 µin/in-°F

@Temperature <=302 °F
ISO E 831
Wolf Kunststoff ZEDEX® ZX-530EL3 066 Polymer Alloy, Carbon Fiber Reinforced
Main Characteristics: Low thermal expansion; High rigidity; High yield stress; High wear resistance; Low friction; Stress ResistantApplications: Chemical Engineering; Laboratory Technology; Automitv..
CTE, linear 50.0 µm/m-°C

@Temperature 25.0 - 100 °C
27.8 µin/in-°F

@Temperature 77.0 - 212 °F
Vertical; ASTM D696
Unitika UNILATE® 1 NC PET
Flame resisting gradeUNILATE® products are plate materials prepared by using a polyethylene terephthalate (PET resin) as the main component, blending it with glass staple fiber, inorganic filler, a..
CTE, linear 50.0 µm/m-°C

@Temperature -26.0 °C
27.8 µin/in-°F

@Temperature -14.8 °F
DIN 53752
BASF Ultrason E 2010 PES
Ultrason E 2010 is an unreinforced, medium viscosity standard injection molding PES grade. It flows readily and offers outstanding heat resistance and dimensional stability. It conforms to FDA req..
CTE, linear 50.0 µm/m-°C

@Temperature 23.0 - 60.0 °C
27.8 µin/in-°F

@Temperature 73.4 - 140 °F
Murtfeldt Murpec® Polyetheretherketone
In comparison with other thermoplastics, Murpec® has an exceptionally low thermal expansion coefficient. This property provides optimum dimensional stability and means that dimensions do not change..
CTE, linear 50.0 µm/m-°C

@Temperature 20.0 °C
27.8 µin/in-°F

@Temperature 68.0 °F
Estimated by MatWeb from similar grades
EVALCA EVAL® EF-F Ethylene Vinyl Alcohol Copolymer Film  (discontinued **)
32 mol % Ethylene. Non oriented type film; property values for 15 µm film.Data provided by EVALCA. Applications: EVOH is used in packaging applications because of its outstanding gas barrier pro..
CTE, linear 50.0 µm/m-°C

@Temperature 0.000 - 150 °C
27.8 µin/in-°F

@Temperature 32.0 - 302 °F
X-Direction; IPC-TM-650 2.4.41
Rogers Corporation 2929 Bondply Unreinforced, Hydrocarbon based Thin Film Adhesive System
Low dielectric constant and loss tangentIdeal for multi-layer bondingCompatible with traditional processing methodsCompatible with a broad range of material types including PTFE compositesReliable t..
CTE, linear 50.0 µm/m-°C

@Temperature 0.000 - 150 °C
27.8 µin/in-°F

@Temperature 32.0 - 302 °F
Y-Direction; IPC-TM-650 2.4.41
Rogers Corporation 2929 Bondply Unreinforced, Hydrocarbon based Thin Film Adhesive System
Low dielectric constant and loss tangentIdeal for multi-layer bondingCompatible with traditional processing methodsCompatible with a broad range of material types including PTFE compositesReliable t..
CTE, linear 50.0 µm/m-°C

@Temperature 0.000 - 150 °C
27.8 µin/in-°F

@Temperature 32.0 - 302 °F
Z-Direction; IPC-TM-650 2.4.41
Rogers Corporation 2929 Bondply Unreinforced, Hydrocarbon based Thin Film Adhesive System
Low dielectric constant and loss tangentIdeal for multi-layer bondingCompatible with traditional processing methodsCompatible with a broad range of material types including PTFE compositesReliable t..
CTE, linear 50.0 µm/m-°C

@Temperature <=143 °C
27.8 µin/in-°F

@Temperature <=289 °F
Average below Tg; ISO 11359
Victrex® PEEK 450GL15 Polyetheretherketone, 15% Glass Fibre Reinforced
Product Description:High performance thermoplastic material, 15% glass fibre reinforced Polyetheretherketone (PEEK), semi crystalline, granules for injection moulding and extrusion, standard flow, F..
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