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Polymer Property : CTE, linear = 33.3 µin/in-°F Product List

Thermal Properties

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Thermal Properties Metric English Comments
CTE, linear 60.0 µm/m-°C

@Temperature 23.0 - 100 °C
33.3 µin/in-°F

@Temperature 73.4 - 212 °F
Murtfeldt Murinit® SP Polyphenylene Sulfide
Thanks to the low fiber content and integrated solid lubricant, Murinit® SP offers an excellent combination of good slide and wear behavior, high strength, and dimensional stability – even at high..
CTE, linear 60.0 µm/m-°C

@Temperature 23.0 - 100 °C
33.3 µin/in-°F

@Temperature 73.4 - 212 °F
Murtfeldt Murylon® A GF Nylon 66, Glass Reinforced
Murylon® A’s impressive characteristics are enhanced with admixed glass fibers. This results in a clear improvement in cold flow behavior and dimensional stability, enabling higher static pressure..
CTE, linear 60.0 µm/m-°C

@Temperature -55.0 - 280 °C
33.3 µin/in-°F

@Temperature -67.0 - 536 °F
Z Direction, 3.6 mil thickness; IPC-TM-650 2.4.41
Rogers Corporation RO4450B Prepreg
Prepreg is commonly used to inexpensively form less critical signal layers in antenna designs. A high post-cure Tg makes RO4400 series prepreg an excellent choice for multi-layers requiring sequent..
CTE, linear 60.0 µm/m-°C

@Temperature 23.0 - 60.0 °C
33.3 µin/in-°F

@Temperature 73.4 - 140 °F
Murtfeldt Murylat® Polyethylene Terephthalate
Thanks to its extremely low absorption of moisture and low expansion coefficient, Murylat® is ideally suited for the processing of precision parts. Murylat® has an extremely high hardness grade an..
CTE, linear 60.0 µm/m-°C

@Temperature <=143 °C
33.3 µin/in-°F

@Temperature <=289 °F
Average below Tg; ISO 11359
Victrex® PEEK 450FE20 Polyetheretherketone, 20% PTFE
Product Description:High performance thermoplastic material, 20% filled with PTFE Polyetheretherketone (PEEK), semi crystalline, granules for injection moulding and extrusion, standard flow, FDA foo..
CTE, linear 60.0 µm/m-°C

@Temperature <=100 °C
33.3 µin/in-°F

@Temperature <=212 °F
ISO E 830
Wolf Kunststoff ZEDEX® ZX-530 A5D Polymer Alloy
Main Characteristics: Low Creep; Low moisture absorption; Flame retardant; Low impurity ions; Good machinability; FDA compliant LABS; Extremely low outgassing; Less expensive than PEEK; Stress resis..
CTE, linear 60.0 µm/m-°C

@Temperature <=100 °C
33.3 µin/in-°F

@Temperature <=212 °F
ISO E 830
Wolf Kunststoff ZEDEX® ZX-530KF15 A5M Polymer Alloy
Main Characteristics: High elongation; High impact strength; Stress resistantApplications: Chemical Engineering; Laboratory Technology; Automitve Technology; Machine ToolsInformation provided by Zed..
CTE, linear 60.0 - 67.0 µm/m-°C

@Temperature -40.0 - 0.000 °C
33.3 - 37.2 µin/in-°F

@Temperature -40.0 - 32.0 °F
UV Postcure; ASTM E831-05
DSM Somos® BioClear
Parts created with Somos® BioClear are designed for medical applications that are non-implant and have limited contact with the body such as device prototyping. They are shatter-resistant so they w..
CTE, linear 60.0 µm/m-°C

@Temperature 125 °C
33.3 µin/in-°F

@Temperature 257 °F
DIN 53752
BASF Ultrason S 2010 PSU
Ultrason S 2010 is an unreinforced, medium viscosity standard injection molding PSU grade. It flows readily and offers outstanding heat resistance and dimensional stability. It conforms to FDA req..
CTE, linear 60.0 µm/m-°C

@Temperature 175 °C
33.3 µin/in-°F

@Temperature 347 °F
DIN 53752
BASF Ultrason E 2010 PES
Ultrason E 2010 is an unreinforced, medium viscosity standard injection molding PES grade. It flows readily and offers outstanding heat resistance and dimensional stability. It conforms to FDA req..
CTE, linear 60.0 µm/m-°C

@Temperature -40.0 - 20.0 °C
33.3 µin/in-°F

@Temperature -40.0 - 68.0 °F
3M Scotch-Weld™ DP-100 Epoxy Adhesive
3M™ Scotch-Weld™ Epoxy Adhesive DP-100 is a two-part adhesives offering fast cure and machinability.Information provided by 3M
CTE, linear 60.0 µm/m-°C

@Temperature -50.0 - 10.0 °C
33.3 µin/in-°F

@Temperature -58.0 - 50.0 °F
3M Scotch-Weld™ 3501 B/A Gray Epoxy Adhesive
3M™ Scotch-Weld™ Epoxy Adhesive 3501 B/A Gray is a rapid room temperature curing, two-part epoxy adhesives for use in bonding many metals, wood, and a variety of plastics. Equal parts by volume ar..
CTE, linear 60.0 µm/m-°C

@Temperature -50.0 - 10.0 °C
33.3 µin/in-°F

@Temperature -58.0 - 50.0 °F
3M Scotch-Weld™ DP 3501 Epoxy Adhesive
3M™ Scotch-Weld™ Epoxy Adhesive DP 3501 is a rapid room temperature curing, two-part epoxy adhesives for use in bonding many metals, wood, and a variety of plastics. Equal parts by volume are easi..
CTE, linear 60.0 µm/m-°C

@Temperature <=34.0 °C
33.3 µin/in-°F

@Temperature <=93.2 °F
below Tg
Resinlab® EP1026 Clear Epoxy Adhesive
Resinlab™ EP1026 Clear is a two part unfilled epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free flowing in ..
CTE, linear 60.0 µm/m-°C

@Temperature <=34.0 °C
33.3 µin/in-°F

@Temperature <=93.2 °F
below Tg
Resinlab® EP1026 Black Epoxy Adhesive
Resinlab™ EP1026 Black is a two part unfilled epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free flowing in ..
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