Thermal Properties | Metric | English | Comments |
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CTE, linear | 60.0 µm/m-°C @Temperature 23.0 - 100 °C |
33.3 µin/in-°F @Temperature 73.4 - 212 °F |
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Murtfeldt Murinit® SP Polyphenylene Sulfide Thanks to the low fiber content and integrated solid lubricant, Murinit® SP offers an excellent combination of good slide and wear behavior, high strength, and dimensional stability – even at high.. |
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CTE, linear | 60.0 µm/m-°C @Temperature 23.0 - 100 °C |
33.3 µin/in-°F @Temperature 73.4 - 212 °F |
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Murtfeldt Murylon® A GF Nylon 66, Glass Reinforced Murylon® A’s impressive characteristics are enhanced with admixed glass fibers. This results in a clear improvement in cold flow behavior and dimensional stability, enabling higher static pressure.. |
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CTE, linear | 60.0 µm/m-°C @Temperature -55.0 - 280 °C |
33.3 µin/in-°F @Temperature -67.0 - 536 °F |
Z Direction, 3.6 mil thickness; IPC-TM-650 2.4.41 |
Rogers Corporation RO4450B Prepreg Prepreg is commonly used to inexpensively form less critical signal layers in antenna designs. A high post-cure Tg makes RO4400 series prepreg an excellent choice for multi-layers requiring sequent.. |
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CTE, linear | 60.0 µm/m-°C @Temperature 23.0 - 60.0 °C |
33.3 µin/in-°F @Temperature 73.4 - 140 °F |
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Murtfeldt Murylat® Polyethylene Terephthalate Thanks to its extremely low absorption of moisture and low expansion coefficient, Murylat® is ideally suited for the processing of precision parts. Murylat® has an extremely high hardness grade an.. |
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CTE, linear | 60.0 µm/m-°C @Temperature <=143 °C |
33.3 µin/in-°F @Temperature <=289 °F |
Average below Tg; ISO 11359 |
Victrex® PEEK 450FE20 Polyetheretherketone, 20% PTFE Product Description:High performance thermoplastic material, 20% filled with PTFE Polyetheretherketone (PEEK), semi crystalline, granules for injection moulding and extrusion, standard flow, FDA foo.. |
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CTE, linear | 60.0 µm/m-°C @Temperature <=100 °C |
33.3 µin/in-°F @Temperature <=212 °F |
ISO E 830 |
Wolf Kunststoff ZEDEX® ZX-530 A5D Polymer Alloy Main Characteristics: Low Creep; Low moisture absorption; Flame retardant; Low impurity ions; Good machinability; FDA compliant LABS; Extremely low outgassing; Less expensive than PEEK; Stress resis.. |
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CTE, linear | 60.0 µm/m-°C @Temperature <=100 °C |
33.3 µin/in-°F @Temperature <=212 °F |
ISO E 830 |
Wolf Kunststoff ZEDEX® ZX-530KF15 A5M Polymer Alloy Main Characteristics: High elongation; High impact strength; Stress resistantApplications: Chemical Engineering; Laboratory Technology; Automitve Technology; Machine ToolsInformation provided by Zed.. |
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CTE, linear | 60.0 - 67.0 µm/m-°C @Temperature -40.0 - 0.000 °C |
33.3 - 37.2 µin/in-°F @Temperature -40.0 - 32.0 °F |
UV Postcure; ASTM E831-05 |
DSM Somos® BioClear Parts created with Somos® BioClear are designed for medical applications that are non-implant and have limited contact with the body such as device prototyping. They are shatter-resistant so they w.. |
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CTE, linear | 60.0 µm/m-°C @Temperature 125 °C |
33.3 µin/in-°F @Temperature 257 °F |
DIN 53752 |
BASF Ultrason S 2010 PSU Ultrason S 2010 is an unreinforced, medium viscosity standard injection molding PSU grade. It flows readily and offers outstanding heat resistance and dimensional stability. It conforms to FDA req.. |
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CTE, linear | 60.0 µm/m-°C @Temperature 175 °C |
33.3 µin/in-°F @Temperature 347 °F |
DIN 53752 |
BASF Ultrason E 2010 PES Ultrason E 2010 is an unreinforced, medium viscosity standard injection molding PES grade. It flows readily and offers outstanding heat resistance and dimensional stability. It conforms to FDA req.. |
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CTE, linear | 60.0 µm/m-°C @Temperature -40.0 - 20.0 °C |
33.3 µin/in-°F @Temperature -40.0 - 68.0 °F |
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3M Scotch-Weld™ DP-100 Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP-100 is a two-part adhesives offering fast cure and machinability.Information provided by 3M |
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CTE, linear | 60.0 µm/m-°C @Temperature -50.0 - 10.0 °C |
33.3 µin/in-°F @Temperature -58.0 - 50.0 °F |
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3M Scotch-Weld™ 3501 B/A Gray Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive 3501 B/A Gray is a rapid room temperature curing, two-part epoxy adhesives for use in bonding many metals, wood, and a variety of plastics. Equal parts by volume ar.. |
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CTE, linear | 60.0 µm/m-°C @Temperature -50.0 - 10.0 °C |
33.3 µin/in-°F @Temperature -58.0 - 50.0 °F |
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3M Scotch-Weld™ DP 3501 Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP 3501 is a rapid room temperature curing, two-part epoxy adhesives for use in bonding many metals, wood, and a variety of plastics. Equal parts by volume are easi.. |
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CTE, linear | 60.0 µm/m-°C @Temperature <=34.0 °C |
33.3 µin/in-°F @Temperature <=93.2 °F |
below Tg |
Resinlab® EP1026 Clear Epoxy Adhesive Resinlab™ EP1026 Clear is a two part unfilled epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free flowing in .. |
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CTE, linear | 60.0 µm/m-°C @Temperature <=34.0 °C |
33.3 µin/in-°F @Temperature <=93.2 °F |
below Tg |
Resinlab® EP1026 Black Epoxy Adhesive Resinlab™ EP1026 Black is a two part unfilled epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free flowing in .. |