Polymer Property : Glass Transition Temp, Tg = 86.0 Â°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Glass Transition Temp, Tg	30.0 Â°C	86.0 Â°F
Mallard Creek Polymers ROVENEÂ® 6014 Acrylic Emulsion Applications: RoveneÂ® 6014 is a self crosslinking acrylic polymer providing a stiff hand to frothed or saturated substrates. RoveneÂ® 6014 is recommended for various nonwoven and paper applicat..
Glass Transition Temp, Tg	30.0 Â°C	86.0 Â°F
Mallard Creek Polymers RoveneÂ® 6117 Acrylic Emulsion Applications: RoveneÂ® 6117 is a clear drying, 100% acrylic, water resistant latex emulsion designed to provide protection for all types of concrete, cementitious and rigid surfaces. RoveneÂ® 61..
Glass Transition Temp, Tg	30.0 °C	86.0 °F
Master Bond FLM36 B-staged film for high performance bonding and sealing Master Bond FLM36 is a film adhesive with exceptional strength properties, high temperature resistance and first class thermal conductivity and electrical insulation properties. Based on the Master ..
Glass Transition Temp, Tg	<= 30.0 °C	<= 86.0 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® 310M-T Flexible Epoxy Material Description: A two component, flexible epoxy designed for low stress applications in semiconductor, hybrid, medical, acoustical and optical industries. Replacement for EPO-TEK® 310T.Info..
Glass Transition Temp, Tg	>= 30.0 °C	>= 86.0 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® E2036 Epoxy Product Description: A two component, slightly flexible, silver-filled, electrically conductive adhesive for semiconductor and electronic assemblies. It is a low Tg epoxy, intended for many kinds o..
Glass Transition Temp, Tg	>= 30.0 °C	>= 86.0 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® EJ2189 Electrically Conductive Epoxy Product Description: EPO-TEK® EJ2189 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although othe..
Glass Transition Temp, Tg	>= 30.0 °C	>= 86.0 °F	Post-Cure Dynamic Scan 20200°C; Ramp -40200°C @ 20°C/Min
Epoxy Technology EPO-TEK® OG159-2 UV Cure Optical Epoxy Material Description: A single component, high viscosity, UV curable epoxy adhesive designed for sealing glass plates together in the LCD/OLED/display industry. It contains 1mil glass beads for bon..
Glass Transition Temp, Tg	30.0 °C	86.0 °F	TM R050-25
Resinlab® EP1026HP Epoxy Adhesive Resinlab™ EP1026HP is a high performance fast setting epoxy adhesive designed for bonding metals, ceramics, glass and most plastics. This product gives good resistance to water salt spray, inorgan..
Glass Transition Temp, Tg	30.0 °C	86.0 °F	TM R050-25
Resinlab® EP1282 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1282 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It is recognized under the Component Recognition Program of Underwriters Laborat..
Glass Transition Temp, Tg	30.0 °C	86.0 °F
DuPont Performance Polymers Hypalon® CP-826 Adhesion Primer, General Description (discontinued **) Hypalon CP 826 is a chlorinated, maleic anhydride grafted polypropylene resin.Suggested End Uses: Adhesion primer for:PolypropylenePolypropylene blends with TPOs (auto bumpers)Polyurethane foam, (at..