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Polymer Property : Glass Transition Temp, Tg = 80.0 °C Product List

Thermal Properties

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Thermal Properties Metric English Comments
Glass Transition Temp, Tg 80.0 °C
176 °F
Resinlab® EP691 Black Unfilled Electronic Grade Epoxy Encapsulant
Resinlab™ EP 691 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting..
Glass Transition Temp, Tg 80.0 °C
176 °F
DSC
Eastman EASTALLOY Polymer DA003-8999K, Clear Alloy  (discontinued **)
Properties below based on a film thickness of 250 microns. CO2 Permeability is 49 cm3·mm/m2·24h·atm per ASTM D 1434.Product Description: EASTALLOY DA003-8999K Polymer is a clear copolyester/pol..
Glass Transition Temp, Tg 80.0 °C
176 °F
10°C/min; DAM; ISO 11357-1/-2
DuPont Performance Polymers Zytel® 70G25HSLR NC010 Nylon 66  (Unverified Data**)
Zytel® 70G25HSLR NC010 is a 25% glass fiber reinforced, heat stabilized, hydrolysis resistant polyamide 66 resin for injection molding.Information provided by DuPont Performance Polymers
Glass Transition Temp, Tg 80.0 °C
176 °F
ASTM E1640-99 (by DMA)
Lord Adhesives 320 / 322 Epoxy Adhesive
LORD® 320/322 adhesive is a general purpose, two component epoxy adhesive system formulated for primerless adhesion to automotive sheet molded compounds (SMC). This adhesive system also provides ..
Glass Transition Temp, Tg 80.0 °C
176 °F
DSC
Wanshijie PETG Sheet
PETG is also named GPET. It is made of a kind of non-crystalline PET resin sourced from cyclohexanediol modification. PETG differs greatly from PET and PCT. PETG is a kind of non-crystalline copolym..
Glass Transition Temp, Tg 80.0 °C
176 °F
Zeus FEP Tubing
FEP, fluorinated ethylene propylene, is a melt processable fluoropolymer that allows for long, continuous lengths and has several distinct advantages over PTFE. Applications where FEP tubing is usua..
Glass Transition Temp, Tg 80.0 °C
176 °F
Ultimate Tg
Tra-Con Tra-Bond 2143G Medium Viscosity Polyamide Epoxy Adhesive
TRA-BOND 2143G is a medium viscosity adhesive recommended for industrial bonding and sealing applications where toughness, impact resistance, and superior mechanical properties are required. This tw..
Glass Transition Temp, Tg 80.0 °C
176 °F
Ultimate Tg
Tra-Con Tra-Bond 9059D Rigid Unfilled Epoxy Adhesive
TRA-BOND 9059D rigid, unfilled epoxy adhesive exhibits good dimensional stability for gyro applications. This material is a blue-green color.Information provided by Tra-Con Inc.
Glass Transition Temp, Tg 80.0 °C
176 °F
DMA
Hexcel® HexPly® M34 75°C (167°F) Curing Epoxy Matrix
HexPly® M34 is an epoxy system, specifically developed for low temperature curing of large structural components, particularly in industrial markets. HexPly® M34 is a self-extinguishing system, pr..
Glass Transition Temp, Tg 80.0 °C
176 °F
DSC
Eastman Cadence™ GS3 Copolyester for film calendering
Eastman Cadence™ copolyester, for calendered films, is a specialty plastic developed to meet the demand for an environmentally responsible material for the calendering industry. Available in diffe..
Glass Transition Temp, Tg 80.0 °C
176 °F
DSC
Eastman Drystar 0601 Copolyester, Injection Molded
This product-line is designed to meet the needs of converters seeking value-added solutions to their drying requirements of copolyesters. Eastman’s copolyesters are highly valued for their excellen..
Glass Transition Temp, Tg 80.0 °C
176 °F
Eastman Eastar GN007 PETG Copolyester
ISO data as provided by the manufacturer, Eastman Chemical
Glass Transition Temp, Tg 80.0 °C
176 °F
DSC
Eastman GSP01 Copolyester for Film and Sheet Extrusion
Applications:Consumer e-packaging trayElectronic packagingElectrostatic dissipative trayProduct Description: GSP01 is a clear, amorphous material. Because of its clarity, toughness and good melt s..
Glass Transition Temp, Tg 80.0 °C
176 °F
ETM 300-90
ExxonMobil ESCOREZ™ 5637 Petroleum Hydrocarbon Resin
Light colored aromatic modified, cycloaliphatic hydrocarbon resin. Designed to tackify a variety of adhesive polymers including EVA, SIS and SEBS block copolymers and metallocene polyolefines. Avail..
Glass Transition Temp, Tg >= 80.0 °C
>= 176 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® 360T High Temperature Epoxy
Material Description: A two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications. It is a thixotropic..
Glass Transition Temp, Tg >= 80.0 °C
>= 176 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® EK1000-MP Epoxy
Material Description: A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding ..
Glass Transition Temp, Tg >= 80.0 °C
>= 176 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® H20E-MP Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H20E-MP is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al..
Glass Transition Temp, Tg >= 80.0 °C
>= 176 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® H20-LC Electrically Conductive, Silver Epoxy
Product Description: EPO TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used exte..
Glass Transition Temp, Tg >= 80.0 °C
>= 176 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® H27D Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H27D is a two component, silver-filled epoxy adhesive designed for semiconductor and hybrid-microelectronic packaging applications.Advantages & Application Notes: Rheo..
Glass Transition Temp, Tg 80.0 °C
176 °F
DAM; 10°C/min; ISO 11357-1/-2
DuPont Performance Polymers Zytel® 70G43HSLA BK099 Nylon 66  (Unverified Data**)
43% Glass Reinforced Heat Stabilized Polyamide 66 Zytel 70G43HSLA BK099 is a 43% glass fiber reinforced heat stabilized black polyamide 66 resin for injection molding.Information provided by DuPont ..
Glass Transition Temp, Tg 80.0 °C
176 °F
DAM; 10°C/min; ISO 11357-1/-2
DuPont Performance Polymers Zytel® FG70G50HSLA BK309 Nylon 66  (Unverified Data**)
50% Glass Reinforced Heat Stabilized Polyamide 66 with Developed for Food Contact Applications Information provided by DuPont Performance Polymers
Glass Transition Temp, Tg 80.0 °C
176 °F
DAM; 10°C/min; DS; ISO 11357-1/-2
DuPont Performance Polymers Zytel® FR50 NC010A Nylon 66  (Unverified Data**)
25% Glass Reinforced Flame Retardant Polyamide 66 Zytel FR50 NC010A is a 25% glass fiber reinforced flame retardant polyamide 66 resin for injection molding.Information provided by DuPont Performanc..
Glass Transition Temp, Tg >= 80.0 °C
>= 176 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also ..
Glass Transition Temp, Tg >= 80.0 °C
>= 176 °F
Dynamic Cure 20—250°C /ISO 25 Min; Ramp -10—250°C @ 20°C/Min
Epoxy Technology EPO-TEK® H20E-175 Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H20E-175 is a two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor / J..
Glass Transition Temp, Tg 80.0 °C
176 °F
TM R050-25
Resinlab® EP691 Unfilled Electronic Grade Epoxy Encapsulant
Resinlab™ EP691 is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting and ad..
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