Thermal Properties | Metric | English | Comments |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | |
Resinlab® EP691 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP 691 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting.. |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | DSC |
Eastman EASTALLOY Polymer DA003-8999K, Clear Alloy
(discontinued **) Properties below based on a film thickness of 250 microns. CO2 Permeability is 49 cm3·mm/m2·24h·atm per ASTM D 1434.Product Description: EASTALLOY DA003-8999K Polymer is a clear copolyester/pol.. |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | 10°C/min; DAM; ISO 11357-1/-2 |
DuPont Performance Polymers Zytel® 70G25HSLR NC010 Nylon 66
(Unverified Data**) Zytel® 70G25HSLR NC010 is a 25% glass fiber reinforced, heat stabilized, hydrolysis resistant polyamide 66 resin for injection molding.Information provided by DuPont Performance Polymers |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | ASTM E1640-99 (by DMA) |
Lord Adhesives 320 / 322 Epoxy Adhesive LORD® 320/322 adhesive is a general purpose, two component epoxy adhesive system formulated for primerless adhesion to automotive sheet molded compounds (SMC). This adhesive system also provides .. |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | DSC |
Wanshijie PETG Sheet PETG is also named GPET. It is made of a kind of non-crystalline PET resin sourced from cyclohexanediol modification. PETG differs greatly from PET and PCT. PETG is a kind of non-crystalline copolym.. |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | |
Zeus FEP Tubing FEP, fluorinated ethylene propylene, is a melt processable fluoropolymer that allows for long, continuous lengths and has several distinct advantages over PTFE. Applications where FEP tubing is usua.. |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | Ultimate Tg |
Tra-Con Tra-Bond 2143G Medium Viscosity Polyamide Epoxy Adhesive TRA-BOND 2143G is a medium viscosity adhesive recommended for industrial bonding and sealing applications where toughness, impact resistance, and superior mechanical properties are required. This tw.. |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | Ultimate Tg |
Tra-Con Tra-Bond 9059D Rigid Unfilled Epoxy Adhesive TRA-BOND 9059D rigid, unfilled epoxy adhesive exhibits good dimensional stability for gyro applications. This material is a blue-green color.Information provided by Tra-Con Inc. |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | DMA |
Hexcel® HexPly® M34 75°C (167°F) Curing Epoxy Matrix HexPly® M34 is an epoxy system, specifically developed for low temperature curing of large structural components, particularly in industrial markets. HexPly® M34 is a self-extinguishing system, pr.. |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | DSC |
Eastman Cadence™ GS3 Copolyester for film calendering Eastman Cadence™ copolyester, for calendered films, is a specialty plastic developed to meet the demand for an environmentally responsible material for the calendering industry. Available in diffe.. |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | DSC |
Eastman Drystar 0601 Copolyester, Injection Molded This product-line is designed to meet the needs of converters seeking value-added solutions to their drying requirements of copolyesters. Eastman’s copolyesters are highly valued for their excellen.. |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | |
Eastman Eastar GN007 PETG Copolyester ISO data as provided by the manufacturer, Eastman Chemical |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | DSC |
Eastman GSP01 Copolyester for Film and Sheet Extrusion Applications:Consumer e-packaging trayElectronic packagingElectrostatic dissipative trayProduct Description: GSP01 is a clear, amorphous material. Because of its clarity, toughness and good melt s.. |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | ETM 300-90 |
ExxonMobil ESCOREZ™ 5637 Petroleum Hydrocarbon Resin Light colored aromatic modified, cycloaliphatic hydrocarbon resin. Designed to tackify a variety of adhesive polymers including EVA, SIS and SEBS block copolymers and metallocene polyolefines. Avail.. |
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Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
Epoxy Technology EPO-TEK® 360T High Temperature Epoxy Material Description: A two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications. It is a thixotropic.. |
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Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
Epoxy Technology EPO-TEK® EK1000-MP Epoxy Material Description: A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding .. |
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Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
Epoxy Technology EPO-TEK® H20E-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-MP is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al.. |
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Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
Epoxy Technology EPO-TEK® H20-LC Electrically Conductive, Silver Epoxy Product Description: EPO TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used exte.. |
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Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
Epoxy Technology EPO-TEK® H27D Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H27D is a two component, silver-filled epoxy adhesive designed for semiconductor and hybrid-microelectronic packaging applications.Advantages & Application Notes: Rheo.. |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | DAM; 10°C/min; ISO 11357-1/-2 |
DuPont Performance Polymers Zytel® 70G43HSLA BK099 Nylon 66
(Unverified Data**) 43% Glass Reinforced Heat Stabilized Polyamide 66 Zytel 70G43HSLA BK099 is a 43% glass fiber reinforced heat stabilized black polyamide 66 resin for injection molding.Information provided by DuPont .. |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | DAM; 10°C/min; ISO 11357-1/-2 |
DuPont Performance Polymers Zytel® FG70G50HSLA BK309 Nylon 66
(Unverified Data**) 50% Glass Reinforced Heat Stabilized Polyamide 66 with Developed for Food Contact Applications Information provided by DuPont Performance Polymers |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | DAM; 10°C/min; DS; ISO 11357-1/-2 |
DuPont Performance Polymers Zytel® FR50 NC010A Nylon 66
(Unverified Data**) 25% Glass Reinforced Flame Retardant Polyamide 66 Zytel FR50 NC010A is a 25% glass fiber reinforced flame retardant polyamide 66 resin for injection molding.Information provided by DuPont Performanc.. |
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Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also .. |
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Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—250°C /ISO 25 Min; Ramp -10—250°C @ 20°C/Min |
Epoxy Technology EPO-TEK® H20E-175 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-175 is a two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor / J.. |
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Glass Transition Temp, Tg | 80.0 °C | 176 °F | TM R050-25 |
Resinlab® EP691 Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP691 is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting and ad.. |