Polymer Property : Glass Transition Temp, Tg = 68.0 °C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Glass Transition Temp, Tg	68.0 °C	154 °F	Ultimate Tg; DSC
Tra-Con Tra-Bond 716K02 Thixotropic Adhesive 716K02 is a more thixotropic version of FDA2T. Information provided by Tra-Con Inc.
Glass Transition Temp, Tg	68.0 °C	154 °F	ETM 300-90
ExxonMobil ESCOREZ™ 5615 Petroleum Hydrocarbon Resin Very light colored aromatic modified, cycloaliphatic hydrocarbon resin. Designed to tackify a variety of adhesive polymers including EVA, SIS and SEBS block copolymers and metallocene polyolefins. A..
Glass Transition Temp, Tg	>= 68.0 °C	>= 154 °F
Epoxy Technology EPO-TEK® B9021-6 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..
Glass Transition Temp, Tg	68.0 °C	154 °F
Epoxyset Epoxibond EB-106 Unfilled Epoxy Adhesive A two-component, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc.
Glass Transition Temp, Tg	68.0 °C	154 °F
Epoxyset Epoxibond EB-130M-1 Unfilled Epoxy Adhesive A two-component, non-hazmat, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc.
Glass Transition Temp, Tg	68.0 °C	154 °F
Epoxyset Epoxibond EB-135 Unfilled Epoxy Adhesive A two-component, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries. EB-135 has excellent bond strength to various substrat..
Glass Transition Temp, Tg	68.0 °C	154 °F
Epoxyset Epoxiohm EO-21 Electrically Conductive Epoxy Adhesive EO-21 is a two part, silver filled high electrical conductivity epoxy adhesive. It is designed to cure at room temperature or rapidly at elevated temperature and exhibits very excellent adhesion and..
Glass Transition Temp, Tg	68.0 °C	154 °F
Epoxyset Epoxiohm EO-23M Electrically Conductive Epoxy Adhesive EO-23M is an electrically conductive, low viscosity silver-filled epoxy adhesive. Used for hybrid / micro-electronic adhesive including die-attach and substrate attach for Rf and Microwave devices.I..
Glass Transition Temp, Tg	68.0 °C	154 °F
Armstrong C-7/W Epoxy Adhesive, 3:2 Mix Ratio A clear, unfilled, medium viscosity adhesive recommended for use with any Armstrong Activator. Physical property data included covers C-7 used with Activators W and H-20. All other Activators may ..
Glass Transition Temp, Tg	68.0 °C	154 °F	TM R050-25
Resinlab® EP965SC-7 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965SC-7 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett..
Glass Transition Temp, Tg	68.0 °C	154 °F	TM R050-25
Resinlab® EP965SC-7 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965SC-7 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett..