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- Polymer Property : Glass Transition Temp, Tg = 65.0 °C
Polymer Property : Glass Transition Temp, Tg = 65.0 °C Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Glass Transition Temp, Tg | 65.0 °C | 149 °F | TM R050-25 |
| Resinlab® EP1215 Clear Unfilled Epoxy Structural Adhesive Resinlab™ EP1215 Clear is a two part unfilled epoxy structural adhesive designed for bonding applications requiring high strength and good impact resistance. It cures completely at room temperature.. |
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| Glass Transition Temp, Tg | 65.0 °C | 149 °F | |
| Resinlab® EP324E Clear Two Part Epoxy Casting Resin Resinlab™ EP 324E Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wettin.. |
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| Glass Transition Temp, Tg | 65.0 °C | 149 °F | 10°C/min; DAM; ISO 11357-1/-2 |
| DuPont Performance Polymers Zytel® 73G30HSL NC010 Nylon 6
(Unverified Data**) Zytel® 73G30HSL NC010 is a 30% glass fiber reinforced, heat stabilized polyamide 6 resin for injection molding.Information provided by DuPont Performance Polymers |
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| Glass Transition Temp, Tg | 65.0 °C | 149 °F | DSC |
| Solvay Specialty Polymers Kalix® 2930 HFFR Polyamide, High Performance (HPPA), Glass Fiber Kalix® 2930 HFFR is a bio-sourced polyamide-based material specifically formulated to meet UL 94V2 @ 0.4 mm requirements for electronic devices. The material uses an advanced halogen-free flame r.. |
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| Glass Transition Temp, Tg | 65.0 °C | 149 °F | |
| Unitika elitel UE3200 Polyester, Pellet Hard type standard Binder PaintUNITIKA l resins are thermoplastic saturated copolymeric polyester resins. l resins are expanding their applications from products such as adhesives, paints, ink bind.. |
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| Glass Transition Temp, Tg | 65.0 °C | 149 °F | |
| Unitika elitel UE3201 Polyester, Pellet High molecular weight type UE3200UNITIKA l resins are thermoplastic saturated copolymeric polyester resins. l resins are expanding their applications from products such as adhesives, paints, ink bi.. |
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| Glass Transition Temp, Tg | 65.0 °C | 149 °F | 10°C/min; ISO 11357-1,-2,-3 |
| Topas Advanced Polymers TOPAS® 9506F-500 Cyclic Olefin Copolymer (COC) TOPAS® 9506F-500 is a high clarity extrusion grade for use in shrink, food and medical packaging as either a discrete layer in multilayer film or in blends with polyethylene. It is designed to del.. |
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| Glass Transition Temp, Tg | 65.0 °C | 149 °F | Ultimate Tg |
| Tra-Con Tra-Cast 3135 Low Viscosity Encapsulant TRA-CAST 3135 is a low viscosity adhesive developed for demanding electronic underfill and encapsulant adhesive applications. This solvent free material is readily mixed, and cured at room temperatu.. |
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| Glass Transition Temp, Tg | 65.0 °C | 149 °F | |
| Unitika elitel UE9200 Polyester, Pellet Hard type standard, Improved in color from UE3200UNITIKA l resins are thermoplastic saturated copolymeric polyester resins. l resins are expanding their applications from products such as adhesives.. |
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| Glass Transition Temp, Tg | 65.0 °C | 149 °F | Ultimate Tg |
| Tra-Con Tra-Bond 2143D Medium Viscosity Polyamide Epoxy Adhesive TRA-BOND 2143D is a medium viscosity adhesive recommended for industrial bonding and sealing applications where toughness, impact resistance, and superior mechanical properties are required. This tw.. |
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| Glass Transition Temp, Tg | 65.0 °C | 149 °F | Ultimate Tg |
| Tra-Con Tra-Bond 216E01 Non-Sag Dam Applications Adhesive TRA-BOND 216E01 is a thixotropic, two-part adhesive formulated specifically for applications where a high-fill, non-sag adhesive is required. TRA-BOND 216E01 works in concert with TRA-BOND 216E02 to.. |
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| Glass Transition Temp, Tg | 65.0 °C | 149 °F | Ultimate Tg |
| Tra-Con Tra-Bond Ablebond 481-20 B-Stageable Epoxy Adhesive Ablebond 481-20 flexible epoxy adhesive is a modification of Ablebond 481-19 adhesive. This adhesive is designed to absorb stresses between adherends with mismatched coefficients of thermal expansio.. |
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| Glass Transition Temp, Tg | >= 65.0 °C | >= 149 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® 301 Spectrally Transparent Epoxy Product Description: EPO-TEK® 301 is a two component, room temperature curing epoxy featuring very low viscosity, and excellent optical-mechanical properties.Advantages & Application Notes: Semicon.. |
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| Glass Transition Temp, Tg | >= 65.0 °C | >= 149 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® 301-1 Optical Grade Epoxy Material Description: A two component, room temperature curing, optical grade epoxy, designed for optics, medical, and opto-electronic packaging of semiconductor devices, components, and electronics.. |
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| Glass Transition Temp, Tg | >= 65.0 °C | >= 149 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® EM127 Electrically Conductive Epoxy Product Description: EPO-TEK® EM127 is a single component, heat curable, electrically conductive epoxy adhesive for semiconductor IC and LED die attach applications.Advantages & Application Notes: .. |
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| Glass Transition Temp, Tg | >= 65.0 °C | >= 149 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® OE101 Two Component Epoxy Material Description: A two component epoxy designed for low stress applications in fiber optic packaging, opto-electronics and semiconductors. It is a lower modulus version of EPO-TEK® 353ND.Inf.. |
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| Glass Transition Temp, Tg | 65.0 °C | 149 °F | |
| Epoxyset Epoxibond EB-107LP-1 Unfilled Epoxy Adhesive A two-component, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc. |
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| Glass Transition Temp, Tg | 65.0 °C | 149 °F | |
| Epoxyset Epoxibond EB-107LP-2 Unfilled Epoxy Adhesive A two-component, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc. |
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| Glass Transition Temp, Tg | 65.0 °C | 149 °F | |
| Epoxyset Epoxiohm EO-21M-5 Electrically Conductive Epoxy Adhesive EO-21M-5 is an electrically conductive & thermally conductive, silver filled epoxy adhesive. This two component system is designed to be cured at room temperature or the cure can be accelerated by e.. |
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| Glass Transition Temp, Tg | 65.0 °C | 149 °F | DAM; 10°C/min; ISO 11357-1/-2 |
| DuPont Performance Polymers Zytel® 77G33L BK031 Nylon 612
(Unverified Data**) 33% Glass Reinforced Polyamide 612 Zytel 77G33L BK031 is a 33% glass fiber reinforced black polyamide 612 resin for injection molding.Information provided by DuPont Performance Polymers |
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| Glass Transition Temp, Tg | 65.0 °C | 149 °F | DAM; 10°C/min; ISO 11357-1/-2 |
| DuPont Performance Polymers Zytel® FG77G33L NC010 Nylon 612 33% Glass Reinforced Polyamide 612 with Developed for Food Contact ApplicationsInformation provided by DuPont Performance Polymers |
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| Glass Transition Temp, Tg | 65.0 °C | 149 °F | DAM; 10°C/min; ISO 11357-1/-2 |
| DuPont Performance Polymers Zytel® 151 NC010 Nylon 612
(Unverified Data**) Unreinforced Polyamide 612Information provided by DuPont Performance Polymers |
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| Glass Transition Temp, Tg | 65.0 °C | 149 °F | |
| Armstrong C-4/W Epoxy Adhesive A low viscosity, clear amber, unfilled adhesive, recommended for use with activators D or W. C-4 with Activator W offers maximum versatility in that differing degrees of flexibility can be achieved .. |
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| Glass Transition Temp, Tg | 65.0 °C | 149 °F | DAM; 10°C/min; ISO 11357-1/-2 |
| DuPont Performance Polymers Zytel® FG151L NC010 Nylon 612
(Unverified Data**) Unreinforced Polyamide 612 with Developed for Food Contact ApplicationsInformation provided by DuPont Performance Polymers |
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