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Polymer Property : Glass Transition Temp, Tg = 572 °F Product List

Thermal Properties

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Thermal Properties Metric English Comments
Glass Transition Temp, Tg 300 °C
572 °F
DMA (Tan d Peak); IPC-TM-650.2.4.24.3
Park Electrochemical Nelco® N8000Q Cyanate Ester Epoxy Laminate and Prepreg
The Nelco N8000 is a high-Tg cyanate ester laminate and prepreg system that provides superior performance and product integrity and is ideal for board designs with higher layer counts, finer lines a..
Glass Transition Temp, Tg 300 °C
572 °F
DMA (Tan d Peak); IPC-TM-650.2.4.24.3
Park Electrochemical Nelco® N8000 Cyanate Ester Epoxy Laminate and Prepreg
The Nelco N8000 is a high-Tg cyanate ester laminate and prepreg system that provides superior performance and product integrity and is ideal for board designs with higher layer counts, finer lines a..
Glass Transition Temp, Tg >= 300 °C
>= 572 °F
Hybrid Plastics POSS® EP 2000 Epoxy Adhesive
EP2000 is a POSS® based, ultra-high temperature epoxy adhesive. The POSS® content in EP2000 offers unique properties such as high thermal stability, outstanding oxygen and chemical resistance...
Glass Transition Temp, Tg 300 °C
572 °F
Dry
Hexcel® HexPly® M65 Bismaleimide Resin
HexPly® M65 is a bismaleimide resin that cures via an addition reaction in a toughened two-phase thermoset matrix with no condensation by-products. HexPly® M65 is a controlled flow polyimide resin..
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